113 Results for

Packaging Jobs in San Francisco, CA

Jobs

SF, CA14 days ago

$80,000–$120,000 Per Year
Full-time

CONSIDERED EXPERIENCE INCLUDES: Field Service Technician Engineer Mechanic Tech Maintenance Install Repair Calibrate Maintain Processing & Packaging Equipment Machinery Automated Film Foil Pouchers Baggers Fillers Roasters Dry Friers Vacuum Fried Baked Snacks Potato Tortilla Chips French Fries Confection Nuts Molded Candy Molders #DiedreMoire #JobSearch #JobHunt #JobOpening #Hiring #Job #Jobs #Careers #Employment #jobposting #fieldeservicejobs #technicianjobs. Field Service Technician Engineer Mechanic Tech Maintenance Install Repair Calibrate Maintain Processing & Packaging Equipment Machinery Automated Film Foil Pouchers Baggers Fillers Roasters Dry Friers Vacuum Fried Baked Snacks Potato Tortilla Chips French Fries Confection Nuts Molded Candy Molders _.

San Jose, CA30+ days ago

Axiado has also won numerous industry awards for our ground-breaking products and technological innovations, including being named one of Fast Companys 2025 Top 10 Most Innovative Companies in Security, winning the 2025 Global InfoSec Award for Outstanding AI Security Solution, and being named a finalist for the Global Semiconductor Alliances 2025 Start-Up to Watch award. We are a fast-growing, well funded silicon, systems, and solutions company pioneering a new category of semiconductor called the Trusted Control/Compute Unit (TCU) that combines advanced hardware security, AI driven resilience and efficiency, and real-time platform management.

Fremont, CA30+ days ago

$50–$78.35 Per Hour

As a key contributor to our team, you will be responsible for designing, testing, and improving packaging solutions to ensure safe and efficient transport of components from suppliers to our distribution center and within our facilities. Collaborate cross-functionally with the Vehicle engineering team, supplier quality organization, and logistics team to ensure packaging meets internal customer needs.

San Ramon, CA18 days ago

$64,000–$85,000 Per Year

Rodan + Fields Dermatologists is a direct selling skincare company founded in 2000 by Dr. Katie Rodan and Dr. Kathy Fields, world-renowned dermatologists, and creators of Proactiv Solution with a passion for giving people the best skin of their lives - and the confidence that comes with it. With effective products, a unique business model and a powerful community of Independent Consultants, Rodan + Fields has disrupted the skincare category to become a leading skincare brand in North America.

San Jose, CA27 days ago

Astera Labs' Intelligent Connectivity Platform integrates CXL, Ethernet, NVLink, PCIe, and UALink semiconductor-based technologies with the company's COSMOS software suite to unify diverse components into cohesive, flexible systems that deliver end-to-end scale-up, and scale-out connectivity. We know that creativity and innovation happen more often when teams include diverse ideas, backgrounds, and experiences, and we actively encourage everyone with relevant experience to apply, including people of color, LGBTQ+ and non-binary people, veterans, parents, and individuals with disabilities.

San Francisco, CA30+ days ago

Knowledge of the product development process and experience related to various delivery system technologies (e.g., aerosol formulation, emulsion chemistry, gel formulation, polymer chemistry, reaction products, surfactants, solvents, builders). In this role, youll help bring ideas from concept to self, developing new packaging, supporting line extensions, and driving technical innovation that keeps our products fresh, functional, and sustainable.

Santa Clara, CA25 days ago

Minimum requirement of a bachelors degree in a relevant fieldMS or PhD preferred, with 3+ years of industry experience in package design and assembly process development of high-bandwidth and high-density memory packages. If you are driven to solve the industrys toughest packaging challenges, your work will have a profound and lasting impact on the products used by millions.

New!

San Ramon, CA4 days ago

$84,000–$105,000 Per Year

Fremont, CA30+ days ago

$16.35–$33.65 Per Hour

Consider before submitting an application: This position is expected to start August 2026 or September 2026 and continue through the Fall term (ending approximately December 2026 or later, if available). Demonstrated ability to facilitate dynamic cross-functional projects with engineering, supply chain, manufacturing and test to meet project timelines.

