NewPackaging Engineer The Fountain Group LLCPackaging EngineerFoster City, CA$88.89–$96.30 / hourWe are seeking an experienced Cold Chain Packaging Engineer to develop, test, qualify, and support temperature-controlled (cold chain) packaging systems for the safe distribution of pharmaceutical and biologic products worldwide. What We're Looking For: Bachelor's degree in Packaging Engineering, Mechanical Engineering, Industrial Engineering, Biomedical Engineering, Chemical Engineering, or a related scientific field.
Packaging Engineer Manpower EngineeringPackaging EngineerFremont, CATemporaryManpowerGroup® (NYSE: MAN), the leading global workforce solutions company, helps organizations transform in a fast-changing world of work by sourcing, assessing, developing, and managing the talent that enables them to win. We are recognized consistently for our diversity - as a best place to work for Women, Inclusion, Equality and Disability and in 2023 ManpowerGroup was named one of the World's Most Ethical Companies for the 14th year - all confirming our position as the brand of choice for in-demand talent.
Internship, Packaging Engineer, Supply Chain (Fall 2026) Tesla IncInternship, Packaging Engineer, Supply Chain (Fall 2026)Fremont, CA$16.35–$33.65 / hourConsider before submitting an application: This position is expected to start August 2026 or September 2026 and continue through the Fall term (ending approximately December 2026 or later, if available). Demonstrated ability to facilitate dynamic cross-functional projects with engineering, supply chain, manufacturing and test to meet project timelines.
Packaging Engineer Rodan & Fields LLCPackaging EngineerSan Ramon, CA$84,000–$105,000 / yearRodan + Fields Dermatologists is a direct selling skincare company founded in 2000 by Dr. Katie Rodan and Dr. Kathy Fields, world-renowned dermatologists, and creators of Proactiv Solution with a passion for giving people the best skin of their lives - and the confidence that comes with it. With effective products, a unique business model and a powerful community of Independent Consultants, Rodan + Fields has disrupted the skincare category to become a leading skincare brand in North America.
NewInnovative Packaging Engineer - Cold Beverage R&D Keurig Dr PepperInnovative Packaging Engineer - Cold Beverage R&DSan Francisco, CACandidates should have a Bachelor's degree in Packaging Engineering and at least 4 years of experience with PET containers and testing packaging materials. A leading beverage company in San Francisco seeks a Packaging Engineer to develop and implement various packaging solutions.
NewCold Chain Packaging Engineer Net2SourceCold Chain Packaging EngineerFoster City, CA$88.89–$96.30 / hourThis position resides within the Packaging Development team with a primary focus on the development, qualification, and lifecycle management of controlled temperature (cold chain) packaging systems (thermal protection systems) to ensure product quality and regulatory compliance across global distribution of our pharmaceuticals and biologics products. Specific Education and Experience B.S. degree in industrial engineering, mechanical engineering, biomedical engineering, chemical engineering, package engineering , or a related scientific field.
NewCold Chain Packaging Engineer Integrated Resources, IncCold Chain Packaging EngineerFoster City, CA$88.89–$96.29 / hourThis position resides within the Packaging Development team at Client, with a primary focus on the development, qualification, and lifecycle management of controlled temperature (cold chain) packaging systems (thermal protection systems) to ensure product quality and regulatory compliance across global distribution of our pharmaceuticals and biologics products. Specific Education and Experience B.S. degree in industrial engineering, mechanical engineering, biomedical engineering, chemical engineering, package engineering, or a related scientific field.
NewSenior Silicon Photonics Packaging Engineer Apple, Inc.Senior Silicon Photonics Packaging EngineerSan Francisco, CAApple Inc. is seeking a Silicon Photonics & Optical Packaging Engineer in San Francisco to develop next-generation optical interconnects. This role involves designing silicon photonic devices, collaborating with various teams, and developing packaging technologies.
Principal Packaging Engineer Skyworks Solutions IncPrincipal Packaging EngineerSan Jose, CAAt Skyworks you will find a fast-paced environment with a strong focus on global collaboration minimal layers of management and the freedom to make meaningful contributions in a setting that encourages creative thinking. Experience in package design and proficient in Cadence Allegro platform tools, PCB Editor, Advanced Package Designer, APDSiP, or Mentor Xpedition platform tools.
