Packaging Engineer iMPact Business GroupPackaging EngineerTempe, AZAnalyzing engineering drawings and specifications to determine the required types of packaging materials and to maximize convenience, utility, and function based on the product's physical characteristics, safety, and special-handling requirements. Our client, a Global Leader in the Medical Device Industry, has an immediate opening for a R&D Packaging Engineer(Medical Products) for a 6-month + Contract.
Packaging Engineer JBL ResourcesPackaging EngineerTempe, AZJBL Resources is proud to have earned the reputation of being a premier provider of top talent professionals in the fields of engineering, human resources, logistics, operations, and supply chain management. Working here means joining a team of top technical professionals bringing cutting-edge products to the forefrontoffering driven individuals the opportunity to make a meaningful impact every day.
NewSilicon Packaging Engineering Manager IntelSilicon Packaging Engineering ManagerPhoenix, AZJob Overview Intel Foundry is seeking a highly experienced IC Packaging Design Manager to lead the delivery of advanced packaging solutions within the Advanced Design and Customer Engineering (ADCE) organization. In this role, you will act as a trusted technical partner to customers, enabling successful adoption of Intel's advanced packaging technologies (EMIB, Foveros, chiplet architectures).Responsibilities
Packaging Engineer Mount IndiePackaging EngineerTempe, ArizonaThis role is responsible for planning, designing, and delivering innovative packaging solutions across a range of technologies, including integrated circuits (ICs), system-in-package (SiP), sub-assemblies, and modules. You will own the full packaging lifecycle—from concept and definition through design, modeling, testing, and production release—while partnering closely with cross-functional engineering teams and external vendors.
NewPackaging Module Development Engineer Intel CorpPackaging Module Development EngineerChandler, AZ$133,800–$188,890 / yearMaster's degree with 3 or more years, or PhD degree with 0 years of experience in Mechanical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry, or a related technical field. Harnessing the capability of the cloud, the ubiquity of the Internet of Things, the latest advances in memory and programmable solutions, and the promise of always-on 5G connectivity, Intel is disrupting industries and solving global challenges.
NewSenior Backend Packaging Engineer, Microdisplay SnapchatSenior Backend Packaging Engineer, MicrodisplayChandler, AZThe ideal candidate will have extensive experience with automated packaging equipment and strong problem-solving capabilities. The role involves process ownership for backend packaging, with responsibilities ranging from development to high-volume manufacturing.
NewPackaging Process Engineer - Microdisplay SwiftCruitPackaging Process Engineer - MicrodisplayChandler, AZ$142,000–$214,000 / yearThe Company's three core products are Snapchat, a visual messaging app that enhances your relationships with friends, family, and the world; Lens Studio, an augmented reality platform that powers AR across Snapchat and other services; and its AR glasses, Spectacles. Direct experience designing and optimizing automated production equipment for semiconductors or displaysDirect experience in final test for semiconductor or display packages.
Silicon Packaging Design Engineer Intel CorpSilicon Packaging Design EngineerPhoenix, AZ$105,650–$200,340 / yearBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
NewIC Packaging Design Engineer Stellent IT LLCIC Packaging Design EngineerChandler, AZExperienceStrong hands‑on experience in Siemens (Mentor) Xpedition (XPD); alternatively: Cadence Allegro/Advanced Package Designer (APD / SiP)Candidates should have experience in the below domains:Physical Design & LayoutSubstrate design and layoutDesign for performance, manufacturability, yield, and reliability#J-18808-Ljbffr. Bachelor's or Master's degree in Electrical / Electronics Engineering is required.
NewSenior IC Packaging Design Engineer - Xpedition Expert Stellent IT LLCSenior IC Packaging Design Engineer - Xpedition ExpertChandler, AZThe ideal candidate should have 10+ years of senior-level experience, or 4–6 years with a Master's degree in IC packaging and design. Stellent IT LLC is seeking an experienced IC Packaging Design Engineer for a role based in Chandler, AZ, or Hillsboro, OR.
Advanced IC Packaging Engineer Powerlattice TechnologiesAdvanced IC Packaging EngineerChandler, ArizonaWe’re looking for a hands-on technical leader to pioneer industry-first packaging solutions that integrate power delivery chiplets directly into advanced substrates. Drive assembly process development, including novel flows for chiplet integration, substrate embedding, advanced interconnects and structure for reliability tests.
