Strong understanding of advanced packaging technologies, including heterogeneous integration, chiplet architectures, hybrid bonding, wafer-level packaging (WLP), panel-level packaging (PLP), 2.5D/3D integration, TSVs, redistribution layers (RDL), and advanced interconnect technologies. You will collaborate closely with leading semiconductor manufacturers, OSATs, IDM customers, and cross-functional teams across R&D, engineering, operations, and sales to define and commercialize differentiated solutions that address the rapidly evolving advanced packaging market.