161 Results for

Packaging Jobs in Foster City, CA

Jobs

SF, CA

$80,000–$120,000 / year
Full time

CONSIDERED EXPERIENCE INCLUDES: Field Service Technician Engineer Mechanic Tech Maintenance Install Repair Calibrate Maintain Processing & Packaging Equipment Machinery Automated Film Foil Pouchers Baggers Fillers Roasters Dry Friers Vacuum Fried Baked Snacks Potato Tortilla Chips French Fries Confection Nuts Molded Candy Molders #DiedreMoire #JobSearch #JobHunt #JobOpening #Hiring #Job #Jobs #Careers #Employment #jobposting #fieldeservicejobs #technicianjobs. Field Service Technician Engineer Mechanic Tech Maintenance Install Repair Calibrate Maintain Processing & Packaging Equipment Machinery Automated Film Foil Pouchers Baggers Fillers Roasters Dry Friers Vacuum Fried Baked Snacks Potato Tortilla Chips French Fries Confection Nuts Molded Candy Molders _.

28 days ago

Cupertino,, California

$50–$60 / hour
Contractor

li class="MsoNoSpacing" style="text-align:justify;margin:0in">Client’s approach to packaging is unique, so we value people who are eager to learn new skills and further improve their knowledge of packaging design, manufacturing processes, and sustainable materials.

Collaborate with crossfunctional teams including hardware, environmental, operations, and technology groups to refine and execute on the design on the packaging .

30+ days ago

Saratoga, CA

$200,000–$250,000 / year

Keywords: Advanced Packaging Engineer, Organic Substrates, CoWoS, TSMC, 2.5D Packaging, Flip Chip, SMT Assembly, Module Integration, Semiconductor Packaging, OSAT, Failure Analysis, Mechanical Modeling, High-Performance Computing, Networking Hardware, Saratoga CA. Responsibilities for the Advanced Packaging Engineer include: Own full lifecycle of system module packaging from architecture through high-volume production, including organic substrates, interposers, cooling, boards, and mechanical hardware.

24 days ago

Saratoga, CA

$210,000–$265,000 / year

p>Keywords: advanced packaging, flip‑chip, multi‑chip module, MCM, organic substrate, CoWoS, 2.5D, 3D packaging, TSMC system‑on‑wafer, OSAT, Wistron, module integration, cold plate integration, wafer‑level assembly, substrate technology, semiconductor packaging, high‑density interconnect, HDI substrates, yield improvement, semiconductor manufacturing, module engineering. The ideal Senior Packaging Engineer will lead advanced component and system‑level packaging efforts, with a strong emphasis on pcb assembly and organic substrate technologies on site in Saratoga, CA.

30+ days ago

Fremont, CA

Temporary

p style="font-family:'calibri' , sans-serif;font-size:11pt;margin-bottom:8pt;margin-left:0in;margin-right:0in;margin-top:0in">ManpowerGroup® (NYSE: MAN), the leading global workforce solutions company, helps organizations transform in a fast-changing world of work by sourcing, assessing, developing, and managing the talent that enables them to win.

About ManpowerGroup, Parent Company of: Manpower, Experis, Talent Solutions, and Jefferson Wells..

6 days ago

San Jose, CA
Axiado has also won numerous industry awards for our ground-breaking products and technological innovations, including being named one of Fast Companys 2025 Top 10 Most Innovative Companies in Security, winning the 2025 Global InfoSec Award for Outstanding AI Security Solution, and being named a finalist for the Global Semiconductor Alliances 2025 Start-Up to Watch award. We are a fast-growing, well funded silicon, systems, and solutions company pioneering a new category of semiconductor called the Trusted Control/Compute Unit (TCU) that combines advanced hardware security, AI driven resilience and efficiency, and real-time platform management.
30+ days ago

San Ramon, CA
$64,000–$85,000 / year
Rodan + Fields Dermatologists is a direct selling skincare company founded in 2000 by Dr. Katie Rodan and Dr. Kathy Fields, world-renowned dermatologists, and creators of Proactiv Solution with a passion for giving people the best skin of their lives - and the confidence that comes with it. With effective products, a unique business model and a powerful community of Independent Consultants, Rodan + Fields has disrupted the skincare category to become a leading skincare brand in North America.
30+ days ago

