Packaging Engineer iMPact Business GroupPackaging EngineerTempe, AZAnalyzing engineering drawings and specifications to determine the required types of packaging materials and to maximize convenience, utility, and function based on the product's physical characteristics, safety, and special-handling requirements. Our client, a Global Leader in the Medical Device Industry, has an immediate opening for a R&D Packaging Engineer(Medical Products) for a 6-month + Contract.
Packaging Engineer JBL ResourcesPackaging EngineerTempe, AZJBL Resources is proud to have earned the reputation of being a premier provider of top talent professionals in the fields of engineering, human resources, logistics, operations, and supply chain management. Working here means joining a team of top technical professionals bringing cutting-edge products to the forefrontoffering driven individuals the opportunity to make a meaningful impact every day.
Packaging Engineer Mount IndiePackaging EngineerTempe, ArizonaThis role is responsible for planning, designing, and delivering innovative packaging solutions across a range of technologies, including integrated circuits (ICs), system-in-package (SiP), sub-assemblies, and modules. You will own the full packaging lifecycle—from concept and definition through design, modeling, testing, and production release—while partnering closely with cross-functional engineering teams and external vendors.
Silicon Packaging Design Engineer Intel Corp.Silicon Packaging Design EngineerPhoenix, AZ$105,650–$200,340 / yearBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Packaging Module Development Engineer Intel CorpPackaging Module Development EngineerChandler, AZ$99,030–$188,890 / yearMinimum Qualifications: Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, Physics/Applied Physics, Chemical Engineering, or a related STEM field with 1+ years of relevant experience. Job Details: Job Description: The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms.
Packaging Module Equipment Development Engineer Intel CorpPackaging Module Equipment Development EngineerChandler, AZ$133,800–$188,890 / yearThe Packaging Module Development Engineer will contribute to advancing technology and foundry capabilities by: Developing First Level/Second Level Interconnect (FLI/SLI), Thermal solutions (TIM1), and SMT/PCB technologies to support Intel's future packaging platforms. Job Details: Job Description: Job Description: The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms.
Senior Director, Global Structural Design and Packaging Sustainability IgnitelySenior Director, Global Structural Design and Packaging SustainabilityGlendale, ArizonaWork closely with Brand, Marketing, Brand Design, Sales, Operations, Compliance, and Product Development teams to understand and subsequently translate through hands-on innovative designing the marketing and promotional strategy, messaging, and creative objectives into finished packages, and ensure optimal process flow from manufacture of components through filling and assembly. Define and execute a packaging road map, development and brand strategy integration that drives best in class packaging from concept through production release, including packaging development, technology development, design for manufacturing, cost and reliability.
Senior Packaging Engineer-Phoenix AZ-Hybrid Roth Staffing CompaniesSenior Packaging Engineer-Phoenix AZ-HybridGuadalupe, Arizona$0–$61.86 / hourAnalyzes engineering drawings and specifications to determine the required type of packaging materials and to maximize convenience, utility and function based on the product's physical characteristics, safety and special-handling requirements. Our collaborative culture, focus on continuous improvement, and passion for making a meaningful impact set us apart as an employer of choice within the industry.
Advanced Packaging Reliability Lab Engineer IntelAdvanced Packaging Reliability Lab EngineerChandler, ArizonaJob Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Arizona, Phoenix Additional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Responsibilities will include but not be limited to: - Characterization of equipment performance and response to excursions/issues - Continuous improvement of methods, specifications, and training - Development, analysis, and implementation of statistical process control - Translation of reliability stress analysis requirements into fixturing and development of new tools, systems, and other innovative solutions - Coordination of tool vendors and field service engineers - Collaboration with internal operations, planning, and facilities teams Qualifications:
Semiconductor Packaging Modeling and Simulation Engineer onsemiSemiconductor Packaging Modeling and Simulation EngineerScottsdale, AZWith a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. As a semiconductor packaging modeling and simulation engineer, you will have the opportunities to support new power module development and new product design, assembly and process, quality and reliability, and customers in worldwide.
Packaging Equipment Development Group Lead IntelPackaging Equipment Development Group LeadChandler, Arizona$180,770–$255,200 / yearThis group focuses on developing industry-leading packaging solutions to support Intel's product roadmap, fostering innovation, optimizing manufacturing equipment, and enabling high-volume production. In this role, you will oversee new equipment introductions, ensure seamless integration of equipment and processes, and lead your team in solving complex challenges to deliver world-class manufacturing solutions.
