NewPackaging Operator Anheuser-BuschPackaging OperatorTempe, AZ$22.80 / hourFrom our longstanding efforts to support American farmers, military, veterans, and first responders, to emergency drinking water donations and responsible drinking programs, we are guided by our commitment to the communities we call home and the 65,000 hardworking Americans who bring our beer to life. We are home to the nation’s most iconic beer and beyond beer brands, including Michelob ULTRA – America’s #1 top-selling beer – as well as Busch Light, Budweiser, Bud Light, Stella Artois, Cutwater Spirits, and industry-leading craft brands.
Packaging Engineer iMPact Business GroupPackaging EngineerTempe, AZAnalyzing engineering drawings and specifications to determine the required types of packaging materials and to maximize convenience, utility, and function based on the product's physical characteristics, safety, and special-handling requirements. Our client, a Global Leader in the Medical Device Industry, has an immediate opening for a R&D Packaging Engineer(Medical Products) for a 6-month + Contract.
NewSenior Medical Packaging Engineer StrykerSenior Medical Packaging EngineerTempe, ArizonaHowever, employees who have access to the compensation information of other employees or applicants as a part of their essential job functions cannot disclose the pay of other employees or applicants to individuals who do not otherwise have access to compensation information, unless the disclosure is (a) in response to a formal complaint or charge, (b) in furtherance of an investigation, proceeding, hearing, or action, including an investigation conducted by the employer, or (c) consistent with the contractor’s legal duty to furnish information. Bachelor’s degree in Engineering, Packaging Engineering, Mechanical Engineering, Biomedical Engineering or related disciplines.
Packaging Engineer JBL ResourcesPackaging EngineerTempe, AZJBL Resources is proud to have earned the reputation of being a premier provider of top talent professionals in the fields of engineering, human resources, logistics, operations, and supply chain management. Working here means joining a team of top technical professionals bringing cutting-edge products to the forefrontoffering driven individuals the opportunity to make a meaningful impact every day.
Packaging Engineer Mount IndiePackaging EngineerTempe, ArizonaThis role is responsible for planning, designing, and delivering innovative packaging solutions across a range of technologies, including integrated circuits (ICs), system-in-package (SiP), sub-assemblies, and modules. You will own the full packaging lifecycle—from concept and definition through design, modeling, testing, and production release—while partnering closely with cross-functional engineering teams and external vendors.
Package Layout Design Engineer , Annapurna Labs - AI Silicon Packaging Amazon.com IncPackage Layout Design Engineer , Annapurna Labs - AI Silicon PackagingTempe, AZIn this role, you will execute package layout tasks from floor planning through tape out and manufacturing release, working closely with senior engineers, SI/PI, thermal, and manufacturing teams to deliver production-ready designs that meet performance, density, and reliability targets. Perform RDL and substrate routing for high-density interconnects including microbumps, C4 bumps, TSVs, microvias, and PTH vias across multi-layer organic substrates or silicon interposers.
Silicon Packaging Design Engineer Intel Corp.Silicon Packaging Design EngineerPhoenix, AZ$105,650–$200,340 / yearBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Senior Packaging Engineer-Phoenix AZ-Hybrid Roth Staffing CompaniesSenior Packaging Engineer-Phoenix AZ-HybridGuadalupe, Arizona$0–$61.86 / hourAnalyzes engineering drawings and specifications to determine the required type of packaging materials and to maximize convenience, utility and function based on the product's physical characteristics, safety and special-handling requirements. Our collaborative culture, focus on continuous improvement, and passion for making a meaningful impact set us apart as an employer of choice within the industry.
Packaging Module Development Engineer Intel CorpPackaging Module Development EngineerChandler, AZ$99,030–$188,890 / yearMinimum Qualifications: Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, Physics/Applied Physics, Chemical Engineering, or a related STEM field with 1+ years of relevant experience. Job Details: Job Description: The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms.
Packaging Module Equipment Development Engineer Intel CorpPackaging Module Equipment Development EngineerChandler, AZ$133,800–$188,890 / yearThe Packaging Module Development Engineer will contribute to advancing technology and foundry capabilities by: Developing First Level/Second Level Interconnect (FLI/SLI), Thermal solutions (TIM1), and SMT/PCB technologies to support Intel's future packaging platforms. Job Details: Job Description: Job Description: The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms.
Senior Director, Global Structural Design and Packaging Sustainability IgnitelySenior Director, Global Structural Design and Packaging SustainabilityGlendale, ArizonaWork closely with Brand, Marketing, Brand Design, Sales, Operations, Compliance, and Product Development teams to understand and subsequently translate through hands-on innovative designing the marketing and promotional strategy, messaging, and creative objectives into finished packages, and ensure optimal process flow from manufacture of components through filling and assembly. Define and execute a packaging road map, development and brand strategy integration that drives best in class packaging from concept through production release, including packaging development, technology development, design for manufacturing, cost and reliability.