Packaging Process Engineer - Microdisplay Snap IncPackaging Process Engineer - MicrodisplayChandler, AZ$142,000–$214,000 / yearThe Company's three core products are Snapchat, a visual messaging app that enhances your relationships with friends, family, and the world; Lens Studio, an augmented reality platform that powers AR across Snapchat and other services; and its AR glasses, Spectacles. Develop, qualify, and sustain assembly and packaging recipes, control plans, and SPC systems, driving continuous improvement in CD/overlay, defectivity, yields, and reliability.
Packaging Process Engineer – Microdisplay SnapPackaging Process Engineer – MicrodisplayChandler, ArizonaThe Company operates Snapchat , a visual messaging app that enhances your relationships with friends, family, and the world, and Specs Inc. , a wholly-owned subsidiary dedicated to making computing more human, in addition to Bitmoji , Saturn, and other digital services. Additionally you will: Own and optimize a backend packaging process for LCOS advanced displays, from early development through high-volume manufacturing, ensuring stable, high-yield output.
Senior Packaging Engineer-Phoenix AZ-Hybrid Roth Staffing CompaniesSenior Packaging Engineer-Phoenix AZ-HybridGuadalupe, Arizona$0–$61.86 / hourAnalyzes engineering drawings and specifications to determine the required type of packaging materials and to maximize convenience, utility and function based on the product's physical characteristics, safety and special-handling requirements. Our collaborative culture, focus on continuous improvement, and passion for making a meaningful impact set us apart as an employer of choice within the industry.
NewMechanical Design Engineer - Semiconductor Packaging IntelMechanical Design Engineer - Semiconductor PackagingPhoenix, AZ$105,650–$149,150 / yearJob Type:Experienced Hire## Shift:Shift 1 (United States of America)## Primary Location:US, Arizona, Phoenix## Additional Locations:## Business group:Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. With a legacy of relentless innovation and a commitment to bring smart, connected devices to every person on Earth, our diverse and brilliant teams are continually searching for tomorrow's technology and revel in the challenge that changing the world for the better brings.
NewNight Shift Substrates Packaging Engineer, Advanced Tech IntelNight Shift Substrates Packaging Engineer, Advanced TechPhoenix, AZThis role provides real-time support in semiconductor manufacturing and requires a Bachelor's degree in a relevant field with at least one year of experience. This night shift position involves ensuring continuous production by addressing equipment and process issues.
NewNight-Shift Substrates Packaging Engineer Advanced Tech IntelNight-Shift Substrates Packaging Engineer Advanced TechChandler, AZThe ideal candidate will have a Bachelor's degree in relevant engineering fields and at least one year of experience. This position requires supporting the manufacturing environment by addressing process and equipment issues during night shifts.
Sr. Package Layout Engineer, Annapurna Labs - AI Silicon Packaging Amazon.com IncSr. Package Layout Engineer, Annapurna Labs - AI Silicon PackagingTempe, AZPerform detailed RDL and substrate routing for high-density interconnects including microbumps, C4 bumps, TSVs, microvias, and PTH vias across multi-layer organic substrates and silicon interposers. You"ll drive the physical implementation of complex multi-die and advanced packaging architectures, working closely with silicon, SI/PI, thermal, and manufacturing teams to deliver production-ready designs that meet dynamic performance, density, and reliability targets.
Semiconductor Packaging Modeling and Simulation Engineer onsemiSemiconductor Packaging Modeling and Simulation EngineerScottsdale, AZWith a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. As a semiconductor packaging modeling and simulation engineer, you will have the opportunities to support new power module development and new product design, assembly and process, quality and reliability, and customers in worldwide.
NewSemiconductor Packaging Mechanical Design Engineer IntelSemiconductor Packaging Mechanical Design EngineerChandler, AZThis role will involve designing and developing mechanical components for semiconductor packaging, collaborating across teams, and addressing design challenges. The ideal candidate will have a Bachelor's degree in mechanical engineering, experience with CAD tools, and strong communication skills.
NewAdvanced Packaging Technology Development Substrates Module Engineer On-Shift (Nightshift) IntelAdvanced Packaging Technology Development Substrates Module Engineer On-Shift (Nightshift)Phoenix, AZ$99,030–$139,810 / yearJob TypeExperienced HireShiftShift 4 (United States of America)Primary LocationUS, Arizona, PhoenixBusiness GroupIntel Foundry strives to make every facet of semiconductor manufacturing state‑of‑the‑art while delighting our customers — from delivering cutting‑edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. This role is responsible for supporting lot movement through the manufacturing line, responding to process excursions, recovering from equipment errors, dispositioning lots, enabling new tools, and performing other operational activities required to support factory objectives.
