Packaging Engineer iMPact Business GroupPackaging EngineerTempe, AZAnalyzing engineering drawings and specifications to determine the required types of packaging materials and to maximize convenience, utility, and function based on the product's physical characteristics, safety, and special-handling requirements. Our client, a Global Leader in the Medical Device Industry, has an immediate opening for a R&D Packaging Engineer(Medical Products) for a 6-month + Contract.
Packaging Engineer JBL ResourcesPackaging EngineerTempe, AZJBL Resources is proud to have earned the reputation of being a premier provider of top talent professionals in the fields of engineering, human resources, logistics, operations, and supply chain management. Working here means joining a team of top technical professionals bringing cutting-edge products to the forefrontoffering driven individuals the opportunity to make a meaningful impact every day.
NewRF/Microelectronics Packaging Engineer Viasat, Inc.RF/Microelectronics Packaging EngineerTempe, Arizona$132,500–$209,500 / yearFull timeThe packaging development process includes package definition, stack-up, substrate layout, bond diagram, drawings, predictive modeling combined with system testing, technical risk/cost assessment, materials and process characterization, compilation of formal documentation, collaborating with sub-contractors and internal assembly and reliability resources, and final release of product. For specific work locations within San Jose, the San Francisco Bay area and New York City metropolitan area, the base pay range for this role is $164,500.00- $246,500.00/ annually: At Viasat, we consider many factors when it comes to compensation, including the scope of the position as well as your background and experience.
Packaging Engineer Mount IndiePackaging EngineerTempe, ArizonaThis role is responsible for planning, designing, and delivering innovative packaging solutions across a range of technologies, including integrated circuits (ICs), system-in-package (SiP), sub-assemblies, and modules. You will own the full packaging lifecycle—from concept and definition through design, modeling, testing, and production release—while partnering closely with cross-functional engineering teams and external vendors.
NewPackaging Module Development Engineer Intel CorpPackaging Module Development EngineerChandler, AZ$133,800–$188,890 / yearMaster's degree with 3 or more years, or PhD degree with 0 years of experience in Mechanical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry, or a related technical field. Harnessing the capability of the cloud, the ubiquity of the Internet of Things, the latest advances in memory and programmable solutions, and the promise of always-on 5G connectivity, Intel is disrupting industries and solving global challenges.
Advanced IC Packaging Engineer Powerlattice TechnologiesAdvanced IC Packaging EngineerChandler, ArizonaWe’re looking for a hands-on technical leader to pioneer industry-first packaging solutions that integrate power delivery chiplets directly into advanced substrates. Drive assembly process development, including novel flows for chiplet integration, substrate embedding, advanced interconnects and structure for reliability tests.
NewSenior IC Packaging Design Engineer - Xpedition Expert Stellent IT LLCSenior IC Packaging Design Engineer - Xpedition ExpertChandler, AZThe ideal candidate should have 10+ years of senior-level experience, or 4–6 years with a Master's degree in IC packaging and design. Stellent IT LLC is seeking an experienced IC Packaging Design Engineer for a role based in Chandler, AZ, or Hillsboro, OR.
Silicon Packaging Design Engineer Intel CorpSilicon Packaging Design EngineerChandler, AZ$105,650–$200,340 / yearBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
NewIC Packaging Design Engineer Stellent IT LLCIC Packaging Design EngineerChandler, AZExperienceStrong hands‑on experience in Siemens (Mentor) Xpedition (XPD); alternatively: Cadence Allegro/Advanced Package Designer (APD / SiP)Candidates should have experience in the below domains:Physical Design & LayoutSubstrate design and layoutDesign for performance, manufacturability, yield, and reliability#J-18808-Ljbffr. Bachelor's or Master's degree in Electrical / Electronics Engineering is required.
NewSenior Backend Packaging Engineer, Microdisplay SnapchatSenior Backend Packaging Engineer, MicrodisplayChandler, AZThe ideal candidate will have extensive experience with automated packaging equipment and strong problem-solving capabilities. The role involves process ownership for backend packaging, with responsibilities ranging from development to high-volume manufacturing.
NewPackaging Process Engineer - Microdisplay SwiftCruitPackaging Process Engineer - MicrodisplayChandler, AZ$142,000–$214,000 / yearThe Company's three core products are Snapchat, a visual messaging app that enhances your relationships with friends, family, and the world; Lens Studio, an augmented reality platform that powers AR across Snapchat and other services; and its AR glasses, Spectacles. Direct experience designing and optimizing automated production equipment for semiconductors or displaysDirect experience in final test for semiconductor or display packages.