VAVE Packaging Engineer Bio-Rad Laboratories IncVAVE Packaging EngineerHercules, CA$107,900–$148,400 / yearActual compensation will be provided in writing at the time of offer, if applicable, and is based on several factors we believe fairly and accurately impact compensation, including geographic location, experience, knowledge, skills, abilities, and other job permitted factors. Bio-Rads robust offerings serve to enrich the overall health, wealth, and wellbeing of our employees and their families through the various stages of an employee's work and life cycle.
NewPackaging Engineer - I TekWissen LLCPackaging Engineer - IFoster City, CA$84–$90Work Type: Onsite Job Description: This position resides within the Packaging Development team at Client, with a primary focus on the development, qualification, and lifecycle management of controlled temperature (cold chain) packaging systems (thermal protection systems) to ensure product quality and regulatory compliance across global distribution of our pharmaceuticals and biologics products. Specific Education and Experience: B.S. degree in industrial engineering, mechanical engineering, biomedical engineering, chemical engineering, package engineering, or a related scientific field.
NewLead IC Packaging Engineer - FCBGA & NPI Apple, Inc.Lead IC Packaging Engineer - FCBGA & NPISan Francisco, CAA leading technology firm in California is seeking an experienced IC Packaging Assembly Engineer to optimize flip-chip BGA assembly processes. Candidates must have over 10 years of experience in semiconductor packaging, a strong engineering background, and excellent problem-solving skills.
Staff Semi Packaging Engineer Analog Devices IncStaff Semi Packaging EngineerSan Jose, CA$130,168–$188,490 / yearADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls.
Packaging Engineer Analog Devices IncPackaging EngineerSan Jose, CA$86,480–$118,910 / yearADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls.
NewPackaging Engineer - I* MindlancePackaging Engineer - I*Foster city, CA$92–$96.29 / hourB.S. degree in industrial engineering, mechanical engineering, biomedical engineering, chemical engineering, package engineering, or a related scientific field. · Author packaging protocols, reports, and technical documentation to support shipping qualification and regulatory filings.
Associate Optical Packaging Engineer PsiQuantum CorpAssociate Optical Packaging EngineerMilpitas, CA$85,000–$120,000 / yearOur application, software, and industry teams work directly with leading Fortune 500 companies-including Lockheed Martin, Mercedes-Benz, Boehringer Ingelheim, and Mitsubishi Chemical-to prepare quantum solutions for real-world impact. Actual compensation may vary outside of these ranges and is dependent on various factors including but not limited to a candidate''s qualifications including relevant education and training, competencies, experience, geographic location, and business needs.
Sr. Industrial Designer (Packaging) SanDisk CorpSr. Industrial Designer (Packaging)Milpitas, CAAn employee's pay position within the salary range may be based on several factors including but not limited to (1) relevant education; qualifications; certifications; and experience; (2) skills, ability, knowledge of the job; (3) performance, contribution and results; (4) geographic location; (5) shift; (6) internal and external equity; and (7) business and organizational needs. Sandisk is looking for a Senior Packaging Industrial Designer to join global industrial design team to design 3D structural packaging solutions for world‑class consumer storage products.
NewSenior Packaging Specialist (TAG) Nestle S.A.Senior Packaging Specialist (TAG)Fremont, CAREQUIREMENTS AND MINIMUM EDUCATION LEVELA BS or MS degree in Food Science, Food Engineering, Chemical Engineering Packaging Science, Packaging Engineering, Mechanical Engineering, or related field. JOB SUMMARYThe Senior Packaging Specialist is a key role within Nestle's Technical Applications Group (TAG) that serves as the technical lead on highly complex and strategic projects.
Senior Packaging Design Engineer, Silicon Google LLCSenior Packaging Design Engineer, SiliconMountain View, CA$163,000–$237,000 / yearCollaborate closely with Signal Integrity (SI), Power Integrity (PI), Test, New Product Introduction (NPI), and Mechanical Engineering teams to refine and optimize product package architecture and design. Skip navigation links home Home work_outline Jobs noogler_hat Students google How we work handyman How we hire person_outline Your career help_outline Help.
