Packaging Engineer iMPact Business GroupPackaging EngineerTempe, AZAnalyzing engineering drawings and specifications to determine the required types of packaging materials and to maximize convenience, utility, and function based on the product's physical characteristics, safety, and special-handling requirements. Our client, a Global Leader in the Medical Device Industry, has an immediate opening for a R&D Packaging Engineer(Medical Products) for a 6-month + Contract.
Senior Packaging Engineer (Microelectronics) Kforce Inc.Senior Packaging Engineer (Microelectronics)Tempe, AZ$180,000–$220,000In this role, you would lead all aspects of microelectronics packaging development, working closely with RFIC, MMIC, and module design teams to create advanced packaging solutions for devices ranging from ICs and System-in-Package (SiP) designs to complex modules and sub-assemblies. Summary: This position would place you as the key Microelectronics Packaging Engineer on a talented space electronics engineering team, responsible for developing next-generation packaging solutions for advanced RF communications products supporting cutting-edge space systems.
Packaging Engineer JBL ResourcesPackaging EngineerTempe, AZJBL Resources is proud to have earned the reputation of being a premier provider of top talent professionals in the fields of engineering, human resources, logistics, operations, and supply chain management. Working here means joining a team of top technical professionals bringing cutting-edge products to the forefrontoffering driven individuals the opportunity to make a meaningful impact every day.
NewSr. Thermal & Mechanical Packaging Engineer, Annapurna Labs AmazonSr. Thermal & Mechanical Packaging Engineer, Annapurna LabsPhoenix, AZThermal & Mechanical Packaging Engineer, Annapurna LabsAs a member of the Machine Learning Acceleration team you'll be responsible for the design and optimization of hardware in our data centers, leading new technology adoption for large‑scale server deployments to deliver a world‑class customer experience. Proficiency with FEA/CFD simulation tools: ANSYS, ABAQUS, COMSOL, FLOTHERM, ICEPACK.Preferred QualificationsExperience with advanced packaging metrologies, laboratory thermal/mechanical measurements, infrared thermography, acoustic chambers, and thermal test setups.
NewSenior Thermal & Mechanical Packaging Engineer - Data Center Systems AmazonSenior Thermal & Mechanical Packaging Engineer - Data Center SystemsPhoenix, AZFamiliarity with simulation tools is crucial for this role, which involves collaboration across multiple technology domains.#J-18808-Ljbffr. You will design and optimize hardware for our data centers, driving new technology adoption to enhance customer experience.
NewMSI/MSIX Packaging Engineer Jobs via DiceMSI/MSIX Packaging EngineerPhoenix, AZThe ideal candidate will have strong hands-on experience with InstallShield and must have skills in packaging, scripting, and troubleshooting. A collaborative approach in working with application developers and infrastructure teams is essential for the role.#J-18808-Ljbffr.
Packaging Engineer Mount IndiePackaging EngineerTempe, ArizonaThis role is responsible for planning, designing, and delivering innovative packaging solutions across a range of technologies, including integrated circuits (ICs), system-in-package (SiP), sub-assemblies, and modules. You will own the full packaging lifecycle—from concept and definition through design, modeling, testing, and production release—while partnering closely with cross-functional engineering teams and external vendors.
RF/Microelectronics Packaging Engineer ViaSat IncRF/Microelectronics Packaging EngineerTempe, AZ$185,500–$278,500 / yearThe packaging development process includes: • Package definition • Stack-up • Substrate layout • Bond diagram • Drawings • Predictive modeling combined with system testing • Technical risk/cost assessment • Materials and process characterization • Compilation of formal documentation • Collaborating with sub-contractors and internal assembly and reliability resources • Final release of product. For specific work locations within San Jose, the San Francisco Bay area, and New York City metropolitan area, the base pay range for this role is $185,500.00 - $278,500.00 / annually.
Advanced IC Packaging Engineer Powerlattice TechnologiesAdvanced IC Packaging EngineerChandler, ArizonaWe’re looking for a hands-on technical leader to pioneer industry-first packaging solutions that integrate power delivery chiplets directly into advanced substrates. Drive assembly process development, including novel flows for chiplet integration, substrate embedding, advanced interconnects and structure for reliability tests.
