Packaging Associate Flow DistributionPackaging AssociatePhoenix, AZPackaging and manufacturing responsibilities including, but not limited to, counting, sorting, labeling, sealing, boxing, and taping products according to SOPs. Flow Distribution is seeking motivated and detail-oriented Packaging Associates to join our Manufacturing and Packaging team for an immediate start.
Kitchen Float – Packaging, Production & Prep JARS CannabisKitchen Float – Packaging, Production & PrepPhoenix, AZ$18–$21 / hourFull timeThe Kitchen Float will work across multiple kitchen stations, supporting packaging, production, and prep tasks as needed. This is an excellent opportunity to gain hands-on experience in packaging, production, and prep while growing your skills in a supportive environment.
Senior Director, Pricing & Packaging Gainsight, Inc.Senior Director, Pricing & PackagingAZ$215,000–$230,000 / yearThis is a great opportunity for someone who thrives in a highly strategic, data-driven SaaS environment and enjoys working cross-functionally with teams like Product, Sales, Finance, Marketing, and Customer Success. In this role, you'll play a key role in driving Gainsight's monetization strategy and long-term revenue growth by leading the evolution of pricing and packaging across its product portfolio, including the transition to usage- and value-based models.
Packaging Engineer iMPact Business GroupPackaging EngineerTempe, AZAnalyzing engineering drawings and specifications to determine the required types of packaging materials and to maximize convenience, utility, and function based on the product's physical characteristics, safety, and special-handling requirements. Our client, a Global Leader in the Medical Device Industry, has an immediate opening for a R&D Packaging Engineer(Medical Products) for a 6-month + Contract.
NewPackaging Module Development Engineer Intel CorpPackaging Module Development EngineerChandler, AZ$133,800–$188,890 / yearMaster's degree with 3 or more years, or PhD degree with 0 years of experience in Mechanical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry, or a related technical field. Harnessing the capability of the cloud, the ubiquity of the Internet of Things, the latest advances in memory and programmable solutions, and the promise of always-on 5G connectivity, Intel is disrupting industries and solving global challenges.
NewSilicon Packaging Engineering Manager IntelSilicon Packaging Engineering ManagerPhoenix, AZJob Overview Intel Foundry is seeking a highly experienced IC Packaging Design Manager to lead the delivery of advanced packaging solutions within the Advanced Design and Customer Engineering (ADCE) organization. In this role, you will act as a trusted technical partner to customers, enabling successful adoption of Intel's advanced packaging technologies (EMIB, Foveros, chiplet architectures).Responsibilities
Silicon Packaging Design Engineer Intel CorpSilicon Packaging Design EngineerPhoenix, AZ$105,650–$200,340 / yearBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
NewIC Packaging Design Engineer Stellent IT LLCIC Packaging Design EngineerChandler, AZExperienceStrong hands‑on experience in Siemens (Mentor) Xpedition (XPD); alternatively: Cadence Allegro/Advanced Package Designer (APD / SiP)Candidates should have experience in the below domains:Physical Design & LayoutSubstrate design and layoutDesign for performance, manufacturability, yield, and reliability#J-18808-Ljbffr. Bachelor's or Master's degree in Electrical / Electronics Engineering is required.
NewSenior IC Packaging Design Engineer - Xpedition Expert Stellent IT LLCSenior IC Packaging Design Engineer - Xpedition ExpertChandler, AZThe ideal candidate should have 10+ years of senior-level experience, or 4–6 years with a Master's degree in IC packaging and design. Stellent IT LLC is seeking an experienced IC Packaging Design Engineer for a role based in Chandler, AZ, or Hillsboro, OR.
Sr. Package Layout Engineer, Annapurna Labs - AI Silicon Packaging Amazon.com IncSr. Package Layout Engineer, Annapurna Labs - AI Silicon PackagingTempe, AZPerform detailed RDL and substrate routing for high-density interconnects including microbumps, C4 bumps, TSVs, microvias, and PTH vias across multi-layer organic substrates and silicon interposers. You"ll drive the physical implementation of complex multi-die and advanced packaging architectures, working closely with silicon, SI/PI, thermal, and manufacturing teams to deliver production-ready designs that meet dynamic performance, density, and reliability targets.
Advanced Packaging Supplier Technology Development Program Manager Intel CorpAdvanced Packaging Supplier Technology Development Program ManagerPhoenix, AZ$133,800–$255,200 / yearBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. This is a hands-on position that requires extensive work with supplier teams (through F2F meetings with local reps, phone/Teams meetings, and international travel to supplier factories), internal integration teams, and process module engineering teams to achieve new capacity qualification and ramp production on-time.