San Jose, CA
Astera Labs' Intelligent Connectivity Platform integrates CXL, Ethernet, NVLink, PCIe, and UALink semiconductor-based technologies with the company's COSMOS software suite to unify diverse components into cohesive, flexible systems that deliver end-to-end scale-up, and scale-out connectivity. We know that creativity and innovation happen more often when teams include diverse ideas, backgrounds, and experiences, and we actively encourage everyone with relevant experience to apply, including people of color, LGBTQ+ and non-binary people, veterans, parents, and individuals with disabilities.
30+ days ago

New
Santa Clara, CA
Qualification plans to characterize and validate packaging solutions for product and it's FRU (Field replaceable unit), subassemblies or components as per industry or internal specifications by working closely with HW design (mechanical, thermal, electrical etc.) Come out with innovative ideas for cost optimization, durability during shipping, environmental impact, and compliance with safety regulations. In this role, you'll combine technical expertise with innovative problem-solving to plan & execute all qualifications activities for cutting-edge packaging designs, ensuring they meet the stringent demands of all global shipping environments.
6 days ago

New
San Jose, CA
$190,000–$250,000 / year
p>Our product portfolio includes ZeroFlap (ZF) Active Electrical Cables (AECs) and ZF optical transceivers, OmniConnect memory solutions, and a suite of retimers and DSPs for optical and copper Ethernet and PCIe, all leveraging the PILOT diagnostic and analytics software platform. Our technology powers the most reliable and energy-efficient connections around the world - and our team powers new products and markets that come next.
3 days ago

San Ramon, CA
$84,000–$105,000 / year
Rodan + Fields Dermatologists is a direct selling skincare company founded in 2000 by Dr. Katie Rodan and Dr. Kathy Fields, world-renowned dermatologists, and creators of Proactiv Solution with a passion for giving people the best skin of their lives - and the confidence that comes with it. With effective products, a unique business model and a powerful community of Independent Consultants, Rodan + Fields has disrupted the skincare category to become a leading skincare brand in North America.
18 days ago

Santa Clara, CA
Minimum requirement of a bachelors degree in a relevant fieldMS or PhD preferred, with 3+ years of industry experience in package design and assembly process development of high-bandwidth and high-density memory packages. If you are driven to solve the industrys toughest packaging challenges, your work will have a profound and lasting impact on the products used by millions.
30+ days ago

Mountain View, CA
$200,000–$350,000 / year
div>
California pay range
$200,000—$350,000 USD

10+ years of experience on very high performance designs at advanced packaging like SIP, CoWoS, EMIB and other interposer technologies.

22 days ago

San Francisco, CA
li>
Knowledge of the product development process and experience related to various delivery system technologies (e.g., aerosol formulation, emulsion chemistry, gel formulation, polymer chemistry, reaction products, surfactants, solvents, builders).
In this role, youll help bring ideas from concept to self, developing new packaging, supporting line extensions, and driving technical innovation that keeps our products fresh, functional, and sustainable.
30+ days ago

Fremont, CA
$16.35–$33.65 / hour
p>Consider before submitting an application:
This position is expected to start August 2026 or September 2026 and continue through the Fall term (ending approximately December 2026 or later, if available).
Demonstrated ability to facilitate dynamic cross-functional projects with engineering, supply chain, manufacturing and test to meet project timelines.
30+ days ago

San Jose, CA
$130,850–$186,900 / year
With our continual goal of making Lumentum a best place to work for our employees, we strive to offer employees competitive total compensation packages, which may include annual bonus, commission for certain sales roles, equity, and health and welfare benefits. This role focuses on advanced mechanical and thermal packaging solutions for high-density, high-power optical modules, including pluggable form factors and emerging advanced packaging architectures.
30+ days ago

San Jose, CA
p>At Skyworks you will find a fast-paced environment with a strong focus on global collaboration minimal layers of management and the freedom to make meaningful contributions in a setting that encourages creative thinking.
Experience in package design and proficient in Cadence Allegro platform tools, PCB Editor, Advanced Package Designer, APDSiP, or Mentor Xpedition platform tools.
30+ days ago

