Chip Packaging Architect GoogleChip Packaging ArchitectSunnyvale, CAYou will collaborate with product architects, design teams, and Signal Integrity/Power Integrity (SI/PI), thermal, mechanical, assembly, and Printed Circuit Board (PCB) engineers to create high-performance packages. As a Chip Packaging Architect on our Silicon Integration team, you will drive advanced packaging solutions (2.5D/3D/3.5D) and technologies for Machine Learning (ML) chips and custom Application-Specific Integrated Circuits (ASICs).
Sr. Technical Solutions Manager - Process Control & Yield Enhancement Software Solutions - (Advanced Packaging) (E) KLA CorpSr. Technical Solutions Manager - Process Control & Yield Enhancement Software Solutions - (Advanced Packaging) (E)Milpitas, CA$138,500–$235,500 / yearMinimum 10+ years of experience in semiconductor manufacturing, product marketing, product management, applications engineering, yield engineering, process control, or related technical commercial roles. Doctorate (Academic) Degree and related work experience of 3 years; Master's Level Degree and related work experience of 6 years; Bachelor's Level Degree and related work experience of 8 years.
Advanced Optical Packaging Design Tech Lead MediaTek IncAdvanced Optical Packaging Design Tech LeadSan Jose, CAThe ideal candidate brings deep expertise in substrate and packaging technologies, hybrid bonding, thermo-mechanical behavior, and high-speed interconnect design, and works effectively across PIC, IC, systems, reliability, manufacturing, and supplier teams. This is a highly visible technical leadership role with responsibility for package architecture, substrate design, hybrid bonding integration, warpage risk management, signal integrity, and production enablement.
Build and OS Packaging Technical Lead, Production Engineering Everpure, IncBuild and OS Packaging Technical Lead, Production EngineeringSanta Clara, CAIn this role, you will drive technical direction, raise engineering execution, and work closely with product, infrastructure, and release teams to improve build performance, reliability, and developer productivity. We have been named Fortune''s Best Workplaces in Technology, Fortune''s Best Workplaces in the Bay Area, and certified as a Great Place to Work!
Sr. Packaging Engineer Tesla IncSr. Packaging EngineerFremont, CA$96,000–$162,000 / yearThe successful candidate must have the ability to work quickly and efficiently with a high level of precision, have strong interpersonal and communication skills, be detail oriented, and not afraid to re-define tradition. Tesla is seeking a highly motivated Packaging Engineer to join our Packaging team in developing world-class designs for automation equipment.
Packaging Graphics & Product Label Specialist 3 Intuitive Surgical IncPackaging Graphics & Product Label Specialist 3Sunnyvale, CACollaborates effectively with cross functional teams (Test Engineering, Quality, Regulatory, Project Management, Design and Document Control) and support business needs/solutions to support manufacturing needs for multiple products/BU. R&D, Regulatory, Operations, Quality, Marketing) and represent Labeling function in the core team meetings for developing labeling content, alignment and translating it into functional label layout utilizing labeling software and/or illustrating software.
Packaging Tech Lead Design Engineer Astera Labs IncPackaging Tech Lead Design EngineerSan Jose, CA$185,000–$240,000 / yearAstera Labs' Intelligent Connectivity Platform integrates CXL, Ethernet, NVLink, PCIe, and UALink semiconductor-based technologies with the company's COSMOS software suite to unify diverse components into cohesive, flexible systems that deliver end-to-end scale-up, and scale-out connectivity. We know that creativity and innovation happen more often when teams include diverse ideas, backgrounds, and experiences, and we actively encourage everyone with relevant experience to apply, including people of color, LGBTQ+ and non-binary people, veterans, parents, and individuals with disabilities.
Sr. Creative Program Manager, eero Packaging Team Amazon.com IncSr. Creative Program Manager, eero Packaging TeamSan Francisco, CAIn addition to creating the packaging plan, which includes a global workback schedule for artwork development in various regions, the role requires management in the creation of technical publications, print on demand (POD) labels, and product labels under the guidance of legal, compliance, brand, marketing, and leadership. Drive cross-functional stakeholders including marketing, brand, product, legal, compliance, and operations to determine schedule for on-box packaging and label content for eero programs.
Director, Pricing and Packaging Strategy McAfee CorpDirector, Pricing and Packaging StrategySan Jose, CAReporting to the Head of Pricing and partnering closely with executive leaders across Marketing, Retention, Product, and Retail, you'll set the vision and frameworks that govern how we price, package, and promote across every channel and stage of the customer lifecycle - from acquisition through renewal - ensuring strategic coherence while maximizing long-term value. You'll lead a high-impact pricing function, influence executive decisions on monetization strategy, and shape how millions of customers experience McAfee - from the first marketing touchpoint, through product packaging, into renewals and win-back, and across our retail ecosystem.
