Sr. Packaging Engineer Tesla IncSr. Packaging EngineerAustin, TXThe successful candidate must have the ability to work quickly and efficiently with a high level of precision, have strong interpersonal and communication skills, be detail oriented, and not afraid to re-define tradition. Tesla is seeking a highly motivated Packaging Engineer to join our Packaging team in developing world-class designs for automation equipment.
Packaging engineer Info Way Solutions LLCPackaging engineerAustin, TXsuccessful candidate must have the ability to work quickly and efficiently with a high level of precision, have strong interpersonal and communication skills, be detail oriented, and not afraid to re-define. • Apply industrial design techniques of CAD, technical drawings, including datum structure, GD&T and tolerance stack up analysis.
NewSenior FCBGA Packaging Engineer for SoC NPI to Volume Apple, Inc.Senior FCBGA Packaging Engineer for SoC NPI to VolumeAustin, TXThe position offers competitive challenges in a dynamic environment focused on cutting-edge technologies.#J-18808-Ljbffr. A leading technology company in Austin, Texas is seeking an IC Packaging Assembly Engineer.
Silicon Photonics & Optical Packaging Engineer Apple IncSilicon Photonics & Optical Packaging EngineerAustin, TXIn this highly visible role, you will develop Si photonics engine/chiplet packaging and co-packaging solutions utilizing advanced packaging technologies, define assembly baseline processes, decide package BOM, establish optical coupling design/manufacturing that are optimized for performance, reliability, yield and cost. Si photonics based optical engine package architecture / Package integration and drive micro-optical component assembly/interface characterization through Innovation Work with optical component vendors, foundry and OSAT to bring Si photonics packaging solution from concept to HVM.
NewSenior Multiphysics IC Packaging Engineer University of Texas at AustinSenior Multiphysics IC Packaging EngineerAustin, TXA prestigious educational institution in Austin, Texas is seeking an experienced professional for a role in semiconductor packaging involving multiphysics simulations and interconnect modeling. This role involves collaboration with engineering teams and vendors to develop and refine simulation workflows.
Sr. Thermal & Mechanical Packaging Engineer, Annapurna Labs Amazon.com IncSr. Thermal & Mechanical Packaging Engineer, Annapurna LabsAustin, TXYou develop from the lowest levels of circuit design to large system design including thermal and mechanical solutions and see those systems all the way through to high volume manufacturing. You'll provide leadership in the application of new technologies to large scale server deployments in a continuous effort to deliver a world-class customer experience.
NewSenior IC Packaging & SoC Integration Engineer Apple, Inc.Senior IC Packaging & SoC Integration EngineerAustin, TXThe role involves collaboration across teams to meet stringent performance specs while fostering a diverse and inclusive work environment.#J-18808-Ljbffr. We seek candidates with a strong background in semiconductor packaging, proven problem-solving abilities, and expertise in advanced packaging techniques.
Integrated Circuit - Packaging Architect Engineer Advanced Micro Devices, IncIntegrated Circuit - Packaging Architect EngineerAustin, TexasSuccessful candidate would collaborate with product design teams and technology development partners to understand future product needs and define a packaging roadmap that includes architecture, process definition, Design for Manufacturing (DFM) and Design for Yield (DFY) guidelines. Education : BS/MS/PhD in Material Science, Mechanical Engineering, Computer Science, Applied Mathematics, Electrical Engineering or equivalent This role is not eligible for visa sponsorship.
Packaging Engineer I YETI CoolersPackaging Engineer IAustin, TexasWork cross functionally with Program Managers, Product Managers, Design & Industrial Engineering, Marketing, Merchandising, Sourcing, Operations, International team members, packaging and manufacturing suppliers to execute on-time packaging solutions. As a Packaging Engineer, you will support the design and development of premium out-of-box experiences for YETI products while considering performance, sustainability, and cost; ensuring YETI packaging delivers our premium brand aesthetic throughout its full lifecycle.