Fremont, CA
$200,000–$280,000 / year
Our advanced optical, mechanical, electrical, and software design capabilities support the evolving needs of high-density, high-bandwidth, and flexible optical networks across telecom, datacom, hyperscale datacenters, artificial intelligence, and supercomputing. The position requires close collaboration with R&D and product design teams, manufacturing, suppliers, and customers to ensure laser components meet stringent optical, mechanical, and Telcordia reliability requirements.
21 days ago

Fremont, CA
$68–$78.37 / hour
li> Work cross-functionally with our Vehicle Engineering team, Supplier Quality organization, and Logistics team, making sure our packaging fulfills all internal customer needs. As our Packaging Engineer, you will be responsible for designing, testing, and improving the packaging used to transport our components from our supplier base to our distribution center, as well as the internal packaging within our facilities.
30+ days ago

New
San Jose, California
Learn more at www.analog.com and on LinkedIn and X.
For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls.

5 days ago

Santa Clara, CA
$133,500–$183,500 / year
If you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor.
The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members.
11 days ago

CA
In this highly visible role, you will develop Si photonics engine/chiplet packaging and co-packaging solutions utilizing advanced packaging technologies, define assembly baseline processes, decide package BOM, establish optical coupling design/manufacturing that are optimized for performance, reliability, yield and cost. Si photonics based optical engine package architecture / Package integration and drive micro-optical component assembly/interface characterization through Innovation Work with optical component vendors, foundry and OSAT to bring Si photonics packaging solution from concept to HVM.
30+ days ago

Milpitas, CA
ul>
An employee's pay position within the salary range may be based on several factors including but not limited to (1) relevant education; qualifications; certifications; and experience; (2) skills, ability, knowledge of the job; (3) performance, contribution and results; (4) geographic location; (5) shift; (6) internal and external equity; and (7) business and organizational needs.
Sandisk is looking for a Senior Packaging Industrial Designer to join global industrial design team to design 3D structural packaging solutions for world‑class consumer storage products.
30+ days ago

Milpitas, CA
$85,000–$120,000 / year
Our application, software, and industry teams work directly with leading Fortune 500 companies-including Lockheed Martin, Mercedes-Benz, Boehringer Ingelheim, and Mitsubishi Chemical-to prepare quantum solutions for real-world impact. Actual compensation may vary outside of these ranges and is dependent on various factors including but not limited to a candidate''s qualifications including relevant education and training, competencies, experience, geographic location, and business needs.
20 days ago

Santa Clara, CA
li>Partner with design, reliability, and architecture teams to evaluate tradeoffs (bump pitch, stack-ups, embedded Si, etc.) and lead test vehicle planning to meet program needs. As the position offered will have direct and/or indirect access to information, systems, or technologies subject to these laws, the offer may be contingent upon your citizenship/permanent residency status or ability to obtain prior license approval from the U.S. Commerce Department or applicable federal agency.
30+ days ago

Mountain View, CA
$163,000–$237,000 / year
li>Collaborate closely with Signal Integrity (SI), Power Integrity (PI), Test, New Product Introduction (NPI), and Mechanical Engineering teams to refine and optimize product package architecture and design.
Skip navigation links home Home work_outline Jobs noogler_hat Students google How we work handyman How we hire person_outline Your career help_outline Help.
30+ days ago

Sunnyvale, CA
From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Google Cloud, Google Global Networking, Data Center operations, systems research, and much more.
Utilize advanced Three-Dimensional/Two-Dimensional Computer-Aided Design software (SolidWorks, Artios CAD, Creo, etc.) to architect complex structural packaging solutions and generate precise technical drawings, assembly instructions, and cushion layouts.
30+ days ago

Palo Alto, CA
$20–$50 / hour
Knowledge of various manufacturing techniques including die bonding, wire bonding, solder dispensing & printing, reflow, plasma cleaning, encapsulation, plating, stamping, die-casting, injection molding, fastening, joining, and automated assembly processes to ensure designs are productionable. Develop Tesla custom power semiconductor packages (e.g., discrete and module) for electric vehicle and energy storage products utilizing SiC, GaN, or Si technology, as well as developing novel cooling and attachment methods for Power Electronics applications.
30+ days ago

