Senior Director, Pricing & Packaging Gainsight, Inc.Senior Director, Pricing & PackagingTX$215,000–$230,000 / yearThis is a great opportunity for someone who thrives in a highly strategic, data-driven SaaS environment and enjoys working cross-functionally with teams like Product, Sales, Finance, Marketing, and Customer Success. In this role, you'll play a key role in driving Gainsight's monetization strategy and long-term revenue growth by leading the evolution of pricing and packaging across its product portfolio, including the transition to usage- and value-based models.
Director, Advanced Packaging Disruptive Technology (Based in Singapore) Applied Materials IncDirector, Advanced Packaging Disruptive Technology (Based in Singapore)Austin, TXThe Director will build and lead a high-impact team focused on exploratory, pre-product technologies, developing solutions such as D2W, RDL, CoWoS, TSV, etc and connecting emerging technology inflections to customer and market roadmaps. Based in Singapore, this role is responsible for defining and driving pathfinding strategy for N+2 and beyond advanced packaging technologies, leading disruptive innovation that shapes future integration architectures and unlocks new value creation opportunities.
Sr. Packaging Engineer Tesla IncSr. Packaging EngineerAustin, TXThe successful candidate must have the ability to work quickly and efficiently with a high level of precision, have strong interpersonal and communication skills, be detail oriented, and not afraid to re-define tradition. Tesla is seeking a highly motivated Packaging Engineer to join our Packaging team in developing world-class designs for automation equipment.
Integrated Circuit Packaging Architect Advanced Micro Devices IncIntegrated Circuit Packaging ArchitectAustin, TXSuccessful candidate would collaborate with product design teams and technology development partners to understand future product needs and define a packaging roadmap that includes architecture, process definition, Design for Manufacturing (DFM) and Design for Yield (DFY) guidelines. The Role: Advanced packaging technology leader driving packaging architecture across client, server, gaming and GPU products.
AI Automation Design Packaging Lead Advanced Micro Devices IncAI Automation Design Packaging LeadAustin, TXTHE PERSON: The successful candidate must be a proven leader and a technical innovator who can bridge the gap between physical design requirements and software automation to generate AI driven workflows. THE ROLE: We are looking for a forward-thinking candidate to drive and lead the team for the development and deployment of next-generation packaging design automation and AI-Driven workflows.
Integrated Circuit - Packaging Architect Engineer Advanced Micro Devices, IncIntegrated Circuit - Packaging Architect EngineerAustin, TexasSuccessful candidate would collaborate with product design teams and technology development partners to understand future product needs and define a packaging roadmap that includes architecture, process definition, Design for Manufacturing (DFM) and Design for Yield (DFY) guidelines. Education : BS/MS/PhD in Material Science, Mechanical Engineering, Computer Science, Applied Mathematics, Electrical Engineering or equivalent This role is not eligible for visa sponsorship.
Thermal Mechanical Test Engineer, Silicon Packaging Starlink Space Exploration Technologies CorpThermal Mechanical Test Engineer, Silicon Packaging StarlinkBastrop, TXWe provide reliable and fast internet to millions of users worldwide, including populations with little or no connectivity, rural communities, aircraft, watercraft, and places where existing services are unreliable, too expensive, or disconnected by natural disasters. You will support the silicon packaging process engineering organization by characterizing package and board thermal performance, validating mechanical robustness, and correlating simulation results with physical test data to enable high-volume production of reliable Starlink hardware.
Silicon Packaging Process Engineer, Production Starlink Space Exploration Technologies CorpSilicon Packaging Process Engineer, Production StarlinkTXDevelop new technologies and establish baselines for assembly and packaging, including wafer grinding, wafer dicing, lithography, lamination, plating, etching, surface mount technology (SMT), flip chip, bonding, molding, underfill, dispense, sputter, lid attach, solder ball attach, and advanced packaging processes. ITAR REQUIREMENTS: To conform to U.S. Government export regulations, applicant must be a (i) U.S. citizen or national, (ii) U.S. lawful, permanent resident (aka green card holder), (iii) Refugee under 8 U.S.C. § 1157, or (iv) Asylee under 8 U.S.C. § 1158, or be eligible to obtain the required authorizations from the U.S. Department of State.
