Silicon Packaging Design Engineer IntelSilicon Packaging Design EngineerChandler, ArizonaJob Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Arizona, Phoenix Additional Locations: US, Oregon, Hillsboro Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Packaging Module Development Engineer Intel CorpPackaging Module Development EngineerChandler, AZ$99,030–$188,890 / yearMinimum Qualifications: Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, Physics/Applied Physics, Chemical Engineering, or a related STEM field with 1+ years of relevant experience. Job Details: Job Description: The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms.
Packaging Module Equipment Development Engineer Intel CorpPackaging Module Equipment Development EngineerChandler, AZ$133,800–$188,890 / yearThe Packaging Module Development Engineer will contribute to advancing technology and foundry capabilities by: Developing First Level/Second Level Interconnect (FLI/SLI), Thermal solutions (TIM1), and SMT/PCB technologies to support Intel's future packaging platforms. Job Details: Job Description: Job Description: The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms.
Advanced Packaging Reliability Lab Engineer IntelAdvanced Packaging Reliability Lab EngineerChandler, ArizonaJob Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Arizona, Phoenix Additional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Responsibilities will include but not be limited to: - Characterization of equipment performance and response to excursions/issues - Continuous improvement of methods, specifications, and training - Development, analysis, and implementation of statistical process control - Translation of reliability stress analysis requirements into fixturing and development of new tools, systems, and other innovative solutions - Coordination of tool vendors and field service engineers - Collaboration with internal operations, planning, and facilities teams Qualifications:
Packaging Equipment Development Group Lead IntelPackaging Equipment Development Group LeadChandler, Arizona$180,770–$255,200 / yearThis group focuses on developing industry-leading packaging solutions to support Intel's product roadmap, fostering innovation, optimizing manufacturing equipment, and enabling high-volume production. In this role, you will oversee new equipment introductions, ensure seamless integration of equipment and processes, and lead your team in solving complex challenges to deliver world-class manufacturing solutions.
Substrate Packaging Defect Metro Tool Owner IntelSubstrate Packaging Defect Metro Tool OwnerChandler, ArizonaDirect next-generation tool installation, reaching major milestones-purchase-spec development, source inspection, design, pre-fac, Safety level approval, Supplier qual, Intel qual, etc.-by collaborating with diverse stakeholders. In this role, you will help drive innovation in EMIB-T, glass core, EMIB scaling, and panel-level packaging technologies for substrate as well as assembly test mfg (ATM) factories for Intel's IPG and IFS customers.
Manufacturing Operations Manager Shift 6 – Advanced Packaging IntelManufacturing Operations Manager Shift 6 – Advanced PackagingChandler, Arizona$89,010–$170,630 / yearIntel's Advanced Packaging Technology Development: Substrate and Wafer Assembly (APTDSWA) organization is seeking a dynamic and experienced Manufacturing Operations Manager to lead a high-performing team of technicians in a state-of-the-art substrate packaging manufacturing environment. Job Type: Experienced Hire Shift: Shift 6 (United States of America) Primary Location: US, Arizona, Phoenix Additional Locations: Business group: Intel makes possible the most amazing experiences of the future.
Packaging Lead Bright Innovation LabsPackaging LeadCoolidge, AZFull timeThe Production Line Leader position is accountable for ensuring that production is executed in a timely manner and performs regular quality control assessments to produce excellent quality output, minimize delays and reach production goals. While performing the duties of this job, employee is regularly required to stand and walk for prolonged periods of time, employee must be able to bend, reach, pull and lift to 40 pounds.
Packaging Associate Gummi WorldPackaging AssociateChandler, AZWe’re currently hiring Packaging Line Operators and Team Members who are excited to grow with us, thrive in a collaborative environment, and take pride in producing products that make a difference in people’s lives. Set up, operate, and monitor packaging machinery (bottle fillers, cappers, labelers, sealers, pouch fillers, etc.).
ATD MIHL Equipment Development Engineer IntelATD MIHL Equipment Development EngineerChandler, Arizona$115,110–$188,890 / yearThis group collaborates with cross-functional teams to drive innovation in manufacturing processes, enhance product reliability, and support Intel's broader mission of delivering world-class technologies. Business group Intel's Packaging Module Development team focuses on advancing assembly and packaging technologies that enable cutting-edge solutions across Intel's diverse product portfolio.
NewATD Laser Development Engineer IntelATD Laser Development EngineerChandler, ArizonaYour work will directly impact the performance, quality, and reliability of Intel's assembly and packaging solutions, driving advancements in technology that address the dynamic needs of the semiconductor industry. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.