Packaging Engineer iMPact Business GroupPackaging EngineerTempe, AZAnalyzing engineering drawings and specifications to determine the required types of packaging materials and to maximize convenience, utility, and function based on the product's physical characteristics, safety, and special-handling requirements. Our client, a Global Leader in the Medical Device Industry, has an immediate opening for a R&D Packaging Engineer(Medical Products) for a 6-month + Contract.
Packaging Engineer JBL ResourcesPackaging EngineerTempe, AZJBL Resources is proud to have earned the reputation of being a premier provider of top talent professionals in the fields of engineering, human resources, logistics, operations, and supply chain management. Working here means joining a team of top technical professionals bringing cutting-edge products to the forefrontoffering driven individuals the opportunity to make a meaningful impact every day.
Packaging Engineer Mount IndiePackaging EngineerTempe, ArizonaThis role is responsible for planning, designing, and delivering innovative packaging solutions across a range of technologies, including integrated circuits (ICs), system-in-package (SiP), sub-assemblies, and modules. You will own the full packaging lifecycle—from concept and definition through design, modeling, testing, and production release—while partnering closely with cross-functional engineering teams and external vendors.
Silicon Packaging Design Engineer IntelSilicon Packaging Design EngineerChandler, ArizonaJob Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Arizona, Phoenix Additional Locations: US, Oregon, Hillsboro Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Senior Packaging Engineer-Phoenix AZ-Hybrid Roth Staffing CompaniesSenior Packaging Engineer-Phoenix AZ-HybridGuadalupe, Arizona$0–$61.86 / hourAnalyzes engineering drawings and specifications to determine the required type of packaging materials and to maximize convenience, utility and function based on the product's physical characteristics, safety and special-handling requirements. Our collaborative culture, focus on continuous improvement, and passion for making a meaningful impact set us apart as an employer of choice within the industry.
Packaging Module Development Engineer Intel CorpPackaging Module Development EngineerChandler, AZ$99,030–$188,890 / yearMinimum Qualifications: Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, Physics/Applied Physics, Chemical Engineering, or a related STEM field with 1+ years of relevant experience. Job Details: Job Description: The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms.
Packaging Module Equipment Development Engineer Intel CorpPackaging Module Equipment Development EngineerChandler, AZ$133,800–$188,890 / yearThe Packaging Module Development Engineer will contribute to advancing technology and foundry capabilities by: Developing First Level/Second Level Interconnect (FLI/SLI), Thermal solutions (TIM1), and SMT/PCB technologies to support Intel's future packaging platforms. Job Details: Job Description: Job Description: The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms.
Advanced Packaging Reliability Lab Engineer IntelAdvanced Packaging Reliability Lab EngineerChandler, ArizonaJob Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Arizona, Phoenix Additional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Responsibilities will include but not be limited to: - Characterization of equipment performance and response to excursions/issues - Continuous improvement of methods, specifications, and training - Development, analysis, and implementation of statistical process control - Translation of reliability stress analysis requirements into fixturing and development of new tools, systems, and other innovative solutions - Coordination of tool vendors and field service engineers - Collaboration with internal operations, planning, and facilities teams Qualifications:
Packaging Equipment Development Group Lead IntelPackaging Equipment Development Group LeadChandler, Arizona$180,770–$255,200 / yearThis group focuses on developing industry-leading packaging solutions to support Intel's product roadmap, fostering innovation, optimizing manufacturing equipment, and enabling high-volume production. In this role, you will oversee new equipment introductions, ensure seamless integration of equipment and processes, and lead your team in solving complex challenges to deliver world-class manufacturing solutions.
Senior Engineer, Packaging Engineering Apidel TechnologiesSenior Engineer, Packaging EngineeringTempe, AZContractorAnalyzes engineering drawings and specifications to determine the required type of packaging materials and to maximize convenience, utility and function based on the product's physical characteristics, safety and special-handling requirements. This is an individual contributor role that requires the use of judgement in applying professional expertise and is expected to work independently with minimal supervision.