Coordinator, Packaging e.l.f. BeautyCoordinator, PackagingOakland, CaliforniaOur total compensation philosophy offers every full-time new hire competitive pay and benefits, bonus eligibility (200% of target over the last seven fiscal years), equity, flexible time off, year-round half-day Fridays, and a hybrid 3 day in office, 2 day at home work environment. You’ll own critical workflows from component assessments and supplier communications to PO execution and data integrity, ensuring every launch moves from idea to shelf with precision and speed.
Principal Packaging Engineer Delos DataPrincipal Packaging EngineerPalo Alto, CaliforniaSelect and design optimal multi‑die package types (MCM, 2.5D, 3D, fan‑out, CoWoS, InFO, CPC, CPO) balancing electrical performance, thermal behavior, cost, and manufacturability. We aim to create an environment where people are treated fairly, supported in their growth, and are empowered to do meaningful work alongside others who take the craft seriously.
NewSenior Packaging Engineer: Innovation & Sustainability Lead Nestle S.A.Senior Packaging Engineer: Innovation & Sustainability LeadFremont, CAThis role involves managing the lifecycle of packaging development and collaborating with cross-functional teams to ensure sustainable and effective solutions. Responsibilities include driving innovation strategies, managing timelines, and providing sustainability guidance.
Packaging Engineer I Exelixis IncPackaging Engineer IAlameda, CA$75,000–$106,500 / yearESSENTIAL DUTIES/RESPONSIBILITIES: Provide on-site/remote technical support for project activities such as commercial packaging, implementation/qualification of new packaging line equipment and introduction of components changes. EDUCATION/EXPERIENCE/KNOWLEDGE & SKILLS: Education: Bachelor's degree in related discipline and a minimum of 1 year of related experience; or, Equivalent combination of education and experience.
NewPackaging Assembly Engineer Apple, Inc.Packaging Assembly EngineerSan Francisco, CA$181,100–$318,400 / yearIn this highly visible role, you will own development, optimization and sustaining the advanced flip-chip BGA (FCBGA) assembly process from pathfinding, NPI through high-volume manufacturing by defining assembly baseline processes, deciding package BOM, establishing package design rules that are optimized for performance, reliability, yield and cost for a variety of projects including SoC.DescriptionResponsible to lead packaging assembly technology development. ResponsibilitiesDefine and optimize end‑to‑end FCBGA assembly process flow (wafer back‑end interface, flip‑chip attach, underfill, lid/heat spreader attach, ball attach, singulation, final inspection).Develop and maintain process documentation including process specs, work instructions, control plans, PFMEA, and process flow diagrams.
NewChiplet SI/PI Engineer: Packaging & Interconnects Eliyan CorporationChiplet SI/PI Engineer: Packaging & InterconnectsSan Francisco, CAEliyan Corporation in San Francisco is seeking a Signal and Power Integrity Engineer to develop packaging solutions for chiplet interconnects. This role involves working with a cross-functional team and leading simulation efforts for advanced packaging technologies.
Sr. Packaging Engineer NEXTracker IncSr. Packaging EngineerFremont, CA$160,000–$175,000 / yearThis role goes beyond traditional packaging design, focusing on end-to-end packaging systems, including returnable packaging, reverse logistics, cost modeling, and network-wide performance. Our talented worldwide teams are redefining how solar power plants are designed, built, and operated every day with smart technology, data-driven insights, and advanced automation.
NewIC Packaging Simulation Engineer FEM & GenAI Modeling Apple, Inc.IC Packaging Simulation Engineer FEM & GenAI ModelingSan Francisco, CAThe role involves stress and deformation simulation of IC packages, programming CAD/FEM software, and supporting new product introductions. Candidates should have a bachelor's degree and proficiency in FEM tools like ANSYS and ABAQUS, along with programming skills in MATLAB or Python.
NewSignal & Power Integrity Engineer for Chiplet Packaging EliyanSignal & Power Integrity Engineer for Chiplet PackagingSan Francisco, CAIdeal candidates have extensive experience in signal and power integrity, using advanced simulation tools, and are eager to contribute to high-performance manufacturable products.#J-18808-Ljbffr. This role involves developing innovative packaging solutions for chiplet interconnects while working with a talented cross-functional team.