San Jose, California
Learn more at www.analog.com and on LinkedIn and Twitter (X).
Requirements: Must have a Master’s degree in Mechanical Engineering, Materials Science, Electrical Engineering, Autonomy and Robotics Engineering, or related field (willing to accept a foreign education equivalent) and two (2) years of experience as a Packaging Engineer or related occupation conceptualizing and productizing semiconductor devices to bridge analog signals to digital Cloud.
30+ days ago

Mountain View, CA
$197,000–$285,000 / year
Aurora expects commitment to our safety policies from every employee, and seeks candidates who take an active responsibility, can contribute to building an atmosphere of trust, and invest in the organization's long-term success by prioritizing working safely, no matter what. Aurora hires talented people with diverse backgrounds who are ready to help build a transportation ecosystem that will make our roads safer, get crucial goods where they need to go, and make mobility more efficient and accessible for all.
30+ days ago

Santa Clara, CA
$64–$64 / hour
div>
We are looking for a Senior Electrical Engineer with deep expertise in semiconductor design, advanced packaging, and ASIC development.
What We Are Looking For
M.S. in Electrical or Computer Engineering (Ph.
8 days ago

San Jose, California
Successful candidate would collaborate with product design teams and technology development partners to understand future product needs and define a packaging roadmap that includes architecture, process definition, Design for Manufacturing (DFM) and Design for Yield (DFY) guidelines. Responsibilities:
The Role:
Advanced packaging technology leader driving packaging architecture across client, server, gaming and GPU products.
8 days ago

Santa Clara, CA
$97,630–$146,300 / year
Highlights include an employee stock purchase plan with a 2-year look back, family support programs to help balance work and home life, robust mental health resources to prioritize emotional well-being, and a recognition and service awards to celebrate contributions and milestones.
Expected Base Pay Range (USD) $97,630 - $146,300 per annum The successful candidate's starting base pay will be determined based on job-related skills, experience, qualifications, work location, and market conditions.
30+ days ago

Santa Clara, CA
The group focuses on signal integrity, power integrity, thermal integrity, mechanical integrity, high speed signaling and complex power delivery networks (PDNs) requiring innovative and custom solutions to meet constantly evolving customer needs. Highlights include an employee stock purchase plan with a 2-year look back, family support programs to help balance work and home life, robust mental health resources to prioritize emotional well-being, and a recognition and service awards to celebrate contributions and milestones.
30+ days ago

Cupertino, CA
In this highly visible role, you will own development, optimization and sustaining the advanced flip-chip BGA (FCBGA) assembly process from pathfinding, NPI through high-volume manufacturing by defining assembly baseline processes, deciding package BOM, establishing package design rules that are optimized for performance, reliability, yield and cost for a variety of projects including SoC.
Define and optimize end-to-end FCBGA assembly process flow (wafer back-end interface, flip-chip attach, underfill, lid/heat spreader attach, ball attach, singulation, final inspection).
30+ days ago

Sunnyvale, CA
We are a vertically integrated manufacturing company that develops innovative products for diversified applications in the industrial, optical communications, military, life sciences, semiconductor equipment, and consumer markets. Coherent provides a comprehensive career development platform within an environment that challenges employees to perform at their best, while rewarding excellence and hard work through a competitive compensation program.
30+ days ago

Los Gatos, CA
$388,000–$619,000 / year
p>The Ads Pricing and Packaging team is responsible for developing cutting-edge inventory management systems which support various monetization strategies, including dynamic pricing, rate card management, product packaging, inventory segmentation, and yield optimization.
Skills & experience we're seeking:
Professional experience in building inventory management solutions that support monetization strategies such as dynamic pricing, rate card management, product packaging, inventory split and yield management.
30+ days ago

Palo Alto, CA
$85,760–$197,160 / year
li>Owner of RFQ's and contract management - ensure Non-Disclosure Agreements, General Terms & Conditions, Piece Price Agreements, and other related contracts are negotiated, agreed and appropriately documented before business is initiated.
Along with competitive pay, as a full-time Tesla employee, you are eligible for the following benefits at day 1 of hire:
Aetna PPO and HSA plans > 2 medical plan options with $0 payroll deduction.
30+ days ago