Senior Packaging Designer Dell Technologies IncSenior Packaging DesignerAustin, TXThe Senior Packaging Designer will collaborate closely with Industrial Designers, Packaging Engineers, CMF teams, the Brand team, Software team and other partners to interpret design requirements and execute cohesive solutions. Develop high-quality design assets across packaging, product interfaces, marketing, and communications, including graphics, branded elements, wallpapers, and digital content such as short-form videos and animations.
Mechanical Engineer, Packaging Engineering Tesla IncMechanical Engineer, Packaging EngineeringAustin, TXYou will serve as a highly technical contributor on the team responsible for design, optimization, prototyping and validation of new ways to deliver components safely and efficiently throughout our supply chain and manufacturing processes. Tesla is seeking a highly motivated Mechanical Design Engineer to join our Vehicle Packaging team in developing world-class designs for use in high volume automation equipment.
NewSr. Signal & Power Integrity Engineer, Annapurna Labs - AI Silicon Packaging AmazonSr. Signal & Power Integrity Engineer, Annapurna Labs - AI Silicon PackagingAustin, TX$183,000–$247,600 / yearExperience analyzing and modeling decoupling technologies including on‑die MOM/MOS capacitors, deep trench capacitors (DTCs), and IPD capacitors within the package PDN.Proficiency in stack‑up design and impedance control for multi‑layer organic substrates and silicon interposers. Knowledge of package co‑design methodologies (chip‑package‑board co‑simulation).Experience with high‑density fan‑out or silicon bridge packaging (e.g., EMIB, CoWoS, or similar).Experience with PDN target impedance methodology and frequency‑domain decoupling optimization across die, package, and board domains.
Packaging Engineer I YETI Coolers, LLCPackaging Engineer IAustin, TXWork cross functionally with Program Managers, Product Managers, Design & Industrial Engineering, Marketing, Merchandising, Sourcing, Operations, International team members, packaging and manufacturing suppliers to execute on-time packaging solutions. As a Packaging Engineer, you will support the design and development of premium out-of-box experiences for YETI products while considering performance, sustainability, and cost; ensuring YETI packaging delivers our premium brand aesthetic throughout its full lifecycle.
Advanced Packaging Engineer - SI/PI Marvell Technology IncAdvanced Packaging Engineer - SI/PIAustin, TX$97,630–$146,300 / yearHighlights include an employee stock purchase plan with a 2-year look back, family support programs to help balance work and home life, robust mental health resources to prioritize emotional well-being, and a recognition and service awards to celebrate contributions and milestones. Expected Base Pay Range (USD) $97,630 - $146,300 per annum The successful candidate's starting base pay will be determined based on job-related skills, experience, qualifications, work location, and market conditions.
NewLead Substrate Packaging Engineer Innovation & Roadmap Apple, Inc.Lead Substrate Packaging Engineer Innovation & RoadmapAustin, TXApple Inc. is seeking a qualified individual in Austin, Texas, to lead the development of SoC package substrate technologies for its hardware technology team. This role involves working with cross-functional groups and industry partners to optimize packaging solutions.
NewPackaging Assembly Engineer Apple, Inc.Packaging Assembly EngineerAustin, TXIn this highly visible role, you will own development, optimization and sustaining the advanced flip-chip BGA (FCBGA) assembly process from pathfinding, NPI through high-volume manufacturing by defining assembly baseline processes, deciding package BOM, establishing package design rules that are optimized for performance, reliability, yield and cost for a variety of projects including SoC.Description Responsible to lead packaging assembly technology development. Responsibilities Define and optimize end‑to‑end FCBGA assembly process flow (wafer back‑end interface, flip‑chip attach, underfill, lid/heat spreader attach, ball attach, singulation, final inspection).Develop and maintain process documentation including process specs, work instructions, control plans, PFMEA, and process flow diagrams.