Advanced Packaging Reliability Lab Engineer IntelAdvanced Packaging Reliability Lab EngineerChandler, ArizonaJob Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Arizona, Phoenix Additional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Responsibilities will include but not be limited to: - Characterization of equipment performance and response to excursions/issues - Continuous improvement of methods, specifications, and training - Development, analysis, and implementation of statistical process control - Translation of reliability stress analysis requirements into fixturing and development of new tools, systems, and other innovative solutions - Coordination of tool vendors and field service engineers - Collaboration with internal operations, planning, and facilities teams Qualifications:
Semiconductor Packaging Modeling and Simulation Engineer onsemiSemiconductor Packaging Modeling and Simulation EngineerScottsdale, AZWith a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. As a semiconductor packaging modeling and simulation engineer, you will have the opportunities to support new power module development and new product design, assembly and process, quality and reliability, and customers in worldwide.
(Senior) Member of Technical Staff / Director, Process Engineering, Advanced Packaging ASM International NV(Senior) Member of Technical Staff / Director, Process Engineering, Advanced PackagingPhoenix, AZYoull lead a team of experts working on advanced thermal films compatible with rapidly evolving demands of advanced packaging and heterogenous integration, leveraging ALD/PEALD, CVD/PECVD, and related technologies to turn forward looking roadmaps into manufacturable solutions. Collaborate closely with customers, Account Technology Directors, Product Management, and Business Development to align on high thermal conductivity materials roadmaps with customer device and packaging strategies.
Packaging Equipment Development Group Lead IntelPackaging Equipment Development Group LeadChandler, Arizona$180,770–$255,200 / yearThis group focuses on developing industry-leading packaging solutions to support Intel's product roadmap, fostering innovation, optimizing manufacturing equipment, and enabling high-volume production. In this role, you will oversee new equipment introductions, ensure seamless integration of equipment and processes, and lead your team in solving complex challenges to deliver world-class manufacturing solutions.
Senior Engineer, Packaging Engineering Apidel TechnologiesSenior Engineer, Packaging EngineeringTempe, AZContractorAnalyzes engineering drawings and specifications to determine the required type of packaging materials and to maximize convenience, utility and function based on the product's physical characteristics, safety and special-handling requirements. This is an individual contributor role that requires the use of judgement in applying professional expertise and is expected to work independently with minimal supervision.
Substrate Packaging Defect Metro Tool Owner Intel Corp.Substrate Packaging Defect Metro Tool OwnerPhoenix, AZ$103,730–$198,820 / yearDirect next-generation tool installation, reaching major milestones-purchase-spec development, source inspection, design, pre-fac, Safety level approval, Supplier qual, Intel qual, etc.-by collaborating with diverse stakeholders. In this role, you will help drive innovation in EMIB-T, glass core, EMIB scaling, and panel-level packaging technologies for substrate as well as assembly test mfg (ATM) factories for Intel's IPG and IFS customers.
Kitchen Packaging Technician Lead JARS CannabisKitchen Packaging Technician LeadPhoenix, AZFull timeRole Overview:The Kitchen Packaging Technician Lead oversees all evening packaging operations, ensuring products are packaged accurately, eciently, and in full compliance with Arizona Department of Health Services (ADHS) regulations and Title 9, Chapter 18 (Arizona Administrative Code for marijuana facilities). Inventory & Workflow Management: Manage packaging materials, monitor stock levels, and ensure smooth workflow through production stages.
Principal Engineer, Electrical Engineering – Advanced Packaging ASMPrincipal Engineer, Electrical Engineering – Advanced PackagingPhoenix, ArizonaThe Principal Electrical Engineer is a technical leader responsible for defining, designing, and governing the electrical architecture of advanced semiconductor packaging equipment (etch, deposition, etc.). With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving.
(Senior) Member of Technical Staff / Director, Process Engineering, Advanced Packaging ASM(Senior) Member of Technical Staff / Director, Process Engineering, Advanced PackagingPhoenix, ArizonaYou’ll lead a team of experts working on advanced thermal films compatible with rapidly evolving demands of advanced packaging and heterogenous integration, leveraging ALD/PEALD, CVD/PECVD, and related technologies to turn forward looking roadmaps into manufacturable solutions. · Collaborate closely with customers, Account Technology Directors, Product Management, and Business Development to align on high thermal conductivity materials roadmaps with customer device and packaging strategies.