Packaging Process Engineer – Microdisplay SnapPackaging Process Engineer – MicrodisplayChandler, ArizonaThe Company operates Snapchat , a visual messaging app that enhances your relationships with friends, family, and the world, and Specs Inc. , a wholly-owned subsidiary dedicated to making computing more human, in addition to Bitmoji , Saturn, and other digital services. Additionally you will: Own and optimize a backend packaging process for LCOS advanced displays, from early development through high-volume manufacturing, ensuring stable, high-yield output.
Packaging Process Engineer - Microdisplay Snap IncPackaging Process Engineer - MicrodisplayChandler, AZ$142,000–$214,000 / yearThe Company's three core products are Snapchat, a visual messaging app that enhances your relationships with friends, family, and the world; Lens Studio, an augmented reality platform that powers AR across Snapchat and other services; and its AR glasses, Spectacles. Develop, qualify, and sustain assembly and packaging recipes, control plans, and SPC systems, driving continuous improvement in CD/overlay, defectivity, yields, and reliability.
Senior Packaging Engineer-Phoenix AZ-Hybrid Roth Staffing CompaniesSenior Packaging Engineer-Phoenix AZ-HybridGuadalupe, Arizona$0–$61.86 / hourAnalyzes engineering drawings and specifications to determine the required type of packaging materials and to maximize convenience, utility and function based on the product's physical characteristics, safety and special-handling requirements. Our collaborative culture, focus on continuous improvement, and passion for making a meaningful impact set us apart as an employer of choice within the industry.
NewNight-Shift Substrates Packaging Engineer Advanced Tech IntelNight-Shift Substrates Packaging Engineer Advanced TechChandler, AZThe ideal candidate will have a Bachelor's degree in relevant engineering fields and at least one year of experience. This position requires supporting the manufacturing environment by addressing process and equipment issues during night shifts.
Sr. Package Layout Engineer, Annapurna Labs - AI Silicon Packaging Amazon.com IncSr. Package Layout Engineer, Annapurna Labs - AI Silicon PackagingTempe, AZPerform detailed RDL and substrate routing for high-density interconnects including microbumps, C4 bumps, TSVs, microvias, and PTH vias across multi-layer organic substrates and silicon interposers. You"ll drive the physical implementation of complex multi-die and advanced packaging architectures, working closely with silicon, SI/PI, thermal, and manufacturing teams to deliver production-ready designs that meet dynamic performance, density, and reliability targets.
NewAdvanced Packaging Reliability Lab Engineer Intel CorpAdvanced Packaging Reliability Lab EngineerChandler, AZ$133,800–$188,890 / yearResponsibilities will include but not be limited to: - Characterization of equipment performance and response to excursions/issues - Continuous improvement of methods, specifications, and training - Development, analysis, and implementation of statistical process control - Translation of reliability stress analysis requirements into fixturing and development of new tools, systems, and other innovative solutions - Coordination of tool vendors and field service engineers - Collaboration with internal operations, planning, and facilities teams. Additional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly.
NewAdvanced Packaging Technology Development Substrates Module Engineer On-Shift (Nightshift) IntelAdvanced Packaging Technology Development Substrates Module Engineer On-Shift (Nightshift)Chandler, AZThis night‑shift, onsite position in Chandler, Arizona is responsible for supporting lot movement through the manufacturing line, responding to process excursions, recovering from equipment errors, dispositioning lots, enabling new tools, and performing other operational activities required to support factory objectives. Qualifications Minimum Qualifications:Bachelor's degree in Materials Engineering, Mechanical Engineering, Chemical Engineering, Chemistry, Physics, or a related discipline, with 1+ years of relevant experience OR Master's degree in one of the above disciplines with 0 years of relevant experience.
NewMechanical Design Engineer - Semiconductor Packaging IntelMechanical Design Engineer - Semiconductor PackagingChandler, AZ$105,650–$149,150 / yearBachelor's degree in mechanical engineering or a STEM‑related field of study.1+ year's experience with CAD tools such as SolidWorks, Siemens NX, AutoCAD or similar 2D and 3D CAD software. Job Summary We are seeking a proactive and detail‑oriented Mechanical Design Engineer to serve as a key point of contact for all collateral design activities supporting semiconductor packaging architecture.
Semiconductor Packaging Modeling and Simulation Engineer onsemiSemiconductor Packaging Modeling and Simulation EngineerScottsdale, AZWith a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. As a semiconductor packaging modeling and simulation engineer, you will have the opportunities to support new power module development and new product design, assembly and process, quality and reliability, and customers in worldwide.