San Jose, CA30+ days ago

$130,850–$186,900 Per Year

With our continual goal of making Lumentum a best place to work for our employees, we strive to offer employees competitive total compensation packages, which may include annual bonus, commission for certain sales roles, equity, and health and welfare benefits. This role focuses on advanced mechanical and thermal packaging solutions for high-density, high-power optical modules, including pluggable form factors and emerging advanced packaging architectures.

Fremont, CA21 days ago

$68–$78.37 Per Hour

Work cross-functionally with our Vehicle Engineering team, Supplier Quality organization, and Logistics team, making sure our packaging fulfills all internal customer needs. As our Packaging Engineer, you will be responsible for designing, testing, and improving the packaging used to transport our components from our supplier base to our distribution center, as well as the internal packaging within our facilities.

Mountain View, CA30+ days ago

$119,800–$234,700 Per Year

Specific responsibilities to include: • Work with product architects to determine the optimal packaging solution • Drive package technology solutions for chiplet architecture with advanced packaging • Drive supplier assessments and manage suppliers through definition, development, qualification and production • Develop and deliver FMEA (Failure Mode and Effects Analysis) for various technology options • Define, design and develop test vehicles to validate Silicon, Package, System performance • Support substrate design working with suppliers and internal teams • Assess and characterize the reliability of Integrated Circuits (IC) packages • Design and develop package and assembly drawings to support the manufacturing • Work closely with silicon and platform architects, motherboard and package designers, thermal architects and engineers, and power and performance engineers • Drives the execution of architecture solutions across product lines or multiple product groups and across teams that account for design trends and future concepts by leveraging cross-functional expertise, industry best practices, and lessons learned from teams working across multiple product lines • Drives engineering system design decisions that require collaboration between internal and external stakeholders to account for platform-specific technology decisions and develop system models based on current and anticipated feature/design needs and trade-offs. Preferred Qualifications: • Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 3+ years technical engineering experience • Masters Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 6+ years technical engineering experience • Bachelors Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 8+ years technical engineering experience • Master's Degree with 10 years experience in semiconductor package product development • 5+ years hands-on experience in Semiconductor Package development, manufacturing, supplier management or quality management • Specific experience with Advanced Semiconductor Package technologies (e.g.

San Jose, CA30+ days ago

At Skyworks you will find a fast-paced environment with a strong focus on global collaboration minimal layers of management and the freedom to make meaningful contributions in a setting that encourages creative thinking. Experience in package design and proficient in Cadence Allegro platform tools, PCB Editor, Advanced Package Designer, APDSiP, or Mentor Xpedition platform tools.

San Francisco, California30+ days ago

Knowledge of the product development process and experience related to various delivery system technologies (e.g., aerosol formulation, emulsion chemistry, gel formulation, polymer chemistry, reaction products, surfactants, solvents, builders). In this role, you’ll help bring ideas from concept to self, developing new packaging, supporting line extensions, and driving technical innovation that keeps our products fresh, functional, and sustainable.

Fremont, CA7 days ago

$200,000–$280,000 Per Year

Our advanced optical, mechanical, electrical, and software design capabilities support the evolving needs of high-density, high-bandwidth, and flexible optical networks across telecom, datacom, hyperscale datacenters, artificial intelligence, and supercomputing. The position requires close collaboration with R&D and product design teams, manufacturing, suppliers, and customers to ensure laser components meet stringent optical, mechanical, and Telcordia reliability requirements.

New!

Milpitas, CA6 days ago

$85,000–$120,000 Per Year

Our application, software, and industry teams work directly with leading Fortune 500 companies-including Lockheed Martin, Mercedes-Benz, Boehringer Ingelheim, and Mitsubishi Chemical-to prepare quantum solutions for real-world impact. Actual compensation may vary outside of these ranges and is dependent on various factors including but not limited to a candidate''s qualifications including relevant education and training, competencies, experience, geographic location, and business needs.

Mountain View, CA8 days ago

$200,000–$350,000 Per Year

10+ years of experience on very high performance designs at advanced packaging like SIP, CoWoS, EMIB and other interposer technologies. Demonstrated ability to work closely with architects to create right packaging solutions and sign off complex packaging solutions.