NewAI Automation Design Packaging Lead Advanced Micro Devices IncAI Automation Design Packaging LeadAustin, TXTHE PERSON: The successful candidate must be a proven leader and a technical innovator who can bridge the gap between physical design requirements and software automation to generate AI driven workflows. THE ROLE: We are looking for a forward-thinking candidate to drive and lead the team for the development and deployment of next-generation packaging design automation and AI-Driven workflows.
Test Engineer, Packaging Product Design Apple IncTest Engineer, Packaging Product DesignAustin, TXThe Packaging PD team is a diverse group of people responsible for the design and execution of structural packaging for all Apple products, from shippers to finished goods boxes. Apple's approach to packaging is unique, so we value people who are eager to learn new skills and further improve their knowledge of packaging design, manufacturing processes, and sustainable materials.
NewPackaging Product Design Engineer Apple, Inc.Packaging Product Design EngineerAustin, TXThe Packaging PD team is a diverse group of people responsible for the design and execution of structural packaging for all Apple products - from shippers to finished goods boxes. Apple's approach to packaging is unique, so we value people who are eager to learn new skills and further improve their knowledge of packaging design, manufacturing processes, and sustainable materials.
Package Layout Design Engineer , Annapurna Labs - AI Silicon Packaging Amazon.com IncPackage Layout Design Engineer , Annapurna Labs - AI Silicon PackagingAustin, TXIn this role, you will execute package layout tasks from floor planning through tape out and manufacturing release, working closely with senior engineers, SI/PI, thermal, and manufacturing teams to deliver production-ready designs that meet performance, density, and reliability targets. Perform RDL and substrate routing for high-density interconnects including microbumps, C4 bumps, TSVs, microvias, and PTH vias across multi-layer organic substrates or silicon interposers.
Foundry Services Advanced Packaging Account Technical Solutions Engineer Intel CorpFoundry Services Advanced Packaging Account Technical Solutions EngineerAustin, TX$220,320–$311,040 / yearBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. With a focus on scalability, AI advancement, and shaping the future, we provide an unparalleled blend of an industry-leading technology, a rich IP portfolio, a world-class design ecosystem, and an operationally resilient global manufacturing supply chain.
IC Packaging Simulation Engineer Apple IncIC Packaging Simulation EngineerTXIn this role, you will be working on stress and deformation simulation of IC packages to provide a comprehensive understanding of chip-package interaction and package-board interaction to ensure good device yield and reliability. Numerical modeling of the stress and deformation of component packages to provide a comprehensive understanding of chip-package interaction and package-board interaction to ensure good device yield and reliability.
NewIC Packaging Simulation Engineer Stress & AI Modeling Apple, Inc.IC Packaging Simulation Engineer Stress & AI ModelingAustin, TXA technology company in Austin, Texas, is seeking a Packaging Simulation Engineer skilled in FEM simulation with experience in ANSYS and ABAQUS. The role involves numerical modeling of IC packages and scripting CAD/FEM software to enhance product development and reliability.
NewSystem Packaging Design & Validation Engineer Apple, Inc.System Packaging Design & Validation EngineerAustin, TXApple Inc. in Austin, Texas is seeking a qualified individual to develop and validate packaging designs for future products. The ideal candidate will have a Bachelor's degree in Physics or a related field, along with 4 years of experience.
NewSignal & Power Integrity Engineer, Annapurna Labs - AI Silicon Packaging AmazonSignal & Power Integrity Engineer, Annapurna Labs - AI Silicon PackagingAustin, TXBasic Qualifications BS degree in electrical engineering or equivalent5+ years of experience in signal integrity, power integrity, or package designSolid understanding of either SI (S-parameter extraction, crosstalk, return loss, channel analysis) or PI (PDN impedance analysis, IR drop, decoupling strategy), with working awareness of the otherExperience with EM simulation and SI/PI tools such as HFSS, Cadence Sigrity (PowerSI, PowerDC, Clarity), ADS, or equivalentUnderstanding of advanced packaging technologies: 2.5D/3D-IC, silicon interposers, fan-out wafer-level packaging, RDL, TSVs, and microbump interconnectsFamiliarity with stack-up design and impedance control for multi-layer organic substrates or silicon interposers. Run high-speed channel simulations (S-parameter extraction, time-domain analysis, eye diagrams) for die-to-die and die-to-board interfaces, or analyze package PDN performance (decoupling effectiveness, plane resonance, IR drop, AC impedance).Model advanced interconnects: microbumps, C4 bumps, TSVs, microvias, PTH vias, and RDL traces for signal or power paths.