Packaging Technician Grow SciencesPackaging TechnicianPhoenix, AZFull timeMaintains the highest level of cleanliness and sanitation inside the processing area and participates in the clean-up of equipment and the workplace at the end of every shift. This role is responsible for product and loss tracking, ensuring products are packaged and accounted for in accordance with company policy and state regulations.
NewMechanical Design Engineer - Semiconductor Packaging IntelMechanical Design Engineer - Semiconductor PackagingPhoenix, AZ$105,650–$149,150 / yearJob Type:Experienced Hire## Shift:Shift 1 (United States of America)## Primary Location:US, Arizona, Phoenix## Additional Locations:## Business group:Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. With a legacy of relentless innovation and a commitment to bring smart, connected devices to every person on Earth, our diverse and brilliant teams are continually searching for tomorrow's technology and revel in the challenge that changing the world for the better brings.
Packaging Engineer JBL ResourcesPackaging EngineerTempe, AZJBL Resources is proud to have earned the reputation of being a premier provider of top talent professionals in the fields of engineering, human resources, logistics, operations, and supply chain management. Working here means joining a team of top technical professionals bringing cutting-edge products to the forefrontoffering driven individuals the opportunity to make a meaningful impact every day.
Packaging Graphics Production Lead The WebstaurantStore IncPackaging Graphics Production LeadPhoenix, AZThis person is the single point of ownership for print-ready packaging files - from redesign planning and DAM governance through factory submission, vendor coordination, and cost forecasting. The Packaging Graphics Production Lead owns the end-to-end production, governance, and project management of packaging graphics across our Private Label brands and product lines.
Head of Pricing and Packaging Cable One Inc.Head of Pricing and PackagingPhoenix, AZFull timeThe Head of Pricing and Packaging will own enterprise‑wide pricing and packaging strategy across our consumer product portfolio, partnering closely with Product, Finance, Marketing, Sales, and Operations to drive revenue growth, margin discipline, and customer value. Cable One and our family of brands appreciates the role our associates play to help the company grow, and in return an excellent benefits package is offered to our associates to recognize the importance of their contributions, such as: Medical, dental, and vision plans - start when you start!
2nd Shift Packaging Material Handler Campbell's2nd Shift Packaging Material HandlerGoodyear, ArizonaOther duties that may be performed by the Material Handler are, but not limited to: safe housekeeping, keeping work areas clean; storing supplies in designated areas; keeping aisles/exits clear and free from obstructions; removing trash from work area floor; following instructions for safe lifting/carrying of various sizes, shapes, and weights. Our portfolio includes the iconic Campbell’s brand, as well as Cape Cod, Chunky, Goldfish, Kettle Brand, Lance, Late July, Pacific Foods, Pepperidge Farm, Prego, Pace, Rao’s Homemade, Snack Factory, Snyder’s of Hanover.
NewSenior Packaging Architect Substrate & IC Integration Dormont Manufacturing CompanySenior Packaging Architect Substrate & IC IntegrationPhoenix, AZ$220,920–$311,890 / yearDormont Manufacturing Co in Phoenix, Arizona is searching for a seasoned engineer specializing in substrate design and semiconductor packaging. Annual salary ranges from $220,920 to $311,890, reflecting your skills and location.#J-18808-Ljbffr.
NewSilicon Packaging Design Engineer Dormont Manufacturing CompanySilicon Packaging Design EngineerPhoenix, AZ$105,650–$200,340 / yearAs a key contributor to Intel's cutting-\u2018edge technology, you will play a pivotal role in bridging silicon and hardware design, optimizing package performance, and delivering high-impact solutions that meet performance, cost, and manufacturability goals. Job DescriptionIntel seeks a motivated and innovative Silicon Packaging Design Engineer to join our team, driving the end-to-end development of silicon interposer and bridge designs that define the future of computing and connectivity.
ADCE Packaging Design Architect Intel CorpADCE Packaging Design ArchitectPhoenix, AZ$220,920–$311,890 / yearBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Experience in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP, Concept HDL, Sigrity), and/or Mentor Xpedition platform tools (PCB Layout/XPD, Designer, Hyperlynx).
Semiconductor Packaging Modeling and Simulation Engineer onsemiSemiconductor Packaging Modeling and Simulation EngineerScottsdale, AZWith a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. As a semiconductor packaging modeling and simulation engineer, you will have the opportunities to support new power module development and new product design, assembly and process, quality and reliability, and customers in worldwide.