Substrate Packaging Defect Metro Tool Owner IntelSubstrate Packaging Defect Metro Tool OwnerChandler, ArizonaDirect next-generation tool installation, reaching major milestones-purchase-spec development, source inspection, design, pre-fac, Safety level approval, Supplier qual, Intel qual, etc.-by collaborating with diverse stakeholders. In this role, you will help drive innovation in EMIB-T, glass core, EMIB scaling, and panel-level packaging technologies for substrate as well as assembly test mfg (ATM) factories for Intel's IPG and IFS customers.
Packaging Prod Designer QXRXV5W3 icreativesPackaging Prod Designer QXRXV5W3Tempe, ArizonaOur client, a trusted leader in consumer health products, is looking for a Temp-to-Hire, Packaging Production Designer to bring their packaging to life across multiple brands. Include samples of your packaging production work, labels, FDA / Regulatory Compliance Integration (if applicable), Die Lines, samples of Final Art Files, and Comps.
NewPackaging Operator Brewers CollectivePackaging OperatorTempe, ArizonaFor more than 165 years as a leading American manufacturer, Anheuser-Busch has delivered a legacy of brewing great-tasting, high-quality beers that have satisfied beer drinkers for generations. As the nation’s top brewer, one of the fastest growing spirits companies, and an insurgent force in energy drinks, we drive economic prosperity nationwide through investments in our people, facilities, and communities.
Manufacturing Operations Manager Shift 6 – Advanced Packaging IntelManufacturing Operations Manager Shift 6 – Advanced PackagingChandler, ArizonaIntel's Advanced Packaging Technology Development: Substrate and Wafer Assembly (APTDSWA) organization is seeking a dynamic and experienced Manufacturing Operations Manager to lead a high-performing team of technicians in a state-of-the-art substrate packaging manufacturing environment. Job Type: Experienced Hire Shift: Shift 6 (United States of America) Primary Location: US, Arizona, Phoenix Additional Locations: Business group: Intel makes possible the most amazing experiences of the future.
Packaging Associate Gummi WorldPackaging AssociateChandler, AZWe’re currently hiring Packaging Line Operators and Team Members who are excited to grow with us, thrive in a collaborative environment, and take pride in producing products that make a difference in people’s lives. Set up, operate, and monitor packaging machinery (bottle fillers, cappers, labelers, sealers, pouch fillers, etc.).
Packaging Operator Anheuser-Busch InBevPackaging OperatorTempe, AZFrom our longstanding efforts to support American farmers, military, veterans, and first responders, to emergency drinking water donations and responsible drinking programs, we are guided by our commitment to the communities we call home and the 65,000 hardworking Americans who bring our beer to life. COMPANY: We are home to the nation's most iconic beer and beyond beer brands, including Michelob ULTRA - America's #1 top-selling beer - as well as Busch Light, Budweiser, Bud Light, Stella Artois, Cutwater Spirits, and industry-leading craft brands.
HTST Packaging Operator Shamrock Foods CompanyHTST Packaging OperatorPhoenix, AZPart timeThis would include compliance with Good Manufacturing Practices, wearing of all required PPE in designated areas, confined space safety, safe chemical handling, fall restraints, etc. This would include compliance of Good Manufacturing Practices, wearing required PPE in designated areas, confined space safety, safe chemical handling, fall restraints, etc.
ATD MIHL Equipment Development Engineer IntelATD MIHL Equipment Development EngineerChandler, Arizona$115,110–$188,890 / yearThis group collaborates with cross-functional teams to drive innovation in manufacturing processes, enhance product reliability, and support Intel's broader mission of delivering world-class technologies. Business group Intel's Packaging Module Development team focuses on advancing assembly and packaging technologies that enable cutting-edge solutions across Intel's diverse product portfolio.
NewATD Laser Development Engineer IntelATD Laser Development EngineerChandler, ArizonaYour work will directly impact the performance, quality, and reliability of Intel's assembly and packaging solutions, driving advancements in technology that address the dynamic needs of the semiconductor industry. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.