Advanced Packaging Process Engineer, Silicon Technology Starlink Space Exploration Technologies CorpAdvanced Packaging Process Engineer, Silicon Technology StarlinkTXRESPONSIBILITIES: • Own packaging assembly processes from concept to mass production, including equipment and material selection for wafer-level and chip-level systems • Develop new technologies and establish baselines for assembly and packaging, including wafer grinding, wafer dicing, lithography, lamination, plating, etching, SMT, flip chip, bonding, molding, underfill, dispense, sputter, lid attach, and solder ball attach, and next-generation panel-level packaging processes • Bring-up for new product introduction (NPI) and new technology introduction (NTI) for assembly packaging lines • Own packaging prototypes, product development, and release to production • Select equipment and material to meet quality, reliability, cost, yield, and production targets • Interface with equipment and material suppliers including continuous improvement plans, cost reduction, and productivity improvements • Cross-functional interface with silicon design, materials, thermal, systems, and production teams • Implement advanced packaging solutions into SpaceX next generation products on Earth, in orbit, and beyond. BASIC QUALIFICATIONS: • Bachelor's degree in electrical engineering, mechanical engineering, chemical engineering, materials science, physics, or other engineering discipline • 1+ years working with semiconductor packaging processing equipment, silicon, microelectronics, or packaging design (internship experience applicable).
Sr. Silicon Packaging Process Engineer, Silicon Technology Starlink Space Exploration Technologies CorpSr. Silicon Packaging Process Engineer, Silicon Technology StarlinkTXDevelop new technologies and establish baselines for assembly and packaging including wafer grinding, wafer dicing, lithography, lamination, plating, etching, SMT, flip chip, bonding, molding, underfill, dispense, sputter, lid attach, and solder ball attach. ITAR REQUIREMENTS: To conform to U.S. Government export regulations, applicant must be a (i) U.S. citizen or national, (ii) U.S. lawful, permanent resident (aka green card holder), (iii) Refugee under 8 U.S.C. § 1157, or (iv) Asylee under 8 U.S.C. § 1158, or be eligible to obtain the required authorizations from the U.S. Department of State.
Silicon Packaging Process Engineer, Silicon Technology Starlink Space Exploration Technologies CorpSilicon Packaging Process Engineer, Silicon Technology StarlinkTXRESPONSIBILITIES: • Own packaging assembly processes from concept to mass production, including equipment and material selection for wafer-level and chip-level systems • Develop new technologies and establish baselines for assembly and packaging, including wafer grinding, wafer dicing, lithography, lamination, plating, etching, SMT, flip chip, bonding, molding, underfill, dispense, sputter, lid attach, and solder ball attach, and next-generation panel-level packaging processes • Bring-up for new product introduction (NPI) and new technology introduction (NTI) for assembly packaging lines • Own packaging prototypes, product development, and release to production • Select equipment and material to meet quality, reliability, cost, yield, and production targets • Interface with equipment and material suppliers including continuous improvement plans, cost reduction, and productivity improvements • Cross-functional interface with silicon design, materials, thermal, systems, and production teams • Implement advanced packaging solutions into SpaceX next generation products on Earth, in orbit, and beyond. BASIC QUALIFICATIONS: • Bachelor's degree in electrical engineering, mechanical engineering, chemical engineering, materials science, physics, or other engineering discipline • 1+ years working with semiconductor packaging processing equipment, silicon, microelectronics, or packaging design (internship experience applicable).
Mechanical Engineer, Packaging Engineering Tesla IncMechanical Engineer, Packaging EngineeringAustin, TXYou will serve as a highly technical contributor on the team responsible for design, optimization, prototyping and validation of new ways to deliver components safely and efficiently throughout our supply chain and manufacturing processes. Tesla is seeking a highly motivated Mechanical Design Engineer to join our Vehicle Packaging team in developing world-class designs for use in high volume automation equipment.
Lead Silicon Packaging Technician, Silicon Assembly Starlink Space Exploration Technologies CorpLead Silicon Packaging Technician, Silicon Assembly StarlinkBastrop, TXOperate and maintain surface mount technology, automated optical inspection, reflow, aqueous deflux, convection and vacuum bake, compression molding, laser marking, ball grid array, tape mount, singulation, physical vapor deposition, vision, and pick/place machines. Operate die attach equipment, including epoxy dispensers, pick-and-place bonders, and reflow stations, to place and secure dies with micron-level accuracy and controlled bond line thickness.
Silicon Packaging Technician, Silicon Assembly Starlink Space Exploration Technologies CorpSilicon Packaging Technician, Silicon Assembly StarlinkBastrop, TXalign, bake, coat, expose, develop), electrochemical plating, die Attach, thermal compression bonding, compression molding/overmold, wafer dicing, scribe & break, stripping/etching, plasma, reactive ion etching (RIE), thin films deposition (CVD/PVD/ALD), dry film lamination & imaging. Operate photolithography tools, such as photoresist coaters, aligners, steppers, scanners, and developers, to apply uniform resist layers, align products, expose patterns, and develop images with precision accuracy.
Packaging Sourcing Specialist Woodbolt Distribution LLCPackaging Sourcing SpecialistAustin, TXThe company's disruptive and innovative products compete in the Functional Beverage and Active Nutrition segments, under three consumer-loved brands: C4 (one of the fastest-growing energy drink brands in the United States and the #1 selling global pre-workout brand), XTEND (the #1 post-workout recovery brand in the United States), and Cellucor (an award-winning sports nutrition brand created in 2002). Since its founding 20 years ago, Nutrabolt has set out to meet the discerning needs of performance athletes and fitness enthusiasts, while appealing beyond this core group to include consumers around the globe who are making healthy, active living a daily priority.
Packaging Designer, Amazon & Whole Foods Market Private Brands, Brand and Sustainability Amazon.com IncPackaging Designer, Amazon & Whole Foods Market Private Brands, Brand and SustainabilityAustin, TXReporting to the Creative Director of Package Design, you"ll own and drive the development and evolution of packaging systems across both Whole Foods Market and Amazon private label brands, helping shape how customers experience our products across stores, digital channels, and multiple retail formats. Based at Whole Foods Market HQ in Austin, TX, this role supports a growing portfolio of Whole Foods Market and Amazon private brands, spanning multiple categories, tiers, and customer experiences.
Test Engineer, Packaging Product Design Apple IncTest Engineer, Packaging Product DesignAustin, TXThe Packaging PD team is a diverse group of people responsible for the design and execution of structural packaging for all Apple products, from shippers to finished goods boxes. Apple's approach to packaging is unique, so we value people who are eager to learn new skills and further improve their knowledge of packaging design, manufacturing processes, and sustainable materials.
NewPackaging Product Design Engineer Apple, Inc.Packaging Product Design EngineerAustin, TXThe Packaging PD team is a diverse group of people responsible for the design and execution of structural packaging for all Apple products - from shippers to finished goods boxes. Apple's approach to packaging is unique, so we value people who are eager to learn new skills and further improve their knowledge of packaging design, manufacturing processes, and sustainable materials.
NewIC Packaging Integration Engineer Apple, Inc.IC Packaging Integration EngineerAustin, TXDescriptionYou will be responsible for IC packaging developmentWork with cross‑functional teams and lead SoC Package integration and architecture effortsDrive the industry with advanced package solutions, new material developments, and specsResponsibilitiesWork with cross-functional domains through package definition process and deliver optimized solutions to meet electrical, mechanical, thermal requirements. Test vehicle definition and execution working alongside foundries and OSATs for advanced packaging technologies (FOWLP, 2.5D, 3D, coreless MCM).Well versed with DOE principles and statistical analyses to establish robust build plans for OSATs through NPI phase.
NewPackaging Assembly Engineer Apple, Inc.Packaging Assembly EngineerAustin, TXIn this highly visible role, you will own development, optimization and sustaining the advanced flip-chip BGA (FCBGA) assembly process from pathfinding, NPI through high-volume manufacturing by defining assembly baseline processes, deciding package BOM, establishing package design rules that are optimized for performance, reliability, yield and cost for a variety of projects including SoC.Description Responsible to lead packaging assembly technology development. Responsibilities Define and optimize end‑to‑end FCBGA assembly process flow (wafer back‑end interface, flip‑chip attach, underfill, lid/heat spreader attach, ball attach, singulation, final inspection).Develop and maintain process documentation including process specs, work instructions, control plans, PFMEA, and process flow diagrams.
Supply Chain Manager, Packaging & Logistics Tesla IncSupply Chain Manager, Packaging & LogisticsAustin, TXThis is a cross-functional role that involves data collection from logistics, planning, packaging and other stakeholders to model, scope high value cost reduction opportunities and responsible for accelerated execution of logistics optimization opportunities identified. Tesla is seeking a motivated, experienced, and knowledgeable Supply Chain Program Manager to support optimization of logistics, warehousing and material flow costs through packaging and supply chain improvements.
Senior Packaging Designer Dell Technologies IncSenior Packaging DesignerAustin, TXThe Senior Packaging Designer will collaborate closely with Industrial Designers, Packaging Engineers, CMF teams, the Brand team, Software team and other partners to interpret design requirements and execute cohesive solutions. Develop high-quality design assets across packaging, product interfaces, marketing, and communications, including graphics, branded elements, wallpapers, and digital content such as short-form videos and animations.
Packaging Engineering Intern - Fall Fab2Packaging Engineering Intern - FallAustin, TexasDesign and iterate on machines and subsystems for semiconductor packaging fabrication, such as laser ablation machines, reflow ovens, and automated metal plating facilities. We are a small team engaged in end-to-end process development and integration work for semiconductor packaging processes, providing exposure to interesting work that is hard to find at larger companies.
Packaging Sales Executive Enhance RecruitingPackaging Sales ExecutiveAustin, TXStay connected to local market trends, key industries (energy, food & beverage, industrial manufacturing), and competitive landscape. Own and grow a Austin/San Antonio-based territory through aggressive prospecting and relationship development across manufacturing, logistics, and distribution clients.
Package Layout Design Engineer , Annapurna Labs - AI Silicon Packaging Amazon.com IncPackage Layout Design Engineer , Annapurna Labs - AI Silicon PackagingAustin, TXIn this role, you will execute package layout tasks from floor planning through tape out and manufacturing release, working closely with senior engineers, SI/PI, thermal, and manufacturing teams to deliver production-ready designs that meet performance, density, and reliability targets. Perform RDL and substrate routing for high-density interconnects including microbumps, C4 bumps, TSVs, microvias, and PTH vias across multi-layer organic substrates or silicon interposers.
Sr. Signal & Power Integrity Engineer, Annapurna Labs - AI Silicon Packaging Amazon.com IncSr. Signal & Power Integrity Engineer, Annapurna Labs - AI Silicon PackagingAustin, TXWe pioneered cloud computing and never stopped innovating - that's why customers from the most successful startups to Global 500 companies trust our robust suite of products and services to power their businesses. Signal & Power Integrity Engineer to join our hardware team and drive the SI/PI analysis and optimization of advanced packaging solutions for next-generation machine learning and data center ASICs.
NewStrategic Packaging Sourcing & Cost Optimization Woodbolt Distribution, LLCStrategic Packaging Sourcing & Cost OptimizationAustin, TXQualified candidates will have a Bachelor's degree in a relevant field and at least 2 years of experience in packaging or supply chain roles. Woodbolt Distribution, LLC is seeking a skilled supply chain professional to manage packaging materials and sourcing strategies.
IC Packaging Simulation Engineer Apple IncIC Packaging Simulation EngineerTXIn this role, you will be working on stress and deformation simulation of IC packages to provide a comprehensive understanding of chip-package interaction and package-board interaction to ensure good device yield and reliability. Numerical modeling of the stress and deformation of component packages to provide a comprehensive understanding of chip-package interaction and package-board interaction to ensure good device yield and reliability.
NewLead Silicon Photonics Packaging Engineer Apple, Inc.Lead Silicon Photonics Packaging EngineerAustin, TXThe role includes designing silicon photonic devices to optimize coupling and performance, working with cross-functional teams, and developing packaging solutions. Apple Inc. is seeking a Silicon Photonics & Optical Packaging Engineer in Austin, Texas, to develop optical I/O module architecture and assembly solutions.
NewSenior IC Packaging & SoC Integration Engineer Apple, Inc.Senior IC Packaging & SoC Integration EngineerAustin, TXThe role involves collaboration across teams to meet stringent performance specs while fostering a diverse and inclusive work environment.#J-18808-Ljbffr. We seek candidates with a strong background in semiconductor packaging, proven problem-solving abilities, and expertise in advanced packaging techniques.
NewPackaging Design Engineer - Sustainable Prototyping & CAD Apple, Inc.Packaging Design Engineer - Sustainable Prototyping & CADAustin, TXA leading technology company based in Austin, Texas is seeking a packaging design professional to create innovative and sustainable packaging solutions. Candidates should have a BS degree in Mechanical Engineering or Packaging Science, along with 3 years of relevant experience and proficiency in CAD.
NewSenior FCBGA Packaging Engineer for SoC NPI to Volume Apple, Inc.Senior FCBGA Packaging Engineer for SoC NPI to VolumeAustin, TXThe position offers competitive challenges in a dynamic environment focused on cutting-edge technologies.#J-18808-Ljbffr. A leading technology company in Austin, Texas is seeking an IC Packaging Assembly Engineer.
NewIC Packaging Simulation Engineer Stress & AI Modeling Apple, Inc.IC Packaging Simulation Engineer Stress & AI ModelingAustin, TXA technology company in Austin, Texas, is seeking a Packaging Simulation Engineer skilled in FEM simulation with experience in ANSYS and ABAQUS. The role involves numerical modeling of IC packages and scripting CAD/FEM software to enhance product development and reliability.
NewIC Packaging & Integration Lead Drive Innovative Solutions Apple, Inc.IC Packaging & Integration Lead Drive Innovative SolutionsAustin, TXA leading technology company based in Austin, Texas, is seeking an IC Packaging Engineering Lead to drive innovative packaging solutions and collaborate with cross-functional teams. The role requires a BS degree and 20+ years of relevant industry experience, with strong skills in semiconductor packaging design and managerial capabilities.
Packaging engineer Info Way Solutions LLCPackaging engineerAustin, TXsuccessful candidate must have the ability to work quickly and efficiently with a high level of precision, have strong interpersonal and communication skills, be detail oriented, and not afraid to re-define. • Apply industrial design techniques of CAD, technical drawings, including datum structure, GD&T and tolerance stack up analysis.
Advanced Packaging Technologist Advanced Micro Devices IncAdvanced Packaging TechnologistAustin, TXDevelop and maintain mechanical and multi-physics models (structural, thermo-mechanical, electro-thermal and electro-optical) & drive validation strategies partnering with internal and external labs as required to enable STCO across silicon, package, board and platform. In this role, you will serve as a PCB-centric Mechanical Modeling Architect responsible for defining and driving next-generation packaging-platform architectures through rigorous, model-based decision making and System-Technology Co-Optimization (STCO).
NewGlobal Pricing & Packaging Director for AI SaaS Tricentis AmericasGlobal Pricing & Packaging Director for AI SaaSAustin, TXThe ideal candidate will have over 10 years of experience in pricing and commercial strategy at enterprise software firms, with a valuable ability to influence senior executives and drive results in a global context.#J-18808-Ljbffr. Tricentis Americas, Inc. is seeking a Senior Pricing & Packaging Director to design and evolve pricing strategies that enhance revenue for its products.
NewSenior Multiphysics IC Packaging Engineer University of Texas at AustinSenior Multiphysics IC Packaging EngineerAustin, TXA prestigious educational institution in Austin, Texas is seeking an experienced professional for a role in semiconductor packaging involving multiphysics simulations and interconnect modeling. This role involves collaboration with engineering teams and vendors to develop and refine simulation workflows.
NewMechanical Integration Engineer - Electronics & Sensor Packaging NightDragon AcquisitionMechanical Integration Engineer - Electronics & Sensor PackagingAustin, TXA leading defense technology firm located in Austin, Texas is seeking a Mechanical Integration Engineer to drive the integration of complex mechanical and electrical systems. The ideal candidate will have a Bachelor's degree in Mechanical or Aerospace Engineering and over 2 years of relevant experience.
Senior Packaging Sales Representative Enhance RecruitingSenior Packaging Sales RepresentativeAustin, TXGrow sales through: Cold calling and developing relationships with prospective accounts, closing on opportunities with prospects to turn them into customers, and growing the business within customers. SUMMARY We are seeking an experienced, results-driven Senior Packaging Sales Rep in Austin area for a Texas-based leading wholesale packaging distributor.
Project Manager, WWGS Marketing Operations - Packaging Amazon.com IncProject Manager, WWGS Marketing Operations - PackagingAustin, TXLead strategic planning for macro-level packaging initiatives (rebrands, new brand creation, portfolio-wide refreshes) with detailed project plans, milestones, and risk mitigation strategies. Whole Foods Market and Amazon Fresh are part of Worldwide Grocery Stores (WWGS), delivering quality food and innovative shopping experiences to customers across multiple brands and channels.
NewSignal & Power Integrity Engineer, Annapurna Labs - AI Silicon Packaging AmazonSignal & Power Integrity Engineer, Annapurna Labs - AI Silicon PackagingAustin, TXBasic Qualifications BS degree in electrical engineering or equivalent5+ years of experience in signal integrity, power integrity, or package designSolid understanding of either SI (S-parameter extraction, crosstalk, return loss, channel analysis) or PI (PDN impedance analysis, IR drop, decoupling strategy), with working awareness of the otherExperience with EM simulation and SI/PI tools such as HFSS, Cadence Sigrity (PowerSI, PowerDC, Clarity), ADS, or equivalentUnderstanding of advanced packaging technologies: 2.5D/3D-IC, silicon interposers, fan-out wafer-level packaging, RDL, TSVs, and microbump interconnectsFamiliarity with stack-up design and impedance control for multi-layer organic substrates or silicon interposers. Run high-speed channel simulations (S-parameter extraction, time-domain analysis, eye diagrams) for die-to-die and die-to-board interfaces, or analyze package PDN performance (decoupling effectiveness, plane resonance, IR drop, AC impedance).Model advanced interconnects: microbumps, C4 bumps, TSVs, microvias, PTH vias, and RDL traces for signal or power paths.
Silicon Photonics & Optical Packaging Engineer Apple IncSilicon Photonics & Optical Packaging EngineerTXIn this highly visible role, you will develop Si photonics engine/chiplet packaging and co-packaging solutions utilizing advanced packaging technologies, define assembly baseline processes, decide package BOM, establish optical coupling design/manufacturing that are optimized for performance, reliability, yield and cost. Si photonics based optical engine package architecture / Package integration and drive micro-optical component assembly/interface characterization through Innovation Work with optical component vendors, foundry and OSAT to bring Si photonics packaging solution from concept to HVM.
NewSI/PI Engineer Advanced 2.5D/3D Packaging AmazonSI/PI Engineer Advanced 2.5D/3D PackagingAustin, TXA leading cloud solutions provider in Austin, Texas is seeking a Signal or Power Integrity Engineer to enhance packaging solutions for cutting-edge machine learning applications. Ideal candidates will have a BS in Electrical Engineering, with 5+ years of relevant experience, and proficiency in signal and power integrity evaluation.
Packaging Machine Operator | $16.55/hr. Campbell'sPackaging Machine Operator | $16.55/hr.Austin, TexasOur portfolio includes the iconic Campbell’s brand, as well as Cape Cod, Chunky, Goldfish, Kettle Brand, Lance, Late July, Pacific Foods, Pepperidge Farm, Prego, Pace, Rao’s Homemade, Snack Factory, Snyder’s of Hanover. Individual base pay depends on work location and additional factors such as experience, job-related skills, and relevant education or training.
Sr. Thermal & Mechanical Packaging Engineer, Annapurna Labs Amazon.com IncSr. Thermal & Mechanical Packaging Engineer, Annapurna LabsAustin, TXYou develop from the lowest levels of circuit design to large system design including thermal and mechanical solutions and see those systems all the way through to high volume manufacturing. You'll provide leadership in the application of new technologies to large scale server deployments in a continuous effort to deliver a world-class customer experience.
Advanced Packaging Engineer - SI/PI Marvell Technology IncAdvanced Packaging Engineer - SI/PIAustin, TX$97,630–$146,300 / yearHighlights include an employee stock purchase plan with a 2-year look back, family support programs to help balance work and home life, robust mental health resources to prioritize emotional well-being, and a recognition and service awards to celebrate contributions and milestones. Expected Base Pay Range (USD) $97,630 - $146,300 per annum The successful candidate's starting base pay will be determined based on job-related skills, experience, qualifications, work location, and market conditions.
NewPackaging Design Test Engineer - Analytics & Sustainability Apple, Inc.Packaging Design Test Engineer - Analytics & SustainabilityAustin, TXJoin a diverse team helping to enhance customer experiences through innovative structural packaging while advancing Apple's sustainability goals. The role is dynamic, requiring great communication skills and the ability to work collaboratively in a fast-paced environment.#J-18808-Ljbffr.
NewPackaging Substrate Engineer Apple, Inc.Packaging Substrate EngineerAustin, TXOur Hardware Technology Packaging team invents, designs, develops, and integrates electronic packaging solutions for Apple's internal and custom external components of hardware for its consumer electronic products such as iPhone, iPad, Mac, Apple Watch, Apple TV etc. You will be responsible for Apple package substrate including design, technology, manufacturing, and reliability, and future roadmap; and work with cross-functional teams to achieve the best package performance.
NewLead Substrate Packaging Engineer Innovation & Roadmap Apple, Inc.Lead Substrate Packaging Engineer Innovation & RoadmapAustin, TXApple Inc. is seeking a qualified individual in Austin, Texas, to lead the development of SoC package substrate technologies for its hardware technology team. This role involves working with cross-functional groups and industry partners to optimize packaging solutions.