NewPrincipal Packaging Integration Engineer GlobalFoundries IncPrincipal Packaging Integration EngineerEssex Junction, VT$85,000–$146,000 / yearThe candidate will bring a strong focus on tool-process interactions for each step in a SiPh Flip Chip assembly, with focus on product and module reliability, package risk factors, packaging design rules, materials selection criteria, definition of electrical, photonic and thermal stress plan for chiplet and product module reliability qualifications. Summary of Role: GlobalFoundries (GF) seeks a hands-on Assembly Process Integration Engineer that will deliver industry leading electro-optical transceivers using GF's Photonix platform and advanced packaging 2.5D and 3D co-packaged optics form factors meeting customer requirements.
NewPrincipal Packaging Design Integration Engineer GlobalFoundries IncPrincipal Packaging Design Integration EngineerEssex Junction, VT$85,000–$146,000 / yearThe candidate will bring a strong focus on thermal, mechanical, electrical, and optical chip package co-design, with a focus on product and module performance, reliability, packaging design rules, materials selection criteria, and definition of electrical, photonic and thermal requirements for chiplet and product modules. Summary of Role: GlobalFoundries (GF) seeks a hands-on Assembly Integration Design Engineer that will deliver industry leading electro-optical transceivers using GF's Photonix platform and advanced packaging 2.5D and 3D co-packaged optics form factors.
Advanced Packaging Process Integration Engineer GlobalFoundries IncAdvanced Packaging Process Integration EngineerEssex Junction, VT$143,000–$247,000 / yearAbout GlobalFoundries: GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world's most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets.
MTS Packaging Integration Engineer GlobalFoundries IncMTS Packaging Integration EngineerEssex Junction, VTIt is expected that options for optical fiber attach will include detachable fiber optic couplers, grating couplers, edge couplers, passive V-groove, and 3D MEMs spot size converters which must be compatible with 3D electrical interconnect solutions including Copper RX, Copper uPillar, chip-on-wafer hybrid bonding and wafer-to-wafer hybrid bonding. • Provides tools and complex analysis of quality issues and associated financial implications • Protects the business by ensuring that all necessary requirements are met and that the technology performs to the expectations of customers and market to avoid costly re-designs.
NewAdvanced Packaging Si/Pi Senior Engineer MarvellAdvanced Packaging Si/Pi Senior EngineerBurlington, VTHighlights include an employee stock purchase plan with a 2-year look back, family support programs to help balance work and home life, robust mental health resources to prioritize emotional well-being, and a recognition and service awards to celebrate contributions and milestones. BS degree in a technical field (Electrical Engineering, Computer Engineering, or related) with coursework or hands-on exposure to signal integrity and power delivery concepts with 3+ years of relatable experience OR.
SMTS Photonics Advanced Packaging Integration GlobalFoundries IncSMTS Photonics Advanced Packaging IntegrationEssex Junction, VT$107,400–$204,500 / yearAbout GlobalFoundries: GlobalFoundries (GF) is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world's most inspired technology companies. Summary of Role: As a Photonic Packaging Engineer within GF's APPC, you will lead the development and sustainment of advanced optical packaging solutions for silicon photonics (SiPh) and co-packaged optics (CPO) platforms.
PMTS Silicon Photonics Packaging Integration GlobalFoundries IncPMTS Silicon Photonics Packaging IntegrationEssex Junction, VTAbout GlobalFoundries: • GlobalFoundries (GF) is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the worlds most inspired technology companies. Summary of Role: As a Photonic Packaging Engineer within GFs APPC, you will lead the development and sustainment of advanced optical packaging solutions for silicon photonics (SiPh) and co-packaged optics (CPO) platforms.
Smts Photonics Advanced Packaging Integration Global FoundriesSmts Photonics Advanced Packaging IntegrationEssex Junction, VT$107,400–$204,500 / yearAbout GlobalFoundries: GlobalFoundries (GF) is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world's most inspired technology companies. Summary of Role: As a Photonic Packaging Engineer within GF's APPC, you will lead the development and sustainment of advanced optical packaging solutions for silicon photonics (SiPh) and co-packaged optics (CPO) platforms.