Santa Clara, CA30+ days ago

Partner with design, reliability, and architecture teams to evaluate tradeoffs (bump pitch, stack-ups, embedded Si, etc.) and lead test vehicle planning to meet program needs. As the position offered will have direct and/or indirect access to information, systems, or technologies subject to these laws, the offer may be contingent upon your citizenship/permanent residency status or ability to obtain prior license approval from the U.S. Commerce Department or applicable federal agency.

Santa Clara, CA21 days ago

$64–$64 Per Hour

If you enjoy solving complex challenges in mixed-signal design, chiplet integration, and high-performance electronics, this role is for you. We are looking for a Senior Electrical Engineer with deep expertise in semiconductor design, advanced packaging, and ASIC development.

Mountain View, CA12 days ago

Collaborate closely with Signal integrity (SI)/Power Integrity (PI), Test, New Product Introduction (NPI) and Mechanical Engineering teams to refine and optimize product package architecture and design. 5 years of experience in chip package substrate design using Cadence APD (Allegro Package Designer) or Mentor Expedition with package tape-outs.

Sunnyvale, CA18 days ago

From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Google Cloud, Google Global Networking, Data Center operations, systems research, and much more. Utilize advanced Three-Dimensional/Two-Dimensional Computer-Aided Design software (SolidWorks, Artios CAD, Creo, etc.) to architect complex structural packaging solutions and generate precise technical drawings, assembly instructions, and cushion layouts.

Mountain View, CA30+ days ago

$197,000–$285,000 Per Year

Aurora expects commitment to our safety policies from every employee, and seeks candidates who take an active responsibility, can contribute to building an atmosphere of trust, and invest in the organization's long-term success by prioritizing working safely, no matter what. Aurora hires talented people with diverse backgrounds who are ready to help build a transportation ecosystem that will make our roads safer, get crucial goods where they need to go, and make mobility more efficient and accessible for all.

Fremont, CA30+ days ago

$200,000–$280,000 Per Year

Palo Alto, CA30+ days ago

$20–$50 Per Hour

Knowledge of various manufacturing techniques including die bonding, wire bonding, solder dispensing & printing, reflow, plasma cleaning, encapsulation, plating, stamping, die-casting, injection molding, fastening, joining, and automated assembly processes to ensure designs are productionable. Develop Tesla custom power semiconductor packages (e.g., discrete and module) for electric vehicle and energy storage products utilizing SiC, GaN, or Si technology, as well as developing novel cooling and attachment methods for Power Electronics applications.

fremont, CA30+ days ago

Collaborate with cross-functional teams consisting of Silicon Photonics, IC design, substrate layout, and module design teams. Develop Silicon Photonic (PIC) and electronics IC (EIC) co-design process flow, PIC and EIC IO pad frame and 3D interposer floor plan.

Santa Clara, CA30+ days ago

$97,630–$146,300 Per Year

Highlights include an employee stock purchase plan with a 2-year look back, family support programs to help balance work and home life, robust mental health resources to prioritize emotional well-being, and a recognition and service awards to celebrate contributions and milestones. Expected Base Pay Range (USD) $97,630 - $146,300 per annum The successful candidate's starting base pay will be determined based on job-related skills, experience, qualifications, work location, and market conditions.

Sunnyvale, CA30+ days ago

We are a vertically integrated manufacturing company that develops innovative products for diversified applications in the industrial, optical communications, military, life sciences, semiconductor equipment, and consumer markets. Coherent provides a comprehensive career development platform within an environment that challenges employees to perform at their best, while rewarding excellence and hard work through a competitive compensation program.

Santa Clara, CA30+ days ago

The group focuses on signal integrity, power integrity, thermal integrity, mechanical integrity, high speed signaling and complex power delivery networks (PDNs) requiring innovative and custom solutions to meet constantly evolving customer needs. Highlights include an employee stock purchase plan with a 2-year look back, family support programs to help balance work and home life, robust mental health resources to prioritize emotional well-being, and a recognition and service awards to celebrate contributions and milestones.

New!

Palo Alto, California5 days ago

Select and design optimal multi‑die package types (MCM, 2.5D, 3D, fan‑out, CoWoS, InFO, CPC, CPO) balancing electrical performance, thermal behavior, cost, and manufacturability. We aim to create an environment where people are treated fairly, supported in their growth, and are empowered to do meaningful work alongside others who take the craft seriously.