NewMechanical Packaging Design Engineer - Semiconductor IntelMechanical Packaging Design Engineer - SemiconductorPhoenix, AZThis role focuses on designing and developing mechanical components and tooling, collaborating with cross-functional teams, and ensuring design manufacturability. Candidates should have a Bachelor's degree in mechanical engineering, familiarity with CAD tools like SolidWorks, and strong communication skills.
NewMechanical Tooling Engineer Advanced Packaging Tools IntelMechanical Tooling Engineer Advanced Packaging ToolsPhoenix, AZThe ideal candidate will hold a master's degree in a relevant field with at least 4 years of experience, particularly in tooling and mechanical engineering. Intel Corporation is seeking a Mechanical Tooling Engineer in Phoenix, Arizona to drive technology development for advanced semiconductor packaging.
NewPackaging Equipment Engineer: Innovate & Optimize IntelPackaging Equipment Engineer: Innovate & OptimizePhoenix, AZIntel Corporation is seeking a Packaging Module Equipment Development Engineer in Phoenix, Arizona. This role involves developing and optimizing assembly processes and technologies.
NewSenior Mechanical Tooling Engineer - Advanced Packaging IntelSenior Mechanical Tooling Engineer - Advanced PackagingPhoenix, AZIntel is seeking a highly motivated Mechanical Tooling Engineer in Phoenix, Arizona, to define, design, and deploy tooling solutions for advanced semiconductor packaging. Qualified candidates will possess a master's degree in Mechanical Engineering or related fields, with 4+ years of experience, or a Ph.
NewPackaging Design Engineer: Substrate Layout & Interconnects IntelPackaging Design Engineer: Substrate Layout & InterconnectsPhoenix, AZThis role involves end-to-end development of substrate designs, collaboration with silicon and hardware teams, and ensuring optimal cost efficiency and manufacturability. Ideal candidates will have a relevant Bachelor's or Master's degree and 1+ years of experience in microelectronic package design or PCB layout.
NewSenior Silicon Packaging Design Engineer IntelSenior Silicon Packaging Design EngineerPhoenix, AZ$105,650–$200,340 / yearThis position offers competitive pay, stock bonuses, and a comprehensive benefits package, with a salary ranging from $105,650 to $200,340 annually.#J-18808-Ljbffr. This role involves designing and implementing silicon interposers and collaborating with various teams to optimize system designs.
NewSenior Packaging Solutions Engineer - Key Account Lead IntelSenior Packaging Solutions Engineer - Key Account LeadPhoenix, AZThe successful candidate will manage customer relationships, provide technical solutions for semiconductor packaging, and collaborate across teams. A leading semiconductor company seeks a Packaging and Test Account Technical Solutions Engineer in Phoenix, AZ.
NewAdvanced Packaging Reliability Lab Engineer Intel CorpAdvanced Packaging Reliability Lab EngineerChandler, AZ$133,800–$188,890 / yearResponsibilities will include but not be limited to: - Characterization of equipment performance and response to excursions/issues - Continuous improvement of methods, specifications, and training - Development, analysis, and implementation of statistical process control - Translation of reliability stress analysis requirements into fixturing and development of new tools, systems, and other innovative solutions - Coordination of tool vendors and field service engineers - Collaboration with internal operations, planning, and facilities teams. Additional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly.
NewSilicon Packaging Design Engineer Dormont Manufacturing CompanySilicon Packaging Design EngineerPhoenix, AZ$105,650–$200,340 / yearAs a key contributor to Intel's cutting-\u2018edge technology, you will play a pivotal role in bridging silicon and hardware design, optimizing package performance, and delivering high-impact solutions that meet performance, cost, and manufacturability goals. Job DescriptionIntel seeks a motivated and innovative Silicon Packaging Design Engineer to join our team, driving the end-to-end development of silicon interposer and bridge designs that define the future of computing and connectivity.
NewSenior Packaging Solutions Account Engineer IntelSenior Packaging Solutions Account EngineerChandler, AZThis position requires managing customer relationships, providing technical consultation, and collaborating with cross-functional teams to drive product developments. Intel Corporation is seeking an experienced professional for a role focusing on semiconductor packaging in Chandler, Arizona.