NewSemiconductor Packaging Mechanical Design Engineer IntelSemiconductor Packaging Mechanical Design EngineerChandler, AZThis role will involve designing and developing mechanical components for semiconductor packaging, collaborating across teams, and addressing design challenges. The ideal candidate will have a Bachelor's degree in mechanical engineering, experience with CAD tools, and strong communication skills.
NewAdvanced Packaging Technology Development Substrates Module Engineer On-Shift (Nightshift) IntelAdvanced Packaging Technology Development Substrates Module Engineer On-Shift (Nightshift)Phoenix, AZ$99,030–$139,810 / yearJob TypeExperienced HireShiftShift 4 (United States of America)Primary LocationUS, Arizona, PhoenixBusiness GroupIntel Foundry strives to make every facet of semiconductor manufacturing state‑of‑the‑art while delighting our customers — from delivering cutting‑edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. This role is responsible for supporting lot movement through the manufacturing line, responding to process excursions, recovering from equipment errors, dispositioning lots, enabling new tools, and performing other operational activities required to support factory objectives.
NewPackaging Equipment Engineer: Innovate & Optimize IntelPackaging Equipment Engineer: Innovate & OptimizePhoenix, AZIntel Corporation is seeking a Packaging Module Equipment Development Engineer in Phoenix, Arizona. This role involves developing and optimizing assembly processes and technologies.
NewSenior Mechanical Tooling Engineer - Advanced Packaging IntelSenior Mechanical Tooling Engineer - Advanced PackagingPhoenix, AZIntel is seeking a highly motivated Mechanical Tooling Engineer in Phoenix, Arizona, to define, design, and deploy tooling solutions for advanced semiconductor packaging. Qualified candidates will possess a master's degree in Mechanical Engineering or related fields, with 4+ years of experience, or a Ph.
NewMechanical Tooling Engineer Advanced Packaging Tools IntelMechanical Tooling Engineer Advanced Packaging ToolsPhoenix, AZThe ideal candidate will hold a master's degree in a relevant field with at least 4 years of experience, particularly in tooling and mechanical engineering. Intel Corporation is seeking a Mechanical Tooling Engineer in Phoenix, Arizona to drive technology development for advanced semiconductor packaging.
NewMechanical Packaging Design Engineer - Semiconductor IntelMechanical Packaging Design Engineer - SemiconductorPhoenix, AZThis role focuses on designing and developing mechanical components and tooling, collaborating with cross-functional teams, and ensuring design manufacturability. Candidates should have a Bachelor's degree in mechanical engineering, familiarity with CAD tools like SolidWorks, and strong communication skills.
NewSenior Silicon Packaging Design Engineer IntelSenior Silicon Packaging Design EngineerPhoenix, AZ$105,650–$200,340 / yearThis position offers competitive pay, stock bonuses, and a comprehensive benefits package, with a salary ranging from $105,650 to $200,340 annually.#J-18808-Ljbffr. This role involves designing and implementing silicon interposers and collaborating with various teams to optimize system designs.
NewSenior Packaging Solutions Account Engineer IntelSenior Packaging Solutions Account EngineerChandler, AZThis position requires managing customer relationships, providing technical consultation, and collaborating with cross-functional teams to drive product developments. Intel Corporation is seeking an experienced professional for a role focusing on semiconductor packaging in Chandler, Arizona.
NewSenior Packaging Solutions Engineer - Key Account Lead IntelSenior Packaging Solutions Engineer - Key Account LeadPhoenix, AZThe successful candidate will manage customer relationships, provide technical solutions for semiconductor packaging, and collaborate across teams. A leading semiconductor company seeks a Packaging and Test Account Technical Solutions Engineer in Phoenix, AZ.
NewGlobal Packaging Supplier Tech Development Lead IntelGlobal Packaging Supplier Tech Development LeadPhoenix, AZThe successful candidate will need to facilitate technical transfers, handle project execution, and manage supplier relationships while ensuring on-time delivery and quality. Intel Corporation is looking for a qualified candidate to join the Advanced Packaging Substrate Integration Team in Phoenix, Arizona.
NewSemiconductor Packaging Yield Engineer IntelSemiconductor Packaging Yield EngineerChandler, AZThis role focuses on substrate packaging solutions, requiring a Bachelor's or Master's degree in relevant engineering fields with at least 1 year of experience. Intel Corporation is seeking an experienced hire for its Advanced Packaging Team in Arizona.