Substrate Packaging Defect Metro Tool Owner Intel Corp.Substrate Packaging Defect Metro Tool OwnerPhoenix, AZ$103,730–$198,820 / yearDirect next-generation tool installation, reaching major milestones-purchase-spec development, source inspection, design, pre-fac, Safety level approval, Supplier qual, Intel qual, etc.-by collaborating with diverse stakeholders. In this role, you will help drive innovation in EMIB-T, glass core, EMIB scaling, and panel-level packaging technologies for substrate as well as assembly test mfg (ATM) factories for Intel's IPG and IFS customers.
Senior Engineer, Packaging Engineering Apidel TechnologiesSenior Engineer, Packaging EngineeringTempe, AZContractorAnalyzes engineering drawings and specifications to determine the required type of packaging materials and to maximize convenience, utility and function based on the product's physical characteristics, safety and special-handling requirements. This is an individual contributor role that requires the use of judgement in applying professional expertise and is expected to work independently with minimal supervision.
Kitchen Packaging Technician Lead JARS CannabisKitchen Packaging Technician LeadPhoenix, AZFull timeRole Overview:The Kitchen Packaging Technician Lead oversees all evening packaging operations, ensuring products are packaged accurately, eciently, and in full compliance with Arizona Department of Health Services (ADHS) regulations and Title 9, Chapter 18 (Arizona Administrative Code for marijuana facilities). Inventory & Workflow Management: Manage packaging materials, monitor stock levels, and ensure smooth workflow through production stages.
Principal Engineer, Electrical Engineering – Advanced Packaging ASMPrincipal Engineer, Electrical Engineering – Advanced PackagingPhoenix, ArizonaThe Principal Electrical Engineer is a technical leader responsible for defining, designing, and governing the electrical architecture of advanced semiconductor packaging equipment (etch, deposition, etc.). With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving.
Packaging Associate Flow DistributionPackaging AssociatePhoenix, AZPackaging and manufacturing responsibilities including, but not limited to, counting, sorting, labeling, sealing, boxing, and taping products according to SOPs. Flow Distribution is seeking motivated and detail-oriented Packaging Associates to join our Manufacturing and Packaging team for an immediate start.
(Senior) Member of Technical Staff / Director, Process Engineering, Advanced Packaging ASM(Senior) Member of Technical Staff / Director, Process Engineering, Advanced PackagingPhoenix, ArizonaYou’ll lead a team of experts working on advanced thermal films compatible with rapidly evolving demands of advanced packaging and heterogenous integration, leveraging ALD/PEALD, CVD/PECVD, and related technologies to turn forward looking roadmaps into manufacturable solutions. · Collaborate closely with customers, Account Technology Directors, Product Management, and Business Development to align on high thermal conductivity materials roadmaps with customer device and packaging strategies.
Packaging Technician Grow SciencesPackaging TechnicianPhoenix, AZFull timeMaintains the highest level of cleanliness and sanitation inside the processing area and participates in the clean-up of equipment and the workplace at the end of every shift. This role is responsible for product and loss tracking, ensuring products are packaged and accounted for in accordance with company policy and state regulations.
Manufacturing Operations Manager Shift 6 – Advanced Packaging IntelManufacturing Operations Manager Shift 6 – Advanced PackagingChandler, ArizonaIntel's Advanced Packaging Technology Development: Substrate and Wafer Assembly (APTDSWA) organization is seeking a dynamic and experienced Manufacturing Operations Manager to lead a high-performing team of technicians in a state-of-the-art substrate packaging manufacturing environment. Job Type: Experienced Hire Shift: Shift 6 (United States of America) Primary Location: US, Arizona, Phoenix Additional Locations: Business group: Intel makes possible the most amazing experiences of the future.
Advanced Packaging Manufacturing Manager Intel Corp.Advanced Packaging Manufacturing ManagerPhoenix, AZ$164,100–$231,670 / yearAPTDSWA Manufacturing Managers perform senior individual contributor functions associated with substrate and advanced packaging execution, including factory readiness, production execution, equipment and process alignment, operational prioritization, issue resolution, and delivery of committed manufacturing milestones. Experience listed above should be a combination of the following: Experience driving manufacturing execution, factory readiness, equipment performance, process improvement, or technical deliverables in a manufacturing, factory operations, equipment, engineering, or related environment from development to high volume manufacturing.