Support day-to-day process monitoring and control for various processes like: Czochralski crystal pulling, diamond wire saw slicing, texturing, wafer cleaning, thin film deposition, screen printing, and laser operations. Execute designed experiments (DOE) to achieve oxygen/carbon, and crystal defect targets, cell efficiency, Voc, Isc, FF, passivation targets, TTV, warp, bow, and breakage rate targets.