NewSemiconductor Packaging Mechanical Design Engineer IntelSemiconductor Packaging Mechanical Design EngineerChandler, AZThis role will involve designing and developing mechanical components for semiconductor packaging, collaborating across teams, and addressing design challenges. The ideal candidate will have a Bachelor's degree in mechanical engineering, experience with CAD tools, and strong communication skills.
NewSenior Packaging Solutions Account Engineer IntelSenior Packaging Solutions Account EngineerChandler, AZThis position requires managing customer relationships, providing technical consultation, and collaborating with cross-functional teams to drive product developments. Intel Corporation is seeking an experienced professional for a role focusing on semiconductor packaging in Chandler, Arizona.
Advanced Packaging SI/PI Senior Staff Engineer Marvell Technology IncAdvanced Packaging SI/PI Senior Staff EngineerChandler, AZIn addition, the candidate will possess a bachelors degree in electrical engineering or related fields and 5+ years of related professional experience in package or PCB design, or masters degree and/or PhD in Electrical Engineering with coursework in signal integrity and power delivery with 3+ years of experience. To support fair and authentic hiring practices, candidates are not permitted to use AI tools (such as transcription apps, real-time answer generators like ChatGPT or Copilot, or automated note-taking bots) during interviews.
Advanced Packaging SI/PI Staff Engineer Marvell Technology IncAdvanced Packaging SI/PI Staff EngineerChandler, AZIn addition, the candidate will possess a bachelors degree in electrical engineering or related fields and 3+ years of related professional experience in package or PCB design, or masters degree and/or PhD in Electrical Engineering with coursework in signal integrity and power delivery with 2+ years of experience. To support fair and authentic hiring practices, candidates are not permitted to use AI tools (such as transcription apps, real-time answer generators like ChatGPT or Copilot, or automated note-taking bots) during interviews.
NewPackaging Modeling & Simulation Engineer (Digital Twin) OnsemiPackaging Modeling & Simulation Engineer (Digital Twin)Scottsdale, AZ$146,970–$249,780 / yearThis role involves conducting thermal-mechanical simulations for microelectronic packaging and improving modeling methodologies. A competitive salary ranging from $146,970 to $249,780 is offered along with a comprehensive benefits package.#J-18808-Ljbffr.
NewMicrodisplay Packaging Process Engineer - High-Yield Focus SwiftCruitMicrodisplay Packaging Process Engineer - High-Yield FocusChandler, AZThe ideal candidate has over 7 years of experience in process engineering, particularly with automated production equipment and is comfortable in an ISO 5 cleanroom environment. You'll drive process development from prototyping through production, ensuring high-yield, stable output.
ADCE Packaging Design Architect IntelADCE Packaging Design ArchitectChandler, ArizonaJob Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Arizona, Phoenix Additional Locations: US, California, Folsom, US, California, Santa Clara, US, Colorado, Fort Collins, US, Massachusetts, Beaver Brook, US, New Mexico, Albuquerque, US, Oregon, Hillsboro, US, Texas, Austin, US, Washington, Multiple Cities Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Experience in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP, Concept HDL, Sigrity), and/or Mentor Xpedition platform tools (PCB Layout/XPD, Designer, Hyperlynx).
NewSatellite Mechanical Engineer: Thermal Analysis & Packaging ViasatSatellite Mechanical Engineer: Thermal Analysis & PackagingTempe, AZ$114,000–$180,000 / yearA minimum of 8 years in Mechanical Design Engineering, proficiency in SolidWorks, and a Bachelor's degree in mechanical engineering are essential. A leading satellite communication company is seeking a dynamic Mechanical Engineer with satellite thermal analysis experience in Tempe, Arizona.
NewProcess Engineer II, Microelectronics Packaging Dormont Manufacturing CompanyProcess Engineer II, Microelectronics PackagingTempe, AZ$84,000–$126,000 / yearThis position involves developing and transferring microelectronic packaging assembly processes, such as Printed Circuit Board Assembly, into manufacturing. Candidates must have a Bachelor's degree and a minimum of 2 years of relevant experience or a Master's degree with no experience.
Silicon Packaging Engineering Manager Intel CorpSilicon Packaging Engineering ManagerChandler, AZ$190,610–$269,100 / yearBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Minimum Qualifications: Bachelor's degree in Electrical Engineering or STEM related field with 9+ years of relevant experience OR- Master's degree in Electrical Engineering or STEM related field with 6+ years of relevant experience OR- PhD in Electrical Engineering or STEM related field with 4+ years of relevant experience.
