Drive complex cross-functional technical programs involving Marketing, Business Lines, Package Design, Product Engineering, Silicon Design, Simulation, Test, Quality, Reliability, Manufacturing, internal assembly sites, OSATs, material suppliers, and external technology partners. Deep expertise in one or more advanced packaging areas such as fan-out packaging, panel-level packaging, 2.5D/3D integration, chiplets, heterogeneous integration, embedded die/passives, SiP/modules, high-density substrates/RDL, hybrid bonding, or high power packaging is preferred.