Silicon Packaging Design Engineer Intel CorpSilicon Packaging Design EngineerChandler, AZ$105,650–$200,340 / yearBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Packaging Process Engineer – Microdisplay SnapPackaging Process Engineer – MicrodisplayChandler, ArizonaThe Company operates Snapchat , a visual messaging app that enhances your relationships with friends, family, and the world, and Specs Inc. , a wholly-owned subsidiary dedicated to making computing more human, in addition to Bitmoji , Saturn, and other digital services. Additionally you will: Own and optimize a backend packaging process for LCOS advanced displays, from early development through high-volume manufacturing, ensuring stable, high-yield output.
Packaging Process Engineer - Microdisplay Snap IncPackaging Process Engineer - MicrodisplayChandler, AZ$142,000–$214,000 / yearThe Company's three core products are Snapchat, a visual messaging app that enhances your relationships with friends, family, and the world; Lens Studio, an augmented reality platform that powers AR across Snapchat and other services; and its AR glasses, Spectacles. Develop, qualify, and sustain assembly and packaging recipes, control plans, and SPC systems, driving continuous improvement in CD/overlay, defectivity, yields, and reliability.
Packaging Module Development Engineer Intel CorpPackaging Module Development EngineerChandler, AZ$133,800–$255,200 / yearAdditional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Packaging Module Equipment Development Engineer Intel CorpPackaging Module Equipment Development EngineerChandler, AZ$133,800–$188,890 / yearAdditional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Current and future Metrology Engineers are expected to develop strong technical capabilities in the following areas: Operating, programming, troubleshooting, and optimizing automated inspection equipment, including hands-on interaction with hardware components such as lighting systems, cameras, transducers, robotic systems, and conveyors.
Foundry Services Advanced Packaging Account Technical Solutions Engineer Intel CorpFoundry Services Advanced Packaging Account Technical Solutions EngineerChandler, AZ$220,320–$311,040 / yearBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. With a focus on scalability, AI advancement, and shaping the future, we provide an unparalleled blend of an industry-leading technology, a rich IP portfolio, a world-class design ecosystem, and an operationally resilient global manufacturing supply chain.
NewMechanical Design Engineer - Semiconductor Packaging IntelMechanical Design Engineer - Semiconductor PackagingPhoenix, AZ$105,650–$149,150 / yearJob Type:Experienced Hire## Shift:Shift 1 (United States of America)## Primary Location:US, Arizona, Phoenix## Additional Locations:## Business group:Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. With a legacy of relentless innovation and a commitment to bring smart, connected devices to every person on Earth, our diverse and brilliant teams are continually searching for tomorrow's technology and revel in the challenge that changing the world for the better brings.
NewSr. Package Layout Engineer, Annapurna Labs - AI Silicon Packaging Amazon.com IncSr. Package Layout Engineer, Annapurna Labs - AI Silicon PackagingTempe, AZPerform detailed RDL and substrate routing for high-density interconnects including microbumps, C4 bumps, TSVs, microvias, and PTH vias across multi-layer organic substrates and silicon interposers. You"ll drive the physical implementation of complex multi-die and advanced packaging architectures, working closely with silicon, SI/PI, thermal, and manufacturing teams to deliver production-ready designs that meet dynamic performance, density, and reliability targets.
Senior Packaging Engineer-Phoenix AZ-Hybrid Roth Staffing CompaniesSenior Packaging Engineer-Phoenix AZ-HybridGuadalupe, Arizona$0–$61.86 / hourAnalyzes engineering drawings and specifications to determine the required type of packaging materials and to maximize convenience, utility and function based on the product's physical characteristics, safety and special-handling requirements. Our collaborative culture, focus on continuous improvement, and passion for making a meaningful impact set us apart as an employer of choice within the industry.
NewPackaging Equipment Engineer: Innovate & Optimize IntelPackaging Equipment Engineer: Innovate & OptimizePhoenix, AZIntel Corporation is seeking a Packaging Module Equipment Development Engineer in Phoenix, Arizona. This role involves developing and optimizing assembly processes and technologies.
Semiconductor Packaging Modeling and Simulation Engineer onsemiSemiconductor Packaging Modeling and Simulation EngineerScottsdale, AZWith a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. As a semiconductor packaging modeling and simulation engineer, you will have the opportunities to support new power module development and new product design, assembly and process, quality and reliability, and customers in worldwide.
NewSenior Mechanical Tooling Engineer - Advanced Packaging IntelSenior Mechanical Tooling Engineer - Advanced PackagingPhoenix, AZIntel is seeking a highly motivated Mechanical Tooling Engineer in Phoenix, Arizona, to define, design, and deploy tooling solutions for advanced semiconductor packaging. Qualified candidates will possess a master's degree in Mechanical Engineering or related fields, with 4+ years of experience, or a Ph.