NewIC Packaging Simulation Engineer Apple, Inc.IC Packaging Simulation EngineerSan Francisco, CAResponsibilitiesNumerical modeling of the stress and deformation of component packages to provide a comprehensive understanding of chip‑package interaction and package‑board interaction to ensure good device yield and reliability. DescriptionWork on stress and deformation simulation of IC packages to provide a comprehensive understanding of chip‑package interaction and package‑board interaction to ensure good device yield and reliability.
Memory Packaging Engineer MediaTek IncMemory Packaging EngineerSan Jose, CACollaborate closely with IP, ASIC design, package design, Signal Integrity (SI), Power Integrity (PI), Thermal and modeling technologies, Product Engineering, and Test Engineering teams to enable innovative solutions. Roles and Responsibilities: Supports MediaTek's Memory packaging technology development including but not limited to HBM package, cHBM, LPDDR package for mobile applications, In Package Memory (IPM) for Edge AI, etc.
Technologist, Packaging Engineering SanDisk CorpTechnologist, Packaging EngineeringMilpitas, CAProvide technical leadership in evaluating and validating design options through characterization builds and comprehensive DFX (Design for excellence) analyses, including DFM (Design for Manufacturability), DFA (Design for Assembly), DFRW (Design for Rework), influencing product architecture and manufacturing strategy at the system level. ESSENTIAL DUTIES AND RESPONSIBILITIES: Serve as the senior Package Engineering representative on cross‑functional leadership teams, setting technical direction and ensuring packages are fully characterized, qualified, and released to production on schedule while meeting stringent mechanical, electrical, performance, reliability, and quality requirements.
NewSenior Packaging Designer & Engineer Hybrid SF (3-Month) HH GlobalSenior Packaging Designer & Engineer Hybrid SF (3-Month)San Francisco, CAThe ideal candidate has 6-8 years of experience in the creative packaging industry, proficiency in design software, and a strong understanding of packaging materials and processes. A leading health and tech brand in San Francisco is seeking a talented Packaging Designer for a full-time, hybrid role.
Laser Principal Packaging Engineer - Optical Solutions R&D MolexLaser Principal Packaging Engineer - Optical Solutions R&DFremont, CAFull timeOur advanced optical, mechanical, electrical, and software design capabilities support the evolving needs of high-density, high-bandwidth, and flexible optical networks across telecom, datacom, hyperscale datacenters, artificial intelligence, and supercomputing. The position requires close collaboration with R&D and product design teams, manufacturing, suppliers, and customers to ensure laser components meet stringent optical, mechanical, and Telcordia reliability requirements.
NewR&D Process Engineer - Diamond Packaging & Bonding Diamond FoundryR&D Process Engineer - Diamond Packaging & BondingSan Francisco, CADiamond Foundry in San Francisco is looking for an R&D Process Engineer to support customer prototyping and internal process development for AI applications. The ideal candidate should have a strong technical background, problem-solving skills, and experience in semiconductor packaging.
Senior Optical Packaging Process Engineer PsiQuantum CorpSenior Optical Packaging Process EngineerPalo Alto, CA$160,000–$180,000 / yearOur application, software, and industry teams work directly with leading Fortune 500 companies-including Lockheed Martin, Mercedes-Benz, Boehringer Ingelheim, and Mitsubishi Chemical-to prepare quantum solutions for real-world impact. Actual compensation may vary outside of these ranges and is dependent on various factors including but not limited to a candidate''s qualifications including relevant education and training, competencies, experience, geographic location, and business needs.
NewPackaging Engineering Manager Keurig Dr PepperPackaging Engineering ManagerSan Francisco, CAKey ResponsibilitiesLead end-to-end development of rigid packaging systems, including bottles and closures, from concept through commercializationApply deep expertise in injection molding, blow molding, tooling design, and resin selection to deliver robust, scalable solutionsApply expertise across a range of resin systems, including rPET and other recycled materials, as well as barrier technologies, to support performance, sustainability, and regulatory requirementsManage and develop one Associate Packaging Engineer, providing technical guidance, prioritization, and career developmentDrive innovation in packaging formats, materials, and manufacturing processes to improve performance, cost, and sustainabilityCollaborate cross‑functionally with R&D, Procurement, Supply Chain, and Operations to align on technical strategy and executionElevate and implement new packaging capabilities, technologies, and processesLead lab testing, plant trials, and qualification protocols to ensure packaging performance and manufacturabilityEnsure packaging solutions meet key requirements, including shelf life, carbonation retention, durability, and consumer experienceIdentify and mitigate technical risks related to packaging performance, material behavior, and manufacturing variabilityMaintain strong relationships with internal stakeholders, manufacturing partners, and external suppliers and tooling vendorsTravel RequirementsAbility to travel up to 80%; travel requirements will vary based on business needs and project demands, including support for plant trials, supplier engagement, and cross‑functional collaboration. Deep, hands‑on expertise in:Injection molding and blow molding processesTooling design and developmentResin selection and material scienceQualification and commercialization of rigid packaging formatsExpertise in polymer science, mold flow analysis, and packaging performance testing.