Pmts Silicon Photonics Packaging Integration Global FoundriesPmts Silicon Photonics Packaging IntegrationEssex Junction, VT$131,900–$241,500 / yearAbout GlobalFoundries: GlobalFoundries (GF) is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world's most inspired technology companies. Summary of Role: As a Photonic Packaging Engineer within GF's APPC, you will lead the development and sustainment of advanced optical packaging solutions for silicon photonics (SiPh) and co-packaged optics (CPO) platforms.
PMTS Photonics Packaging Design Integration GlobalFoundries IncPMTS Photonics Packaging Design IntegrationEssex Junction, VT$131,900–$241,500 / yearFocus on product and module performance, reliability, packaging design rules, materials selection criteria, definition of electrical, photonic and thermal definition for chiplet and product modules as well as reliability qualification approaches. Summary of Role: As a Photonic Packaging Design Integration Engineer within GF's APPC, you will lead the development and sustainment of advanced optical packaging solutions for silicon photonics (SiPh) and co-packaged optics (CPO) platforms.
Pmts Photonics Packaging Design Integration Global FoundriesPmts Photonics Packaging Design IntegrationEssex Junction, VT$131,900–$241,500 / yearFocus on product and module performance, reliability, packaging design rules, materials selection criteria, definition of electrical, photonic and thermal definition for chiplet and product modules as well as reliability qualification approaches. Summary of Role: As a Photonic Packaging Design Integration Engineer within GF's APPC, you will lead the development and sustainment of advanced optical packaging solutions for silicon photonics (SiPh) and co-packaged optics (CPO) platforms.
Advanced Packaging Si/Pi Senior Staff Engineer MarvellAdvanced Packaging Si/Pi Senior Staff EngineerBurlington, VTIn addition, the candidate will possess a bachelor's degree in electrical engineering or related fields and 5+ years of related professional experience in package or PCB design, or master's degree and/or PhD in Electrical Engineering with coursework in signal integrity and power delivery with 3+ years of experience. Highlights include an employee stock purchase plan with a 2-year look back, family support programs to help balance work and home life, robust mental health resources to prioritize emotional well-being, and a recognition and service awards to celebrate contributions and milestones.
Photonics Packaging Characterization Engineer (2026 New College Graduate) GlobalFoundries IncPhotonics Packaging Characterization Engineer (2026 New College Graduate)Essex Junction, VT$65,400–$145,800 / yearThe candidate will bring a strong focus on assembly packaging inspection and characterization methods for SiPh Flip Chip packaging, including siph wafer level packaging features (v-grooves, cavities, bumps, RDL), assembly components (optical lens arrays, fibers, sockets, lids), and assembly process features (underfill fillets, chip edges). Essential Responsibilities: Develop and lead advanced inspection & characterization workflows for photonics packaging, including AOI, warpage analysis, and metrology across all assembly stages (die attach, underfill, lid attach, socket placement, fiber plug integration).
Advanced Packaging Cryogenic Modeling Engineer GlobalFoundries IncAdvanced Packaging Cryogenic Modeling EngineerEssex Junction, VT$118,000–$239,000 / yearThe engineer will leverage commercial multi-physics tools to build, correlate, and apply models that capture low-temperature material property behavior and thermo-mechanical effects (e.g., thermal contraction and CTE mismatch) to guide device, integration, and cryogenic 3DHI advanced packaging optimizations for mechanical, thermal, and/or electrical performance. About GlobalFoundries: GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the worlds most inspired technology companies.
Principal Advanced Packaging Design Engineer MarvellPrincipal Advanced Packaging Design EngineerBurlington, VTThe group focuses on signal integrity, power integrity, thermal integrity, mechanical integrity, processability, manufacturability, and reliability, involving high speed signaling and complex power delivery networks (PDNs) requiring innovative and custom solutions to meet constantly evolving customer needs. Highlights include an employee stock purchase plan with a 2-year look back, family support programs to help balance work and home life, robust mental health resources to prioritize emotional well-being, and a recognition and service awards to celebrate contributions and milestones.