Principal Engineer, Electrical Engineering - Advanced Packaging ASM International NVPrincipal Engineer, Electrical Engineering - Advanced PackagingPhoenix, AZThe Principal Electrical Engineer is a technical leader responsible for defining, designing, and governing the electrical architecture of advanced semiconductor packaging equipment (etch, deposition, etc.). With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving.
Advanced Packaging SI/PI Senior Staff Engineer Marvell Technology IncAdvanced Packaging SI/PI Senior Staff EngineerChandler, AZIn addition, the candidate will possess a bachelors degree in electrical engineering or related fields and 5+ years of related professional experience in package or PCB design, or masters degree and/or PhD in Electrical Engineering with coursework in signal integrity and power delivery with 3+ years of experience. To support fair and authentic hiring practices, candidates are not permitted to use AI tools (such as transcription apps, real-time answer generators like ChatGPT or Copilot, or automated note-taking bots) during interviews.
Advanced Packaging SI/PI Staff Engineer Marvell Technology IncAdvanced Packaging SI/PI Staff EngineerChandler, AZIn addition, the candidate will possess a bachelors degree in electrical engineering or related fields and 3+ years of related professional experience in package or PCB design, or masters degree and/or PhD in Electrical Engineering with coursework in signal integrity and power delivery with 2+ years of experience. To support fair and authentic hiring practices, candidates are not permitted to use AI tools (such as transcription apps, real-time answer generators like ChatGPT or Copilot, or automated note-taking bots) during interviews.
NewPackaging Modeling & Simulation Engineer (Digital Twin) OnsemiPackaging Modeling & Simulation Engineer (Digital Twin)Scottsdale, AZ$146,970–$249,780 / yearThis role involves conducting thermal-mechanical simulations for microelectronic packaging and improving modeling methodologies. A competitive salary ranging from $146,970 to $249,780 is offered along with a comprehensive benefits package.#J-18808-Ljbffr.
NewPackaging Process Engineer, Microdisplay Backend (RSU) SnapPackaging Process Engineer, Microdisplay Backend (RSU)Chandler, AZThe role requires a BS degree and over 7 years in a related field, focusing on automated production equipment and yield improvement. Snap is looking for an experienced engineer to own the backend packaging process for LCOS advanced displays in Chandler, Arizona.
ADCE Packaging Design Architect Intel CorpADCE Packaging Design ArchitectPhoenix, AZ$220,920–$311,890 / yearBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Experience in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP, Concept HDL, Sigrity), and/or Mentor Xpedition platform tools (PCB Layout/XPD, Designer, Hyperlynx).
Silicon Packaging Engineering Manager Intel CorpSilicon Packaging Engineering ManagerPhoenix, AZ$190,610–$269,100 / yearBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Minimum Qualifications: Bachelor's degree in Electrical Engineering or STEM related field with 9+ years of relevant experience OR- Master's degree in Electrical Engineering or STEM related field with 6+ years of relevant experience OR- PhD in Electrical Engineering or STEM related field with 4+ years of relevant experience.
Senior Engineer, Packaging Engineering Apidel TechnologiesSenior Engineer, Packaging EngineeringTempe, AZContractorAnalyzes engineering drawings and specifications to determine the required type of packaging materials and to maximize convenience, utility and function based on the product's physical characteristics, safety and special-handling requirements. This is an individual contributor role that requires the use of judgement in applying professional expertise and is expected to work independently with minimal supervision.
(Senior) Member of Technical Staff / Director, Process Engineering, Advanced Packaging ASM International NV(Senior) Member of Technical Staff / Director, Process Engineering, Advanced PackagingPhoenix, AZYoull lead a team of experts working on advanced thermal films compatible with rapidly evolving demands of advanced packaging and heterogenous integration, leveraging ALD/PEALD, CVD/PECVD, and related technologies to turn forward looking roadmaps into manufacturable solutions. Collaborate closely with customers, Account Technology Directors, Product Management, and Business Development to align on high thermal conductivity materials roadmaps with customer device and packaging strategies.
NewPackaging Equipment Engineer AI-Enhanced Inspection IntelPackaging Equipment Engineer AI-Enhanced InspectionChandler, AZ$133,800–$188,890 / yearIntel Corporation is seeking an experienced engineer in Chandler, Arizona to develop assembly processes and optimize manufacturing quality for silicon and package technologies. Ideal candidates will have a Bachelor's degree in Engineering or similar, with significant experience in inspection equipment, and a passion for innovation in manufacturing processes.