Senior Staff Software Engineer - Pricing and Packaging Gusto IncSenior Staff Software Engineer - Pricing and PackagingSan Francisco, CA$189,000–$236,000 / yearAbout the Team: The Pricing & Packaging team sits at the heart of Gusto's Commerce infrastructure, serving as the single source of truth for all products, bundles, add-ons, subscriptions, pricing, promotions, and discounts across Gusto's first-party customer experience. The team owns and operates Gusto's internal Commerce Platform including the product catalog, promotion engine, subscription, pricing experimentation platform, and entitlement services that enable Growth and other teams to bring Gusto's offerings to market effectively.
Staff Software Engineer, Pricing and Packaging Engineering Gusto IncStaff Software Engineer, Pricing and Packaging EngineeringSan Francisco, CA$163,000–$204,000 / yearAbout the Team: The Pricing & Packaging team sits at the heart of Gusto's Commerce infrastructure, serving as the single source of truth for all products, bundles, add-ons, subscriptions, pricing, promotions, and discounts across Gusto's first-party customer experience. The team owns and operates Gusto's internal Commerce Platform, including the product catalog, promotion engine, subscription, pricing experimentation platform, and entitlement services that enable Growth and other teams to bring Gusto's offerings to market effectively.
IC Packaging Manager Blue Origin Enterprises LPIC Packaging ManagerCA$230,773–$323,081.85 / yearand/or transports placardable amounts of hazardous materials by ground in any vehicle on a public road while in commerce, may be subject to additional Federal Motor Carrier Safety Regulations including: Driver Qualification Files, Medical Certification (obtained before onboarding), Road Test, Hours of Service, Drug and Alcohol Testing (CDL drivers only), vehicle inspection requirements, CDL requirements (if applicable) and hazardous materials transportation/shipping training. Required for Certain Job Profiles: Drivers who operate Commercial Motor Vehicles with a Gross Vehicle Weight (GVW), Gross Vehicle Weight Rating (GVWR) or combination of power unit and trailer that meets or exceeds 10,001 lbs.
Intern, Optical Packaging and Characterization Engineer PsiQuantum CorpIntern, Optical Packaging and Characterization EngineerMilpitas, CAOur application, software, and industry teams work directly with leading Fortune 500 companies-including Lockheed Martin, Mercedes-Benz, Boehringer Ingelheim, and Mitsubishi Chemical-to prepare quantum solutions for real-world impact. Support image processing workflows (e.g., contrast, alignment, feature extraction) using Python or similar tools and help turn results into clear tables or simple plots.
NewPackaging Substrate Engineer Apple, Inc.Packaging Substrate EngineerSan Francisco, CA$181,100–$318,400 / yearSan Francisco Bay Area, California, United States HardwareOur Hardware Technology Packaging team invents, designs, develops, and integrates electronic packaging solutions for Apple's internal and custom external components of hardware for its consumer electronic products such as iPhone, iPad, Mac, Apple Watch, Apple TV etc. You'll also receive benefits including: Comprehensive medical and dental coverage, retirement benefits, a range of discounted products and free services, and for formal education related to advancing your career at Apple, reimbursement for certain educational expenses — including tuition.