NewMechanical Integration Engineer - Electronics & Sensor Packaging NightDragon AcquisitionMechanical Integration Engineer - Electronics & Sensor PackagingAustin, TXA leading defense technology firm located in Austin, Texas is seeking a Mechanical Integration Engineer to drive the integration of complex mechanical and electrical systems. The ideal candidate will have a Bachelor's degree in Mechanical or Aerospace Engineering and over 2 years of relevant experience.
NewSI/PI Engineer Advanced 2.5D/3D Packaging AmazonSI/PI Engineer Advanced 2.5D/3D PackagingAustin, TXA leading cloud solutions provider in Austin, Texas is seeking a Signal or Power Integrity Engineer to enhance packaging solutions for cutting-edge machine learning applications. Ideal candidates will have a BS in Electrical Engineering, with 5+ years of relevant experience, and proficiency in signal and power integrity evaluation.
NewLead SI/PI Engineer for Advanced 2.5D/3D Packaging Insight GlobalLead SI/PI Engineer for Advanced 2.5D/3D PackagingAustin, TXIdeal candidates will have over 12 years of experience, strong expertise in EDA tools, and the ability to mentor junior engineers. A leading technical recruitment firm is seeking a Principal Signal & Power Integrity Engineer in Austin, TX.
NewDesign Engineer I-II or Senior: 3D Packaging Innovator University of Texas at AustinDesign Engineer I-II or Senior: 3D Packaging InnovatorAustin, TXThis role involves designing innovative semiconductor circuits and collaborating across teams to ensure effective packaging solutions. Located in Austin, Texas, this position offers competitive salaries with many employee benefits, emphasizing a supportive, research-driven environment.
NewMechanical Integration Engineer - Electronics Packaging Dormont Manufacturing CompanyMechanical Integration Engineer - Electronics PackagingAustin, TXThis role involves integrating complex subsystems within mechanical assemblies, focusing on electronics packaging and ensuring reliable integration. The position offers comprehensive medical and dental insurance, PTO, retirement plans, and stock options, fostering a collaborative and innovative work environment.#J-18808-Ljbffr.
NewPackaging Substrate Engineer Apple, Inc.Packaging Substrate EngineerAustin, TXOur Hardware Technology Packaging team invents, designs, develops, and integrates electronic packaging solutions for Apple's internal and custom external components of hardware for its consumer electronic products such as iPhone, iPad, Mac, Apple Watch, Apple TV etc. You will be responsible for Apple package substrate including design, technology, manufacturing, and reliability, and future roadmap; and work with cross-functional teams to achieve the best package performance.
NewPackaging Design Test Engineer - Analytics & Sustainability Apple, Inc.Packaging Design Test Engineer - Analytics & SustainabilityAustin, TXJoin a diverse team helping to enhance customer experiences through innovative structural packaging while advancing Apple's sustainability goals. The role is dynamic, requiring great communication skills and the ability to work collaboratively in a fast-paced environment.#J-18808-Ljbffr.
NewSenior SI/PI Engineer - 3D IC Packaging University of Texas at AustinSenior SI/PI Engineer - 3D IC PackagingAustin, TXA prominent educational institute in Austin is looking for a Principal Signal Power Integrity Engineer to lead comprehensive analysis for advanced heterogeneous integration packages. The ideal candidate will have over 12 years of relevant experience and work closely with EDA vendors on cutting-edge technology while mentoring junior engineers.