NewPackaging Design Engineer: Substrate Layout & Interconnects IntelPackaging Design Engineer: Substrate Layout & InterconnectsPhoenix, AZThis role involves end-to-end development of substrate designs, collaboration with silicon and hardware teams, and ensuring optimal cost efficiency and manufacturability. Ideal candidates will have a relevant Bachelor's or Master's degree and 1+ years of experience in microelectronic package design or PCB layout.
NewAdvanced Packaging Reliability Lab Engineer Intel CorpAdvanced Packaging Reliability Lab EngineerChandler, AZ$133,800–$188,890 / yearResponsibilities will include but not be limited to: - Characterization of equipment performance and response to excursions/issues - Continuous improvement of methods, specifications, and training - Development, analysis, and implementation of statistical process control - Translation of reliability stress analysis requirements into fixturing and development of new tools, systems, and other innovative solutions - Coordination of tool vendors and field service engineers - Collaboration with internal operations, planning, and facilities teams. Additional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly.
NewPackaging Modeling & Simulation Engineer (Digital Twin) OnsemiPackaging Modeling & Simulation Engineer (Digital Twin)Scottsdale, AZ$146,970–$249,780 / yearThis role involves conducting thermal-mechanical simulations for microelectronic packaging and improving modeling methodologies. A competitive salary ranging from $146,970 to $249,780 is offered along with a comprehensive benefits package.#J-18808-Ljbffr.
Advanced Packaging SI/PI Staff Engineer Marvell Technology IncAdvanced Packaging SI/PI Staff EngineerChandler, AZIn addition, the candidate will possess a bachelors degree in electrical engineering or related fields and 3+ years of related professional experience in package or PCB design, or masters degree and/or PhD in Electrical Engineering with coursework in signal integrity and power delivery with 2+ years of experience. To support fair and authentic hiring practices, candidates are not permitted to use AI tools (such as transcription apps, real-time answer generators like ChatGPT or Copilot, or automated note-taking bots) during interviews.
Advanced Packaging SI/PI Senior Staff Engineer Marvell Technology IncAdvanced Packaging SI/PI Senior Staff EngineerChandler, AZIn addition, the candidate will possess a bachelors degree in electrical engineering or related fields and 5+ years of related professional experience in package or PCB design, or masters degree and/or PhD in Electrical Engineering with coursework in signal integrity and power delivery with 3+ years of experience. To support fair and authentic hiring practices, candidates are not permitted to use AI tools (such as transcription apps, real-time answer generators like ChatGPT or Copilot, or automated note-taking bots) during interviews.
NewPackaging Process Engineer - Microdisplay SwiftCruitPackaging Process Engineer - MicrodisplayChandler, AZ$142,000–$214,000 / yearThe Company's three core products are Snapchat, a visual messaging app that enhances your relationships with friends, family, and the world; Lens Studio, an augmented reality platform that powers AR across Snapchat and other services; and its AR glasses, Spectacles. Direct experience designing and optimizing automated production equipment for semiconductors or displaysDirect experience in final test for semiconductor or display packages.
Packaging Operator Brewers CollectivePackaging OperatorTempe, ArizonaFrom our longstanding efforts to support American farmers, military, veterans, and first responders, to emergency drinking water donations and responsible drinking programs, we are guided by our commitment to the communities we call home and the 65,000 hardworking Americans who bring our beer to life. We are home to the nation’s most iconic beer and beyond beer brands, including Michelob ULTRA – America’s #1 top-selling beer – as well as Busch Light, Budweiser, Bud Light, Stella Artois, Cutwater Spirits, and industry-leading craft brands.
(Senior) Member of Technical Staff / Director, Process Engineering, Advanced Packaging ASM International NV(Senior) Member of Technical Staff / Director, Process Engineering, Advanced PackagingPhoenix, AZYoull lead a team of experts working on advanced thermal films compatible with rapidly evolving demands of advanced packaging and heterogenous integration, leveraging ALD/PEALD, CVD/PECVD, and related technologies to turn forward looking roadmaps into manufacturable solutions. Collaborate closely with customers, Account Technology Directors, Product Management, and Business Development to align on high thermal conductivity materials roadmaps with customer device and packaging strategies.
Packaging Process Engineer - Microdisplay Snap IncPackaging Process Engineer - MicrodisplayChandler, AZ$142,000–$214,000 / yearThe Company's three core products are Snapchat, a visual messaging app that enhances your relationships with friends, family, and the world; Lens Studio, an augmented reality platform that powers AR across Snapchat and other services; and its AR glasses, Spectacles. Develop, qualify, and sustain assembly and packaging recipes, control plans, and SPC systems, driving continuous improvement in CD/overlay, defectivity, yields, and reliability.