Senior Engineering Program Manager - Device Packaging, Devices & Services Experience Design Amazon.com IncSenior Engineering Program Manager - Device Packaging, Devices & Services Experience DesignSan Francisco, CAWorking closely with global, cross-functional partners-including Packaging Engineering, Industrial Design, Marketing, Legal/Compliance, Operations, and Hardware Technical Program Managers-the Senior Packaging Engineering Program Manager influences at all levels from concept through production. This role owns the end-to-end packaging plan, including schedule creation, structural design development and approval, testing, and coordination of validation builds, aligning inter-disciplinary teams to ensure packaging structure and artwork meet global launch dates.
Integrated Circuit Packaging Architect Advanced Micro Devices IncIntegrated Circuit Packaging ArchitectSan Jose, CASuccessful candidate would collaborate with product design teams and technology development partners to understand future product needs and define a packaging roadmap that includes architecture, process definition, Design for Manufacturing (DFM) and Design for Yield (DFY) guidelines. The Role: Advanced packaging technology leader driving packaging architecture across client, server, gaming and GPU products.
NewReusable Packaging Ambassador Abacus Service CorporationReusable Packaging AmbassadorSan Francisco, CATo support this pilot, the Reusable Packaging Ambassador will provide on-the-ground support, including but not limited to recruiting merchant participants, supporting consumer marketing design and operations, monitoring return points, raising local awareness, and engaging with local consumers and community groups. Raise local awareness of reusable packaging by providing merchants with handouts and marketing material and engaging with local consumers and community groups, for example during farmers markets or beach clean ups.
Senior Mechanical Simulation Engineer – Avionics & Electronics Packaging ZiplineSenior Mechanical Simulation Engineer – Avionics & Electronics PackagingSan Francisco, CA$130,000–$180,000 / yearOur customers include the world's largest and most prominent healthcare systems, governments, retailers, restaurants and global businesses who rely on us to save lives, reduce emissions, increase economic opportunity, and provide delivery from point A to point B as fast as possible. Develop structural finite element models for electronics housings, PCB assemblies, brackets, connectors, flex circuits, fasteners, heat sinks, shields, and integrated avionics modules.
ASIC Packaging Signal/Power Integrity Engineer (Hybrid) Cisco Systems IncASIC Packaging Signal/Power Integrity Engineer (Hybrid)San Jose, CA$152,500–$219,200 / yearBachelor''s degree in Electrical Engineering and 4+ years of relevant signal and power integrity experience, or Master''s degree in Electrical Engineering and 2+ years of relevant signal and power integrity experience, or PhD in Electrical Engineering and 0+ years of related experience, or equivalent related work experience. Cisco Silicon One is the only unifying silicon architecture in the market that enables customers to deploy the best-of-breed silicon from Top of Rack (TOR) switches all the way through web scale data centers and across service provider, enterprise networks, and data centers with a fully unified routing and switching portfolio.
NewPackaging Operator TalentBurst, Inc.Packaging OperatorPleasanton, CA$21.50 / hourBacked by precision, transparency, and results, we connect top talent with leading organizations through trusted partnerships. We partner with you to move quickly and connect you to opportunities aligned with your skills and long term growth.
Packaging Sourcing Manager Kinder'sPackaging Sourcing ManagerWalnut Creek, California$125,000–$145,000 / yearMost of our work happens in the office to spark creativity and community, but we also offer flexibility so team members have the autonomy to work outside the office when needed to support their work-life balance and personal commitments. By developing strong supplier partnerships, ensuring regulatory compliance, and driving process efficiencies, you will help Kinder’s scale its impact while staying true to our values.
Senior Packaging Designer icreativesSenior Packaging DesignerRedwood City, CaliforniaRemoteIn this role, you'll lead packaging design efforts from the earliest concept to press-ready files, collaborating with clients and internal teams to deliver packaging that's visually compelling, strategically grounded, and production-ready. They're known for building standout brands through smart strategy, impactful visuals, and packaging that jumps off the shelf (in the best way possible).
Process Engineer - Advanced Packaging Applied MaterialsProcess Engineer - Advanced PackagingSanta Clara, CA$147,000–$202,500 / yearRole Responsibilities: Design, collect data, analyze, and compile results for complex process engineering experiments across multiple process modules; apply findings to establish process baseline, monitor performance and stability. If you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor.
Senior Packaging Technical Engineer - Hardware NVIDIA CorpSenior Packaging Technical Engineer - HardwareSanta Clara, CAThis is not just another engineering role-it's a unique opportunity that actively encourages innovative, out-of-the-box problem solvers to contribute and shape the future of our technology. We collaborate with large teams consisting of Circuit, Signal Integrity, RTL, Place and Route, substrate layout and system design Engineers and Managers.
NewPackaging Operator HireTalentPackaging OperatorPleasanton, CAThe Packaging Operator inspects, labels, and packages raw and finished products, ensuring quality and compliance throughout the packaging process. Inspect raw and finished products for quality and packaging accuracy.