Advanced Packaging Reliability Engineer OpenAI LLCAdvanced Packaging Reliability EngineerSan Francisco, CAFor unincorporated Los Angeles County workers: we reasonably believe that criminal history may have a direct, adverse and negative relationship with the following job duties, potentially resulting in the withdrawal of a conditional offer of employment: protect computer hardware entrusted to you from theft, loss or damage; return all computer hardware in your possession (including the data contained therein) upon termination of employment or end of assignment; and maintain the confidentiality of proprietary, confidential, and non-public information. In-depth knowledge of advanced packaging architectures, including 2.5D and 3.5D integration, interposers, embedded bridges, chiplets, large package substrates, HBM integration, redistribution layers, and package-level power delivery.
NewPackaging Design Engineer SolidWorks Prototyping Dormont Manufacturing CompanyPackaging Design Engineer SolidWorks PrototypingOakland, CAThis hands-on role allows students to assist in creating packaging designs based on customer specifications and learn about materials and manufacturing processes. Students will gain proficiency in SolidWorks, manage projects from concept through execution, and work closely with the design team.
NewCustom Packaging Design Engineer Co-Op (Spring 2027) Dormont Manufacturing CompanyCustom Packaging Design Engineer Co-Op (Spring 2027)Oakland, CAAbout The Opportunity The ORBIShield Custom Packaging Design Engineer Co‑Op at ORBIS Corporation will support the Custom Design/Engineering Team by assisting with the creation of packaging designs and prototypes based on customer specifications. By the end of the co‑op, students will be proficient in SolidWorks, capable of creating and interpreting final prints, and equipped to manage a project from concept through execution.
NewPackaging Design Engineer Co-op: SolidWorks Prototyping Dormont Manufacturing CompanyPackaging Design Engineer Co-op: SolidWorks PrototypingOakland, CAThe ideal candidate is a Junior or Senior in a relevant engineering discipline and will gain valuable hands-on experience in design and material processes, working primarily with SolidWorks.#J-18808-Ljbffr. Dormont Manufacturing Co is seeking a Custom Packaging Design Engineer Co-Op to assist the Custom Design/Engineering Team.
NewCustom Packaging Design Engineer Co-Op (Summer/Fall 2026) Dormont Manufacturing CompanyCustom Packaging Design Engineer Co-Op (Summer/Fall 2026)Oakland, CAAbout The OpportunityThe ORBIShield Custom Packaging Design Engineer Co‑Op at ORBIS Corporation will support the Custom Design/Engineering Team by assisting with the creation of packaging designs and prototypes based on customer specifications. By the end of the co‑op, students will be proficient in SolidWorks, capable of creating and interpreting final prints, and equipped to manage a project from concept through execution.
NewGraphic Designer IV (Senior Packaging Production Designer) SkillGraphic Designer IV (Senior Packaging Production Designer)San Francisco, CA$84.94–$94.38 / hourThis is a highly detail-driven production design role focused on packaging artwork for device cartons, in-box documentation, labels, regulatory inserts, and related printed materials. The ideal candidate has deep experience with Adobe Creative Suite, packaging production, dielines, print specifications, SKU/version control, and manufacturing-ready file preparation.
Packaging Integration Engineer CspeedPackaging Integration EngineerPalo Alto, CaliforniaOur executive team has a demonstrated track record of building and scaling category-defining semiconductor and infrastructure businesses at companies like Broadcom, Lumentum, Tesla, Apple, Samsung, Intel, and VMware. Ability to select and manage external foundries/OSATs for interposer-based packaging (must understand material selection, state of the art techniques, and advanced process flows required for advanced packaging).
Intern, Optical Packaging Process PsiQuantum CorpIntern, Optical Packaging ProcessMilpitas, CAOur application, software, and industry teams work directly with leading Fortune 500 companies-including Lockheed Martin, Mercedes-Benz, Boehringer Ingelheim, and Mitsubishi Chemical-to prepare quantum solutions for real-world impact. By leveraging the advanced semiconductor manufacturing industry-including partners like GlobalFoundries-we use the same high-volume processes that already produce billions of chips for telecom and consumer electronics.
Integrated Circuit Packaging Architect Advanced Micro Devices IncIntegrated Circuit Packaging ArchitectSan Jose, CASuccessful candidate would collaborate with product design teams and technology development partners to understand future product needs and define a packaging roadmap that includes architecture, process definition, Design for Manufacturing (DFM) and Design for Yield (DFY) guidelines. The Role: Advanced packaging technology leader driving packaging architecture across client, server, gaming and GPU products.