Integrated Circuit Packaging Architect Advanced Micro Devices IncIntegrated Circuit Packaging ArchitectAustin, TXSuccessful candidate would collaborate with product design teams and technology development partners to understand future product needs and define a packaging roadmap that includes architecture, process definition, Design for Manufacturing (DFM) and Design for Yield (DFY) guidelines. The Role: Advanced packaging technology leader driving packaging architecture across client, server, gaming and GPU products.
NewSenior AI Silicon Packaging Layout Engineer AmazonSenior AI Silicon Packaging Layout EngineerAustin, TX$136,000–$184,000 / yearThe role involves executing package layout tasks across the design cycle, including die floor planning and substrate design. Amazon offers competitive salaries ranging from $136,000 to $184,000 annually, with comprehensive benefits.#J-18808-Ljbffr.
NewSI/PI Engineer for AI Packaging & 2.5D/3D-IC AmazonSI/PI Engineer for AI Packaging & 2.5D/3D-ICAustin, TXResponsibilities include performing detailed simulations, supporting package design, and collaborating with engineers to ensure performance and manufacturing targets. In this role, you'll contribute to SI/PI analysis and optimization for cutting-edge machine learning and data center solutions.
Packaging Designer, Amazon & Whole Foods Market Private Brands, Brand and Sustainability Amazon.com IncPackaging Designer, Amazon & Whole Foods Market Private Brands, Brand and SustainabilityAustin, TXReporting to the Creative Director of Package Design, you"ll own and drive the development and evolution of packaging systems across both Whole Foods Market and Amazon private label brands, helping shape how customers experience our products across stores, digital channels, and multiple retail formats. Based at Whole Foods Market HQ in Austin, TX, this role supports a growing portfolio of Whole Foods Market and Amazon private brands, spanning multiple categories, tiers, and customer experiences.
Packaging Sourcing Specialist Woodbolt Distribution LLCPackaging Sourcing SpecialistAustin, TXThe company's disruptive and innovative products compete in the Functional Beverage and Active Nutrition segments, under three consumer-loved brands: C4 (one of the fastest-growing energy drink brands in the United States and the #1 selling global pre-workout brand), XTEND (the #1 post-workout recovery brand in the United States), and Cellucor (an award-winning sports nutrition brand created in 2002). Since its founding 20 years ago, Nutrabolt has set out to meet the discerning needs of performance athletes and fitness enthusiasts, while appealing beyond this core group to include consumers around the globe who are making healthy, active living a daily priority.
NewLead Power Density Engineer - Inverter & Packaging Enphase EnergyLead Power Density Engineer - Inverter & PackagingAustin, TX$130,000–$226,000 / yearThis role involves leading a multi-disciplinary team to enhance energy efficiency and reduce losses in power converter systems. Enphase Energy, Inc. is seeking a hands-on leader to drive power density innovations in Austin, Texas.
Supply Chain Manager, Packaging & Logistics Tesla IncSupply Chain Manager, Packaging & LogisticsAustin, TXThis is a cross-functional role that involves data collection from logistics, planning, packaging and other stakeholders to model, scope high value cost reduction opportunities and responsible for accelerated execution of logistics optimization opportunities identified. Tesla is seeking a motivated, experienced, and knowledgeable Supply Chain Program Manager to support optimization of logistics, warehousing and material flow costs through packaging and supply chain improvements.
NewLead Process Engineer, Advanced Packaging Line LutronLead Process Engineer, Advanced Packaging LineAustin, TXA leading manufacturer of innovative lighting solutions in Austin is seeking an Engineering Process Owner to elevate the Ketra packaging line. Responsibilities include monitoring production metrics, leading process improvements, and collaborating with engineering teams.