Packaging Operator Anheuser-Busch InBev SA/NVPackaging OperatorTempe, AZFrom our longstanding efforts to support American farmers, military, veterans, and first responders, to emergency drinking water donations and responsible drinking programs, we are guided by our commitment to the communities we call home and the 65,000 hardworking Americans who bring our beer to life. COMPANY: We are home to the nation's most iconic beer and beyond beer brands, including Michelob ULTRA - America's #1 top-selling beer - as well as Busch Light, Budweiser, Bud Light, Stella Artois, Cutwater Spirits, and industry-leading craft brands.
NewPackaging Module Equipment Development Engineer Dormont Manufacturing CompanyPackaging Module Equipment Development EngineerPhoenix, AZ$115,110–$219,550 / yearEstablishes material specifications for contract assemblers and raw material vendors and interfaces with supplier quality and procurement teams to ensure material quality and vendor performance requirements are met through strict adherence to process specifications and existing product qualification methods. Minimum Qualifications:Possess a Bachelor's degree plus 7yrs of experience, ORMaster's degree plus 3yrs of experience, ORPhD degree plus 6+ months of experience in Engineering, Physics, Chemistry or related field.
NewPackaging Module Development Engineer Dormont Manufacturing CompanyPackaging Module Development EngineerPhoenix, AZ$115,110–$219,550 / yearMinimum QualificationsPhD degree in Mechanical Engineering, Materials Science, Electrical Engineering, Physics / Applied Physics, or a related field; ORMaster's degree in mechanical engineering, Materials Science, Electrical Engineering, Physics / Applied Physics, or a related field. Job Description:The Packaging Module Development Engineer will contribute to advancing technology and foundry capabilities by:Developing First Level/Second Level Interconnect (FLI/SLI) and Thermal solutions to support Intel's future packaging platforms.
Packaging Process Engineer – Microdisplay SnapPackaging Process Engineer – MicrodisplayChandler, ArizonaThe Company operates Snapchat , a visual messaging app that enhances your relationships with friends, family, and the world, and Specs Inc. , a wholly-owned subsidiary dedicated to making computing more human, in addition to Bitmoji , Saturn, and other digital services. Additionally you will: Own and optimize a backend packaging process for LCOS advanced displays, from early development through high-volume manufacturing, ensuring stable, high-yield output.
NewPower Integrity Intern: IC Packaging & Analysis IntelPower Integrity Intern: IC Packaging & AnalysisPhoenix, AZThe ideal candidate will be pursuing a Master's or PhD in Electrical Engineering and should have experience with circuit simulation tools. Intel Corporation in Phoenix, Arizona is seeking a Power Integrity / Delivery Electrical Analysis Engineer Intern.
Customer Program Manager, International Packaging Veritiv CorpCustomer Program Manager, International PackagingChandler, AZJob Responsibilities: SOW development, project planning, scheduling, progress tracking/monitoring, resource assignment, risk management, scope management, driving the teams, carrying out the projects against committed goals, managing project members and dependencies and presenting to internal teams and where needed, external partners. Work closely with adjacent functional groups such as Sales, Engineering, Supply Chain, Manufacturing, and Marketing to coordinate interdepartmental activities ensuring the completion of the project on schedule and within the customer parameters.
Packaging Technician Connected Careers PagePackaging TechnicianPhoenix, AZConnected/Alien labs Packaging Technicians play a crucial role in the production and distribution process by ensuring that products are securely and efficiently packaged for shipping or retail display. With over 11 years experience, Connected specializes in breeding, growing, manufacturing, and distributing top-shelf cannabis through its state-of-the-art facilities and proprietary genetics.
Packaging Associate Gummi WorldPackaging AssociateChandler, ArizonaWe’re currently hiring Packaging Line Operators and Team Members who are excited to grow with us, thrive in a collaborative environment, and take pride in producing products that make a difference in people’s lives. Set up, operate, and monitor packaging machinery (bottle fillers, cappers, labelers, sealers, pouch fillers, etc.).
Production Packaging Associate - 3rd Shift Altium Packaging LPProduction Packaging Associate - 3rd ShiftPhoenix, AZResponsibilities include, but are not limited to the following: Demonstrates safe work practices by wearing correct PPE and following safety policies. The Production Packaging Associate is an entry level position, responsible for proper packaging of materials and finished products.