Experience supporting complex PCBAs featuring large BGAs, high-density assemblies, and advanced packaging technologies, with the ability to troubleshoot manufacturing defects such as voiding, head-in-pillow, bridging, warpage, insufficient solder, and BGA-related failures. Experience supporting AI servers, accelerator cards, GPU-based platforms, rack-scale computing, or data center infrastructure products, combined with strong analytical, problem-solving, and cross-functional collaboration skills in a fast-paced manufacturing environment.