Cupertino, CA
p>Collaborate with cross-functional teams including industrial design, hardware, environmental, operations, and technology groups to refine and execute on the design on the packaging. Apple's approach to packaging is unique, so we value people who are eager to learn new skills and further improve their knowledge of packaging design, manufacturing processes, and sustainable materials.
30+ days ago

Alameda, CA
$75,000–$106,500 / year
p>ESSENTIAL DUTIES/RESPONSIBILITIES:
Provide on-site/remote technical support for project activities such as commercial packaging, implementation/qualification of new packaging line equipment and introduction of components changes.
EDUCATION/EXPERIENCE/KNOWLEDGE & SKILLS:
Education:
Bachelor's degree in related discipline and a minimum of 1 year of related experience; or,
Equivalent combination of education and experience.
11 days ago

Palo Alto, California
Recent Press: https://www.eetimes.com/startup-boosts-scale-up-to-1000-gpus-in-a-single-domain/.
Select and design optimal multi‑die package types (MCM, 2.5D, 3D, fan‑out, CoWoS, InFO, CPC, CPO) balancing electrical performance, thermal behavior, cost, and manufacturability.
19 days ago

Milpitas, CA
li>Provide technical leadership in evaluating and validating design options through characterization builds and comprehensive DFX (Design for excellence) analyses, including DFM (Design for Manufacturability), DFA (Design for Assembly), DFRW (Design for Rework), influencing product architecture and manufacturing strategy at the system level.
ESSENTIAL DUTIES AND RESPONSIBILITIES:
Serve as the senior Package Engineering representative on cross‑functional leadership teams, setting technical direction and ensuring packages are fully characterized, qualified, and released to production on schedule while meeting stringent mechanical, electrical, performance, reliability, and quality requirements.
30+ days ago

Sunnyvale, CA
You will collaborate with product architects, design teams, and Signal Integrity/Power Integrity (SI/PI), thermal, mechanical, assembly, and Printed Circuit Board (PCB) engineers to create high-performance packages. As a Chip Packaging Architect on our Silicon Integration team, you will drive advanced packaging solutions (2.5D/3D/3.5D) and technologies for Machine Learning (ML) chips and custom Application-Specific Integrated Circuits (ASICs).
30+ days ago

New
Sunnyvale, CA
From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Google Cloud, Google Global Networking, Data Center operations, systems research, and much more. As an advanced packaging technologist, you will develop advanced packaging solutions (2.5D/3D/3.5D) for ML chips, which involves collaborating with architects, Signal Integrity (SI)/Power Integrity (PI), thermal, and Printed Circuit Board (PCB) engineers to create high-performance packages optimized for electrical performance, reliability, and assembly.
5 days ago

Santa Clara, CA
$220,320–$311,040 / year
p>Business group:
Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. With a focus on scalability, AI advancement, and shaping the future, we provide an unparalleled blend of an industry-leading technology, a rich IP portfolio, a world-class design ecosystem, and an operationally resilient global manufacturing supply chain.
30+ days ago

Santa Clara, CA
$160,980–$311,040 / year
Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
30+ days ago

Fremont, CA
$160,000–$175,000 / year
This role goes beyond traditional packaging design, focusing on end-to-end packaging systems, including returnable packaging, reverse logistics, cost modeling, and network-wide performance. Our talented worldwide teams are redefining how solar power plants are designed, built, and operated every day with smart technology, data-driven insights, and advanced automation.
30+ days ago