Senior Engineer, Packaging Engineering Apidel TechnologiesSenior Engineer, Packaging EngineeringTempe, AZContractorAnalyzes engineering drawings and specifications to determine the required type of packaging materials and to maximize convenience, utility and function based on the product's physical characteristics, safety and special-handling requirements. This is an individual contributor role that requires the use of judgement in applying professional expertise and is expected to work independently with minimal supervision.
NewReliability Staff Engineer, Power Packaging & Devices OnsemiReliability Staff Engineer, Power Packaging & DevicesScottsdale, AZThe ideal candidate should possess a PhD in relevant fields and deep knowledge of electro-thermo-mechanical failure mechanisms. The position involves cross-functional collaboration and clear communication of complex data to various stakeholders.#J-18808-Ljbffr.
Advanced Packaging Supplier Technology Development Program Manager Intel CorpAdvanced Packaging Supplier Technology Development Program ManagerPhoenix, AZ$133,800–$255,200 / yearBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. This is a hands-on position that requires extensive work with supplier teams (through F2F meetings with local reps, phone/Teams meetings, and international travel to supplier factories), internal integration teams, and process module engineering teams to achieve new capacity qualification and ramp production on-time.
Packaging Specialist Verano Holdings CorpPackaging SpecialistAZWhile performing the duties of this job, the employee is frequently required to remain in a stationary position, move and/or position oneself, communicate, operate and/or prepare, place, position objects, tools, or controls. As a Packaging Specialist, you are responsible accurately weighing, packing, and labeling cannabis flower, infused edibles, and cannabis extracts for shipment to retail dispensaries.
Customer Program Manager, International Packaging Veritiv CorpCustomer Program Manager, International PackagingChandler, AZJob Responsibilities: SOW development, project planning, scheduling, progress tracking/monitoring, resource assignment, risk management, scope management, driving the teams, carrying out the projects against committed goals, managing project members and dependencies and presenting to internal teams and where needed, external partners. Work closely with adjacent functional groups such as Sales, Engineering, Supply Chain, Manufacturing, and Marketing to coordinate interdepartmental activities ensuring the completion of the project on schedule and within the customer parameters.
Packaging Operator Brewers CollectivePackaging OperatorTempe, ArizonaFrom our longstanding efforts to support American farmers, military, veterans, and first responders, to emergency drinking water donations and responsible drinking programs, we are guided by our commitment to the communities we call home and the 65,000 hardworking Americans who bring our beer to life. We are home to the nation’s most iconic beer and beyond beer brands, including Michelob ULTRA – America’s #1 top-selling beer – as well as Busch Light, Budweiser, Bud Light, Stella Artois, Cutwater Spirits, and industry-leading craft brands.
Packaging Operator Anheuser-Busch InBev SA/NVPackaging OperatorTempe, AZFrom our longstanding efforts to support American farmers, military, veterans, and first responders, to emergency drinking water donations and responsible drinking programs, we are guided by our commitment to the communities we call home and the 65,000 hardworking Americans who bring our beer to life. COMPANY: We are home to the nation's most iconic beer and beyond beer brands, including Michelob ULTRA - America's #1 top-selling beer - as well as Busch Light, Budweiser, Bud Light, Stella Artois, Cutwater Spirits, and industry-leading craft brands.
Sr Director, Power Packaging & Module Development onsemiSr Director, Power Packaging & Module DevelopmentScottsdale, AZWith a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. Products include power and signal management, logic, discrete, and custom devices for automotive, communications, computing, consumer, industrial, LED lighting, medical, military/aerospace and power applications.
ATD Laser Development Engineer Intel CorpATD Laser Development EngineerChandler, AZ$85,200–$162,500 / yearAdditional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
ATD Experienced Laser Development Engineer IntelATD Experienced Laser Development EngineerChandler, ArizonaJob Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Arizona, Phoenix Additional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Test Module Development Engineer Intel CorpTest Module Development EngineerChandler, AZPrimary Focus: • Advanced semiconductor packaging technologies beyond conventional approaches • 3D packaging innovations and chiplet integration • High-performance computing packaging for data centers and AI applications • Heterogeneous integration across diverse chip technologies • Scaling packaging density while enhancing thermal and electrical performance. Test Module Development Engineer responsibilities include but are not limited to: • Executes test technology development and enablement for high-mix, low-volume testing and future technologies, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications.