Packaging Module Development Engineer IntelPackaging Module Development EngineerChandler, ArizonaJob Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Arizona, Phoenix Additional Locations: Business group: Intel makes possible the most amazing experiences of the future. Master's degree with 3 or more years, or PhD degree with 0 years of experience in Mechanical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry, or a related technical field.
NewSenior Backend Packaging Engineer, Microdisplay SnapchatSenior Backend Packaging Engineer, MicrodisplayChandler, AZThe ideal candidate will have extensive experience with automated packaging equipment and strong problem-solving capabilities. The role involves process ownership for backend packaging, with responsibilities ranging from development to high-volume manufacturing.
NewPackaging Process Engineer - Microdisplay SwiftCruitPackaging Process Engineer - MicrodisplayChandler, AZ$142,000–$214,000 / yearThe Company's three core products are Snapchat, a visual messaging app that enhances your relationships with friends, family, and the world; Lens Studio, an augmented reality platform that powers AR across Snapchat and other services; and its AR glasses, Spectacles. Direct experience designing and optimizing automated production equipment for semiconductors or displaysDirect experience in final test for semiconductor or display packages.
Packaging Process Engineer – Microdisplay SnapPackaging Process Engineer – MicrodisplayChandler, ArizonaThe Company operates Snapchat , a visual messaging app that enhances your relationships with friends, family, and the world, and Specs Inc. , a wholly-owned subsidiary dedicated to making computing more human, in addition to Bitmoji , Saturn, and other digital services. Additionally you will: Own and optimize a backend packaging process for LCOS advanced displays, from early development through high-volume manufacturing, ensuring stable, high-yield output.
Advanced IC Packaging Engineer Powerlattice TechnologiesAdvanced IC Packaging EngineerChandler, ArizonaWe’re looking for a hands-on technical leader to pioneer industry-first packaging solutions that integrate power delivery chiplets directly into advanced substrates. Drive assembly process development, including novel flows for chiplet integration, substrate embedding, advanced interconnects and structure for reliability tests.
Silicon Packaging Design Engineer Intel CorpSilicon Packaging Design EngineerChandler, AZ$105,650–$200,340 / yearBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
NewIC Packaging Design Engineer Stellent IT LLCIC Packaging Design EngineerChandler, AZExperienceStrong hands‑on experience in Siemens (Mentor) Xpedition (XPD); alternatively: Cadence Allegro/Advanced Package Designer (APD / SiP)Candidates should have experience in the below domains:Physical Design & LayoutSubstrate design and layoutDesign for performance, manufacturability, yield, and reliability#J-18808-Ljbffr. Bachelor's or Master's degree in Electrical / Electronics Engineering is required.
NewSenior IC Packaging Design Engineer - Xpedition Expert Stellent IT LLCSenior IC Packaging Design Engineer - Xpedition ExpertChandler, AZThe ideal candidate should have 10+ years of senior-level experience, or 4–6 years with a Master's degree in IC packaging and design. Stellent IT LLC is seeking an experienced IC Packaging Design Engineer for a role based in Chandler, AZ, or Hillsboro, OR.
NewNight-Shift Substrates Packaging Engineer Advanced Tech IntelNight-Shift Substrates Packaging Engineer Advanced TechChandler, AZThe ideal candidate will have a Bachelor's degree in relevant engineering fields and at least one year of experience. This position requires supporting the manufacturing environment by addressing process and equipment issues during night shifts.
NewMechanical Design Engineer - Semiconductor Packaging IntelMechanical Design Engineer - Semiconductor PackagingChandler, AZ$105,650–$149,150 / yearBachelor's degree in mechanical engineering or a STEM‑related field of study.1+ year's experience with CAD tools such as SolidWorks, Siemens NX, AutoCAD or similar 2D and 3D CAD software. Job Summary We are seeking a proactive and detail‑oriented Mechanical Design Engineer to serve as a key point of contact for all collateral design activities supporting semiconductor packaging architecture.
NewSemiconductor Packaging Mechanical Design Engineer IntelSemiconductor Packaging Mechanical Design EngineerChandler, AZThis role will involve designing and developing mechanical components for semiconductor packaging, collaborating across teams, and addressing design challenges. The ideal candidate will have a Bachelor's degree in mechanical engineering, experience with CAD tools, and strong communication skills.
NewAdvanced Packaging Technology Development Substrates Module Engineer On-Shift (Nightshift) IntelAdvanced Packaging Technology Development Substrates Module Engineer On-Shift (Nightshift)Chandler, AZThis night‑shift, onsite position in Chandler, Arizona is responsible for supporting lot movement through the manufacturing line, responding to process excursions, recovering from equipment errors, dispositioning lots, enabling new tools, and performing other operational activities required to support factory objectives. Qualifications Minimum Qualifications:Bachelor's degree in Materials Engineering, Mechanical Engineering, Chemical Engineering, Chemistry, Physics, or a related discipline, with 1+ years of relevant experience OR Master's degree in one of the above disciplines with 0 years of relevant experience.
NewAdvanced Packaging Reliability Lab Engineer Intel CorpAdvanced Packaging Reliability Lab EngineerChandler, AZ$133,800–$188,890 / yearResponsibilities will include but not be limited to: - Characterization of equipment performance and response to excursions/issues - Continuous improvement of methods, specifications, and training - Development, analysis, and implementation of statistical process control - Translation of reliability stress analysis requirements into fixturing and development of new tools, systems, and other innovative solutions - Coordination of tool vendors and field service engineers - Collaboration with internal operations, planning, and facilities teams. Additional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly.
NewSenior Packaging Solutions Account Engineer IntelSenior Packaging Solutions Account EngineerChandler, AZThis position requires managing customer relationships, providing technical consultation, and collaborating with cross-functional teams to drive product developments. Intel Corporation is seeking an experienced professional for a role focusing on semiconductor packaging in Chandler, Arizona.
Advanced Packaging SI/PI Senior Staff Engineer Marvell Technology IncAdvanced Packaging SI/PI Senior Staff EngineerChandler, AZIn addition, the candidate will possess a bachelors degree in electrical engineering or related fields and 5+ years of related professional experience in package or PCB design, or masters degree and/or PhD in Electrical Engineering with coursework in signal integrity and power delivery with 3+ years of experience. To support fair and authentic hiring practices, candidates are not permitted to use AI tools (such as transcription apps, real-time answer generators like ChatGPT or Copilot, or automated note-taking bots) during interviews.
Advanced Packaging SI/PI Staff Engineer Marvell Technology IncAdvanced Packaging SI/PI Staff EngineerChandler, AZIn addition, the candidate will possess a bachelors degree in electrical engineering or related fields and 3+ years of related professional experience in package or PCB design, or masters degree and/or PhD in Electrical Engineering with coursework in signal integrity and power delivery with 2+ years of experience. To support fair and authentic hiring practices, candidates are not permitted to use AI tools (such as transcription apps, real-time answer generators like ChatGPT or Copilot, or automated note-taking bots) during interviews.
NewMicrodisplay Packaging Process Engineer - High-Yield Focus SwiftCruitMicrodisplay Packaging Process Engineer - High-Yield FocusChandler, AZThe ideal candidate has over 7 years of experience in process engineering, particularly with automated production equipment and is comfortable in an ISO 5 cleanroom environment. You'll drive process development from prototyping through production, ensuring high-yield, stable output.
ADCE Packaging Design Architect IntelADCE Packaging Design ArchitectChandler, ArizonaJob Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Arizona, Phoenix Additional Locations: US, California, Folsom, US, California, Santa Clara, US, Colorado, Fort Collins, US, Massachusetts, Beaver Brook, US, New Mexico, Albuquerque, US, Oregon, Hillsboro, US, Texas, Austin, US, Washington, Multiple Cities Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Experience in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP, Concept HDL, Sigrity), and/or Mentor Xpedition platform tools (PCB Layout/XPD, Designer, Hyperlynx).
Silicon Packaging Engineering Manager Intel CorpSilicon Packaging Engineering ManagerChandler, AZ$190,610–$269,100 / yearBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Minimum Qualifications: Bachelor's degree in Electrical Engineering or STEM related field with 9+ years of relevant experience OR- Master's degree in Electrical Engineering or STEM related field with 6+ years of relevant experience OR- PhD in Electrical Engineering or STEM related field with 4+ years of relevant experience.
Packaging Specialist Graham Packaging CompanyPackaging SpecialistCasa Grande, ArizonaFull timeWorking at Graham means you lead constructively with clear goals, use diverse thinking to drive excellence, accountability, innovation, as well as demonstrating collaboration, embracing learning, and taking action for continuous improvement and growth. Packaging Specialists are responsible for general housekeeping of the production area, case making, inspecting, and packing of finished product in accordance with established procedures, specifications and other guidelines.
Packaging Specialist - Day Shift (7:00am - 7:30pm) - Starting at $20.60/hr. - $24.95/hr. Graham Packaging CompanyPackaging Specialist - Day Shift (7:00am - 7:30pm) - Starting at $20.60/hr. - $24.95/hr.Casa Grande, Arizona$20.60–$24.95 / hourFull timeWorking at Graham means you lead constructively with clear goals, use diverse thinking to drive excellence, accountability, innovation, as well as demonstrating collaboration, embracing learning, and taking action for continuous improvement and growth. Packaging Specialists are responsible for general housekeeping of the production area, case making, inspecting, and packing of finished product in accordance with established procedures, specifications and other guidelines.
Packaging Specialist Verano Holdings CorpPackaging SpecialistAZWhile performing the duties of this job, the employee is frequently required to remain in a stationary position, move and/or position oneself, communicate, operate and/or prepare, place, position objects, tools, or controls. As a Packaging Specialist, you are responsible accurately weighing, packing, and labeling cannabis flower, infused edibles, and cannabis extracts for shipment to retail dispensaries.
Customer Program Manager, International Packaging Veritiv CorpCustomer Program Manager, International PackagingChandler, AZJob Responsibilities: SOW development, project planning, scheduling, progress tracking/monitoring, resource assignment, risk management, scope management, driving the teams, carrying out the projects against committed goals, managing project members and dependencies and presenting to internal teams and where needed, external partners. Work closely with adjacent functional groups such as Sales, Engineering, Supply Chain, Manufacturing, and Marketing to coordinate interdepartmental activities ensuring the completion of the project on schedule and within the customer parameters.
Test Module Development Engineer Intel CorpTest Module Development EngineerChandler, AZPrimary Focus: • Advanced semiconductor packaging technologies beyond conventional approaches • 3D packaging innovations and chiplet integration • High-performance computing packaging for data centers and AI applications • Heterogeneous integration across diverse chip technologies • Scaling packaging density while enhancing thermal and electrical performance. Test Module Development Engineer responsibilities include but are not limited to: • Executes test technology development and enablement for high-mix, low-volume testing and future technologies, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications.
ATD Experienced Laser Development Engineer IntelATD Experienced Laser Development EngineerChandler, ArizonaJob Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Arizona, Phoenix Additional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
ATD Laser Development Engineer IntelATD Laser Development EngineerChandler, ArizonaJob Type: College Grad Shift: Shift 1 (United States of America) Primary Location: US, Arizona, Phoenix Additional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.