NewSemiconductor Packaging Yield Engineer IntelSemiconductor Packaging Yield EngineerChandler, AZThis role focuses on substrate packaging solutions, requiring a Bachelor's or Master's degree in relevant engineering fields with at least 1 year of experience. Intel Corporation is seeking an experienced hire for its Advanced Packaging Team in Arizona.
NewPackaging Module Development Engineer Dormont Manufacturing CompanyPackaging Module Development EngineerPhoenix, AZ$115,110–$219,550 / yearMinimum QualificationsPhD degree in Mechanical Engineering, Materials Science, Electrical Engineering, Physics / Applied Physics, or a related field; ORMaster's degree in mechanical engineering, Materials Science, Electrical Engineering, Physics / Applied Physics, or a related field. Job Description:The Packaging Module Development Engineer will contribute to advancing technology and foundry capabilities by:Developing First Level/Second Level Interconnect (FLI/SLI) and Thermal solutions to support Intel's future packaging platforms.
NewPackaging Module Equipment Development Engineer Dormont Manufacturing CompanyPackaging Module Equipment Development EngineerPhoenix, AZ$115,110–$219,550 / yearEstablishes material specifications for contract assemblers and raw material vendors and interfaces with supplier quality and procurement teams to ensure material quality and vendor performance requirements are met through strict adherence to process specifications and existing product qualification methods. Minimum Qualifications:Possess a Bachelor's degree plus 7yrs of experience, ORMaster's degree plus 3yrs of experience, ORPhD degree plus 6+ months of experience in Engineering, Physics, Chemistry or related field.
Principal Engineer, Electrical Engineering - Advanced Packaging ASM International NVPrincipal Engineer, Electrical Engineering - Advanced PackagingPhoenix, AZThe Principal Electrical Engineer is a technical leader responsible for defining, designing, and governing the electrical architecture of advanced semiconductor packaging equipment (etch, deposition, etc.). With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving.
NewMicrodisplay Packaging Process Engineer - High-Yield Focus SwiftCruitMicrodisplay Packaging Process Engineer - High-Yield FocusChandler, AZThe ideal candidate has over 7 years of experience in process engineering, particularly with automated production equipment and is comfortable in an ISO 5 cleanroom environment. You'll drive process development from prototyping through production, ensuring high-yield, stable output.
Advanced Packaging SI/PI Senior Staff Engineer Marvell Technology IncAdvanced Packaging SI/PI Senior Staff EngineerChandler, AZIn addition, the candidate will possess a bachelors degree in electrical engineering or related fields and 5+ years of related professional experience in package or PCB design, or masters degree and/or PhD in Electrical Engineering with coursework in signal integrity and power delivery with 3+ years of experience. To support fair and authentic hiring practices, candidates are not permitted to use AI tools (such as transcription apps, real-time answer generators like ChatGPT or Copilot, or automated note-taking bots) during interviews.
Advanced Packaging SI/PI Staff Engineer Marvell Technology IncAdvanced Packaging SI/PI Staff EngineerChandler, AZIn addition, the candidate will possess a bachelors degree in electrical engineering or related fields and 3+ years of related professional experience in package or PCB design, or masters degree and/or PhD in Electrical Engineering with coursework in signal integrity and power delivery with 2+ years of experience. To support fair and authentic hiring practices, candidates are not permitted to use AI tools (such as transcription apps, real-time answer generators like ChatGPT or Copilot, or automated note-taking bots) during interviews.
NewPackaging Modeling & Simulation Engineer (Digital Twin) OnsemiPackaging Modeling & Simulation Engineer (Digital Twin)Scottsdale, AZ$146,970–$249,780 / yearThis role involves conducting thermal-mechanical simulations for microelectronic packaging and improving modeling methodologies. A competitive salary ranging from $146,970 to $249,780 is offered along with a comprehensive benefits package.#J-18808-Ljbffr.
ADCE Packaging Design Architect Intel CorpADCE Packaging Design ArchitectChandler, AZ$220,920–$311,890 / yearBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Experience in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP, Concept HDL, Sigrity), and/or Mentor Xpedition platform tools (PCB Layout/XPD, Designer, Hyperlynx).
NewSenior Packaging Architect Substrate & IC Integration Dormont Manufacturing CompanySenior Packaging Architect Substrate & IC IntegrationPhoenix, AZ$220,920–$311,890 / yearDormont Manufacturing Co in Phoenix, Arizona is searching for a seasoned engineer specializing in substrate design and semiconductor packaging. Annual salary ranges from $220,920 to $311,890, reflecting your skills and location.#J-18808-Ljbffr.
NewLead Packaging Module Engineer: Equipment & Process Dormont Manufacturing CompanyLead Packaging Module Engineer: Equipment & ProcessPhoenix, AZ$115,110–$219,550 / yearThe role involves developing interconnect and thermal solutions, managing projects, and providing support for equipment performance in a high-volume manufacturing environment. The ideal candidate will have a PhD or Master's degree in a related field and at least 1 year of experience in mechanical design or manufacturing systems.
NewMechanical Design Engineer - Semiconductor Packaging Dormont Manufacturing CompanyMechanical Design Engineer - Semiconductor PackagingPhoenix, AZ$105,650–$149,150 / yearWith a legacy of relentless innovation and a commitment to bring smart, connected devices to every person on Earth, our diverse and brilliant teams are continually searching for tomorrow's technology and revel in the challenge that changing the world for the better brings. The ideal candidate is a strong communicator with excellent time and project management skills, capable of working cross-functionally and solving complex design problems with minimal supervision.
NewMechanical Design Engineer - Semiconductor Packaging (Phoenix) Dormont Manufacturing CompanyMechanical Design Engineer - Semiconductor Packaging (Phoenix)Phoenix, AZYou will collaborate closely with cross-functional teams, ensuring manufacturability and design intent throughout the packaging lifecycle. Intel Corporation is looking for an experienced Mechanical Design Engineer to join their team in Phoenix, Arizona.
NewSilicon Packaging Design Engineer: Interposer & Bridges Dormont Manufacturing CompanySilicon Packaging Design Engineer: Interposer & BridgesPhoenix, AZAs a key contributor, your role involves collaborating closely with various teams to enhance system-level design, utilizing leading EDA tools, and ensuring compliance with design specifications. Dormont Manufacturing Co is looking for a motivated Silicon Packaging Design Engineer in Phoenix, Arizona.
NewLead Packaging Solutions Engineer - Key Accounts Dormont Manufacturing CompanyLead Packaging Solutions Engineer - Key AccountsPhoenix, AZDormont Manufacturing Co is looking for a Packaging and Test Account Technical Solutions Engineer in Phoenix, Arizona. Responsibilities include ensuring customer satisfaction and managing relationships while utilizing advanced technology solutions.
(Senior) Member of Technical Staff / Director, Process Engineering, Advanced Packaging ASM International NV(Senior) Member of Technical Staff / Director, Process Engineering, Advanced PackagingPhoenix, AZYoull lead a team of experts working on advanced thermal films compatible with rapidly evolving demands of advanced packaging and heterogenous integration, leveraging ALD/PEALD, CVD/PECVD, and related technologies to turn forward looking roadmaps into manufacturable solutions. Collaborate closely with customers, Account Technology Directors, Product Management, and Business Development to align on high thermal conductivity materials roadmaps with customer device and packaging strategies.
Senior Engineer, Packaging Engineering Apidel TechnologiesSenior Engineer, Packaging EngineeringTempe, AZContractorAnalyzes engineering drawings and specifications to determine the required type of packaging materials and to maximize convenience, utility and function based on the product's physical characteristics, safety and special-handling requirements. This is an individual contributor role that requires the use of judgement in applying professional expertise and is expected to work independently with minimal supervision.
NewPower Integrity Intern: IC Packaging & Analysis IntelPower Integrity Intern: IC Packaging & AnalysisPhoenix, AZThe ideal candidate will be pursuing a Master's or PhD in Electrical Engineering and should have experience with circuit simulation tools. Intel Corporation in Phoenix, Arizona is seeking a Power Integrity / Delivery Electrical Analysis Engineer Intern.
NewNight-Shift Substrates Module Engineer (Advanced Packaging) IntelNight-Shift Substrates Module Engineer (Advanced Packaging)Phoenix, AZThe ideal candidate will have a Bachelor's or Master's in relevant engineering fields and experience in semiconductor manufacturing is preferred. This role involves providing real-time factory support and ensuring optimal manufacturing operations during the night shift.