Packaging Associate Flow DistributionPackaging AssociatePhoenix, AZPackaging and manufacturing responsibilities including, but not limited to, counting, sorting, labeling, sealing, boxing, and taping products according to SOPs. Flow Distribution is seeking motivated and detail-oriented Packaging Associates to join our Manufacturing and Packaging team for an immediate start.
Principal Engineer, Electrical Engineering – Advanced Packaging ASMPrincipal Engineer, Electrical Engineering – Advanced PackagingPhoenix, ArizonaThe Principal Electrical Engineer is a technical leader responsible for defining, designing, and governing the electrical architecture of advanced semiconductor packaging equipment (etch, deposition, etc.). With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving.
Kitchen Float – Packaging, Production & Prep JARS CannabisKitchen Float – Packaging, Production & PrepPhoenix, AZ$18–$21 / hourFull timeThe Kitchen Float will work across multiple kitchen stations, supporting packaging, production, and prep tasks as needed. This is an excellent opportunity to gain hands-on experience in packaging, production, and prep while growing your skills in a supportive environment.
Packaging Technician Grow SciencesPackaging TechnicianPhoenix, AZFull timeMaintains the highest level of cleanliness and sanitation inside the processing area and participates in the clean-up of equipment and the workplace at the end of every shift. This role is responsible for product and loss tracking, ensuring products are packaged and accounted for in accordance with company policy and state regulations.
(Senior) Member of Technical Staff / Director, Process Engineering, Advanced Packaging ASM(Senior) Member of Technical Staff / Director, Process Engineering, Advanced PackagingPhoenix, ArizonaYou’ll lead a team of experts working on advanced thermal films compatible with rapidly evolving demands of advanced packaging and heterogenous integration, leveraging ALD/PEALD, CVD/PECVD, and related technologies to turn forward looking roadmaps into manufacturable solutions. · Collaborate closely with customers, Account Technology Directors, Product Management, and Business Development to align on high thermal conductivity materials roadmaps with customer device and packaging strategies.
NewProcess Engineer II - Microelectronics Packaging & SPC MED MedtronicProcess Engineer II - Microelectronics Packaging & SPCTempe, AZMedtronic Inc in Tempe, Arizona, is seeking a Process Engineer II who will be responsible for scouting materials and developing manufacturing processes. The role requires a Bachelor's or Master's degree in a related field and experience in microelectronics processes.
Advanced Packaging Supplier Technology Development Program Manager Intel CorpAdvanced Packaging Supplier Technology Development Program ManagerPhoenix, AZ$133,800–$255,200 / yearBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. This is a hands-on position that requires extensive work with supplier teams (through F2F meetings with local reps, phone/Teams meetings, and international travel to supplier factories), internal integration teams, and process module engineering teams to achieve new capacity qualification and ramp production on-time.
Packaging Specialist Verano Holdings CorpPackaging SpecialistAZWhile performing the duties of this job, the employee is frequently required to remain in a stationary position, move and/or position oneself, communicate, operate and/or prepare, place, position objects, tools, or controls. As a Packaging Specialist, you are responsible accurately weighing, packing, and labeling cannabis flower, infused edibles, and cannabis extracts for shipment to retail dispensaries.
2nd Shift Packaging Material Handler Campbell's2nd Shift Packaging Material HandlerGoodyear, ArizonaOther duties that may be performed by the Material Handler are, but not limited to: safe housekeeping, keeping work areas clean; storing supplies in designated areas; keeping aisles/exits clear and free from obstructions; removing trash from work area floor; following instructions for safe lifting/carrying of various sizes, shapes, and weights. Our portfolio includes the iconic Campbell’s brand, as well as Cape Cod, Chunky, Goldfish, Kettle Brand, Lance, Late July, Pacific Foods, Pepperidge Farm, Prego, Pace, Rao’s Homemade, Snack Factory, Snyder’s of Hanover.
Packaging Development Engineer Staffmark Group LlcPackaging Development EngineerPhoenix, AZRemoteconfirm the suitability of packaging on mass production and filling lines; they will provide expert technical support to troubleshoot and resolve. At Staffmark, we connect hardworking people with great companies, creating opportunities that make a lasting impact.