Advanced Packaging SI/PI Senior Staff Engineer Marvell Technology IncAdvanced Packaging SI/PI Senior Staff EngineerBurlington, VTIn addition, the candidate will possess a bachelors degree in electrical engineering or related fields and 5+ years of related professional experience in package or PCB design, or masters degree and/or PhD in Electrical Engineering with coursework in signal integrity and power delivery with 3+ years of experience. To support fair and authentic hiring practices, candidates are not permitted to use AI tools (such as transcription apps, real-time answer generators like ChatGPT or Copilot, or automated note-taking bots) during interviews.
Packaging Associate - Day Shift AstenJohnson IncPackaging Associate - Day ShiftWilliston, VTThe Packaging Associate is responsible for supplying all necessary packaging materials (including spools) to production lines, performing accurate weighing and labeling of finished goods, and delivering them to the appropriate warehouse locations. As a Packaging Associate, you will play an important role in ensuring products are packaged safely, accurately, and efficiently while supporting both the Production and Shipping & Receiving teams.
Quantum Advanced Packaging Manager GlobalFoundries IncQuantum Advanced Packaging ManagerEssex Junction, VT$118,000–$210,000 / yearThe role will entail leading the Quantum advanced packaging team to develop various cryogenic / superconducting capabilities, such as wafer-to-wafer (W2W) hybrid / fusion bonding, die-to-wafer (D2W) hybrid bonding, interposers, etc. GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world's most inspired technology companies.
NewCheese Packaging Specialist (Overnight) Cabot CreameryCheese Packaging Specialist (Overnight)Middlebury, VTMore than 100 years of: Farmers, Family, Mission, Purpose, Sustainability, Respect, Integrity, Work Ethic, Teamwork, Pride in Award Winning Products, and Agriculture. In this role you'll be working as a team, operating the various machinery necessary to manufacture and package cheese in bulk.
NewCheese Packaging Specialist (Overnight) Agri-Mark, Inc.Cheese Packaging Specialist (Overnight)Middlebury, VT$24.64 / hourPart timeMore than 100 years of: Farmers, Family, Mission, Purpose, Sustainability, Respect, Integrity, Work Ethic, Teamwork, Pride in Award Winning Products, and Agriculture. In this role you'll be working as a team, operating the various machinery necessary to manufacture and package cheese in bulk.
NewWarehouse Automation Engineer (remote) Ryder System IncWarehouse Automation Engineer (remote)Montpelier, VTRemoteRFP and New Business Support:• Lead minor RFP project and support lead engineer on major RFP projects by leading automation selection and validation on new business sale projects by identifying potential automation technologies.• Compensation Information: The compensation offered to a candidate may be influenced by a variety of factors, including the candidate's relevant experience; education, including relevant degrees or certifications; work location; market data/ranges; internal equity; internal salary ranges; etc.
NewWarehouse Automation Engineer Ryder System IncWarehouse Automation EngineerMontpelier, VTRFP and New Business Support:• Lead minor RFP project and support lead engineer on major RFP projects by leading automation selection and validation on new business sale projects by identifying potential automation technologies.• Compensation Information: The compensation offered to a candidate may be influenced by a variety of factors, including the candidate's relevant experience; education, including relevant degrees or certifications; work location; market data/ranges; internal equity; internal salary ranges; etc.
Warehouse Solutions Design Manager (remote) Ryder System IncWarehouse Solutions Design Manager (remote)Montpelier, VTRemoteCAD (e.gAutoCAD); slotting (e.gSlot3D); Predetermined Motion and Time Systems and methods (e.gMOST); simulation software and application; Warehouse Management Systems (e.gManhattan Scale); and Labor MgtSystems Network Design Tools (e.g., Llamasoft) and Data Analytics Software (e.g., Tableau) a plus expert required. Key activities include: Manage a sub-set of SD team members or act an independent contributor, specializing in select design discipline (transportation, warehousing or network design) or industry solutions (e.g., packaging, inbound to manufacturing, integrated transportation, temp controlled).