Santa Clara, CA
Experience with Material Characterization (ex; BH analyzer, VSM, SEM, EDX) • Experience in advanced co-packaged power modules • Preferred qualifications: • PhD in Electrical Engineering, Materials Science, or a related field with deep focus on magnetics and power packaging • System-level understanding of power delivery architectures, thermal management, EMI, and reliability constraints • In-depth understanding of magnetic materials: Ferrite materials (NiZn MnZn), metal materials (Fe, FeNi, FeSiCr, FeSiAl, amorphous & nano crystalline materials) • Familiarity with high-frequency magnetic material behavior, loss modeling, and reliability testing • Hands on knowledge of simulation tools and techniques like Maxwell, Ansys, Femtet, homogenization and model order reduction, optimization tools (NN, AI/ML) • Understanding of material processing: ceramic, metal powder and composite materials • Familiarity with inductor coil forming and termination processes: wire wounded, multilayer, metal composite, thin film, etc. Responsibilities may include: • Lead the definition, development and realization of comprehensive low-profile inductors, planar magnetics, and integrated passives roadmaps to enable ultra-compact, high-density, high current (100-300A) power delivery modules for enterprise and AI infrastructure.
30+ days ago

Resume Resources

Free Resume Templates Free Resume Builder

Get noticed by top employers!

Upload your resume to let employers know you're open to Packaging job opportunities. Plus, receive relevant job recommendations in your inbox.

Create A Free Account

Packaging Jobs in Foster City, CA

Field Mechanic - Snack Chip Cooking & Packaging Equipment - San Francisco, CA Diedre Moire Corp.

Product Design Engineer II Pinnacle Technical Resources

Advanced Packaging Engineer Zp Group Llc

Senior Packaging Engineer Zp Group Llc

Packaging Engineer Manpower Engineering

Senior IC Packaging Engineer Axiado Corp

Associate Packaging Engineer Rodan & Fields LLC

Photonic Packaging Engineer, Principal Astera Labs Inc

Packaging Engineer Nexthop Systems Inc

Principal Optical Packaging Engineer DustPhotonics Ltd

Packaging Engineer Rodan & Fields LLC

Memory Packaging Engineer Apple Inc

Advanced Packaging Engineer DensityAI

Sr. Associate, Packaging Engineer Method Products PBC

Internship, Packaging Engineer, Supply Chain (Fall 2026) Tesla Inc

Optic-Electronic Packaging Engineer Lumentum Operations LLC

Principal Packaging Engineer Skyworks Solutions Inc

Principal Packaging Engineer Koch Inc

Packaging Engineer Ursus, Inc.

Packaging Engineer Analog Devices

Staff Semi Packaging Engineer Analog Devices

Sr Packaging Engineer Applied Materials Inc

Silicon Photonics & Optical Packaging Engineer Apple Inc

Sr. Industrial Designer (Packaging) SanDisk Corp

Associate Optical Packaging Engineer PsiQuantum Corp

Advanced Packaging Process Engineer Tenstorrent Inc

Senior Packaging Design Engineer, Silicon Google LLC

Packaging Design Engineer Google LLC

Internship, Power Semiconductor Packaging Mechanical Design Engineer, Energy Engineering (Summer 2026) Tesla Inc

Senior Engineer, Semi Packaging Engineering Analog Devices

Laser Principal Packaging Engineer - Optical Solutions R&D Koch Inc

Senior Staff Optical Packaging Engineer Aurora Innovation Inc

Senior Electrical Engineer / Product Lead Advanced Semiconductor Packaging and Integration Macpower Digital Assets Edge Private Limited

Integrated Circuit - Packaging Architect Engineer Advanced Micro Devices, Inc

Advanced Packaging Engineer - SI/PI Marvell Technology Inc

Sr. Principal Engineer, Advanced Packaging Marvell Technology Inc

Packaging Assembly Engineer Apple Inc

Senior Fiber Optic Module Packaging Engineer II-VI Optical Systems, Inc.

Software Engineer 5 - Ads Pricing & Packaging Netflix Inc

Supplier Industrialization Engineer, IC Packaging, Power Electronics Tesla Inc

Packaging Product Design Engineer Apple Inc

Packaging Engineer I Exelixis Inc

Principal Packaging Engineer Delos Data

Technologist, Packaging Engineering SanDisk Corp

Chip Packaging Architect Google LLC

Advanced Packaging Technologist Google LLC

Foundry Services Advanced Packaging Account Technical Solutions Engineer Intel Corp

Senior Technical Solutions Engineer - Advanced Packaging Intel Corp

Sr. Packaging Engineer NEXTracker Inc

Packaging Engineer - Inductor and Power Module Texas Instruments Inc

Resume Resources

Similar Job Searches