Head of Pricing and Packaging Cable One Inc.Head of Pricing and PackagingPhoenix, AZFull timeThe Head of Pricing and Packaging will own enterprise‑wide pricing and packaging strategy across our consumer product portfolio, partnering closely with Product, Finance, Marketing, Sales, and Operations to drive revenue growth, margin discipline, and customer value. Cable One and our family of brands appreciates the role our associates play to help the company grow, and in return an excellent benefits package is offered to our associates to recognize the importance of their contributions, such as: Medical, dental, and vision plans - start when you start!
Packaging Graphics Production Lead The WebstaurantStore IncPackaging Graphics Production LeadPhoenix, AZThis person is the single point of ownership for print-ready packaging files - from redesign planning and DAM governance through factory submission, vendor coordination, and cost forecasting. The Packaging Graphics Production Lead owns the end-to-end production, governance, and project management of packaging graphics across our Private Label brands and product lines.
Packaging Operator Brewers CollectivePackaging OperatorTempe, ArizonaFrom our longstanding efforts to support American farmers, military, veterans, and first responders, to emergency drinking water donations and responsible drinking programs, we are guided by our commitment to the communities we call home and the 65,000 hardworking Americans who bring our beer to life. We are home to the nation’s most iconic beer and beyond beer brands, including Michelob ULTRA – America’s #1 top-selling beer – as well as Busch Light, Budweiser, Bud Light, Stella Artois, Cutwater Spirits, and industry-leading craft brands.
Packaging Operator Anheuser-Busch InBev SA/NVPackaging OperatorTempe, AZFrom our longstanding efforts to support American farmers, military, veterans, and first responders, to emergency drinking water donations and responsible drinking programs, we are guided by our commitment to the communities we call home and the 65,000 hardworking Americans who bring our beer to life. COMPANY: We are home to the nation's most iconic beer and beyond beer brands, including Michelob ULTRA - America's #1 top-selling beer - as well as Busch Light, Budweiser, Bud Light, Stella Artois, Cutwater Spirits, and industry-leading craft brands.
Production Packaging Associate - 2nd Shift Altium Packaging LPProduction Packaging Associate - 2nd ShiftPhoenix, AZResponsibilities include, but are not limited to the following: Demonstrates safe work practices by wearing correct PPE and following safety policies. The Production Packaging Associate is an entry level position, responsible for proper packaging of materials and finished products.
Account Manager, Protective Packaging (Cushioning) - Phoenix, AZ (Phoenix, AZ, US) Sealed Air CorpAccount Manager, Protective Packaging (Cushioning) - Phoenix, AZ (Phoenix, AZ, US)Phoenix, AZ$103,600–$166,750 / yearSealed Air designs and delivers packaging solutions that protect essential goods transported worldwide, preserve food, enable e-commerce and digital connectivity, and help create a global supply chain that is touchless, safer, less wasteful, and more resilient. The Account Manager acts as a trusted advisor, leveraging Sealed Air's portfolio of cushioning solutions (paper, foam, shrink films and inflatable systems) and service capabilities to create long-term customer value.
Senior Director, Pricing & Packaging Gainsight, Inc.Senior Director, Pricing & PackagingAZ$215,000–$230,000 / yearThis is a great opportunity for someone who thrives in a highly strategic, data-driven SaaS environment and enjoys working cross-functionally with teams like Product, Sales, Finance, Marketing, and Customer Success. In this role, you'll play a key role in driving Gainsight's monetization strategy and long-term revenue growth by leading the evolution of pricing and packaging across its product portfolio, including the transition to usage- and value-based models.
NewCustomer Program Manager, International Packaging Veritiv CorpCustomer Program Manager, International PackagingChandler, AZJob Responsibilities: SOW development, project planning, scheduling, progress tracking/monitoring, resource assignment, risk management, scope management, driving the teams, carrying out the projects against committed goals, managing project members and dependencies and presenting to internal teams and where needed, external partners. Work closely with adjacent functional groups such as Sales, Engineering, Supply Chain, Manufacturing, and Marketing to coordinate interdepartmental activities ensuring the completion of the project on schedule and within the customer parameters.
Application Packaging Specialist Tata Consultancy Services LtdApplication Packaging SpecialistPhoenix, AZ$50,000–$80,000 / yearDevelop and execute test cases for verifying installer packages, focusing on fresh installs, upgrades, uninstalls, silent/command-line installs, and bundled dependency behavior. Utilize InstallShield to create installer packages, including .msi packages, exe installers, msp patches, and hotfixes/updates.