NewThermal-Mechanical Packaging Simulation Engineer Dormont Manufacturing CompanyThermal-Mechanical Packaging Simulation EngineerAustin, TXThe role entails leading advanced thermal and mechanical simulations for semiconductor packages and collaborating with various technical teams. Candidates should have a BS in relevant engineering fields and several years of experience in multiphysics simulations.
Packaging Engineering Intern - Fall Fab2Packaging Engineering Intern - FallAustin, TexasDesign and iterate on machines and subsystems for semiconductor packaging fabrication, such as laser ablation machines, reflow ovens, and automated metal plating facilities. We are a small team engaged in end-to-end process development and integration work for semiconductor packaging processes, providing exposure to interesting work that is hard to find at larger companies.
NewStrategic Packaging Sourcing & Cost Optimization Woodbolt Distribution, LLCStrategic Packaging Sourcing & Cost OptimizationAustin, TXQualified candidates will have a Bachelor's degree in a relevant field and at least 2 years of experience in packaging or supply chain roles. Woodbolt Distribution, LLC is seeking a skilled supply chain professional to manage packaging materials and sourcing strategies.
Packaging Sales Executive Enhance RecruitingPackaging Sales ExecutiveAustin, TXStay connected to local market trends, key industries (energy, food & beverage, industrial manufacturing), and competitive landscape. Own and grow a Austin/San Antonio-based territory through aggressive prospecting and relationship development across manufacturing, logistics, and distribution clients.
Strategic Sourcing Manager- Foundry and Advanced Packaging Advanced Micro Devices IncStrategic Sourcing Manager- Foundry and Advanced PackagingAustin, TXPREFERRED EXPERIENCE: Extensive Foundry or Semiconductor experience (specific to post fab and advanced packaging service offerings is ideal) Strong Engineering background is a plus Strong Negotiation and Sourcing skills Supply Chain Management (SCM) familiarity Experience working in an engineering or semiconductor company Understanding of regional and global markets and cultures. Develop the global procurement strategy for foundry with specific focus on post fab and advanced packaging; implementing a supplier development program that has a coordinated long-term approach on cost, quality, and service.
NewIC Packaging & Integration Lead Drive Innovative Solutions Apple, Inc.IC Packaging & Integration Lead Drive Innovative SolutionsAustin, TXA leading technology company based in Austin, Texas, is seeking an IC Packaging Engineering Lead to drive innovative packaging solutions and collaborate with cross-functional teams. The role requires a BS degree and 20+ years of relevant industry experience, with strong skills in semiconductor packaging design and managerial capabilities.
Project Manager, WWGS Marketing Operations - Packaging Amazon.com IncProject Manager, WWGS Marketing Operations - PackagingAustin, TXLead strategic planning for macro-level packaging initiatives (rebrands, new brand creation, portfolio-wide refreshes) with detailed project plans, milestones, and risk mitigation strategies. Whole Foods Market and Amazon Fresh are part of Worldwide Grocery Stores (WWGS), delivering quality food and innovative shopping experiences to customers across multiple brands and channels.
Senior Packaging Sales Representative Enhance RecruitingSenior Packaging Sales RepresentativeAustin, TXGrow sales through: Cold calling and developing relationships with prospective accounts, closing on opportunities with prospects to turn them into customers, and growing the business within customers. SUMMARY We are seeking an experienced, results-driven Senior Packaging Sales Rep in Austin area for a Texas-based leading wholesale packaging distributor.
NewAdvanced Packaging Technologist Advanced Micro DevicesAdvanced Packaging TechnologistAustin, TXDevelop and maintain mechanical and multi-physics models (structural, thermo-mechanical, electro-thermal and electro-optical) & drive validation strategies partnering with internal and external labs as required to enable STCO across silicon, package, board and platform. The Role In this role, you will serve as a PCB-centric Mechanical Modeling Architect responsible for defining and driving next-generation packaging-platform architectures through rigorous, model-based decision making and System-Technology Co-Optimization (STCO).