Palo Alto, CA30+ days ago

$85,760–$197,160 Per Year

Owner of RFQ's and contract management - ensure Non-Disclosure Agreements, General Terms & Conditions, Piece Price Agreements, and other related contracts are negotiated, agreed and appropriately documented before business is initiated. Along with competitive pay, as a full-time Tesla employee, you are eligible for the following benefits at day 1 of hire: Aetna PPO and HSA plans > 2 medical plan options with $0 payroll deduction.

Sunnyvale, CA21 days ago

You will collaborate with product architects, design teams, and Signal Integrity/Power Integrity (SI/PI), thermal, mechanical, assembly, and Printed Circuit Board (PCB) engineers to create high-performance packages. As a Chip Packaging Architect on our Silicon Integration team, you will drive advanced packaging solutions (2.5D/3D/3.5D) and technologies for Machine Learning (ML) chips and custom Application-Specific Integrated Circuits (ASICs).

sunnyvale, CA30+ days ago

Design and develop multi-fiber module packaging for fiber optic devices and modules to create the physical structures, including enclosure, fiber mounting, connection, and sealing. Proficient computer skills, experience with Word, Excel, Outlook, PowerPoint, Email, internet access and the ability to develop tools and/or special applications within these packages.

San Francisco, California30+ days ago

For unincorporated Los Angeles County workers: we reasonably believe that criminal history may have a direct, adverse and negative relationship with the following job duties, potentially resulting in the withdrawal of a conditional offer of employment: protect computer hardware entrusted to you from theft, loss or damage; return all computer hardware in your possession (including the data contained therein) upon termination of employment or end of assignment; and maintain the confidentiality of proprietary, confidential, and non-public information. In addition to delivering production-grade silicon for OpenAI’s supercomputing infrastructure, the team also creates custom design tools and methodologies that accelerate innovation and enable hardware optimized specifically for AI.

San Francisco30+ days ago

$181,100–$318,400 Per Year

In this highly visible role, you will develop Si photonics engine/chiplet packaging and co-packaging solutions utilizing advanced packaging technologies, define assembly baseline processes, decide package BOM, establish optical coupling design/manufacturing that are optimized for performance, reliability, yield and cost. Develop and simulate optical packaging architectures integrating photonic chips, fibers, and electronics using tools like Lumerical, Zemax, or COMSOL.Prototype and characterize integrated photonic packages, correlating simulation with optical and electrical measurements.

Santa Clara, CA30+ days ago

$160,980–$311,040 Per Year

Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.

Santa Clara, CA30+ days ago

$220,320–$311,040 Per Year

Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. With a focus on scalability, AI advancement, and shaping the future, we provide an unparalleled blend of an industry-leading technology, a rich IP portfolio, a world-class design ecosystem, and an operationally resilient global manufacturing supply chain.

San Jose, CA30+ days ago

$132,142–$164,910 Per Year

Requirements: Must have a Masters degree in Mechanical Engineering, Materials Science, Electrical Engineering, Autonomy and Robotics Engineering, or related field (willing to accept a foreign education equivalent) and two (2) years of experience as a Packaging Engineer or related occupation conceptualizing and productizing semiconductor devices to bridge analog signals to digital Cloud. For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls.

San Jose, CA10 days ago

Collaborate closely with IP, ASIC design, package design, Signal Integrity (SI), Power Integrity (PI), Thermal and modeling technologies, Product Engineering, and Test Engineering teams to enable innovative solutions. Roles and Responsibilities: Supports MediaTek's Memory packaging technology development including but not limited to HBM package, cHBM, LPDDR package for mobile applications, In Package Memory (IPM) for Edge AI, etc.

Fremont, CA30+ days ago

$160,000–$175,000 Per Year

This role goes beyond traditional packaging design, focusing on end-to-end packaging systems, including returnable packaging, reverse logistics, cost modeling, and network-wide performance. Our talented worldwide teams are redefining how solar power plants are designed, built, and operated every day with smart technology, data-driven insights, and advanced automation.

Santa Clara, CA24 days ago

Highlights include an employee stock purchase plan with a 2-year look back, family support programs to help balance work and home life, robust mental health resources to prioritize emotional well-being, and a recognition and service awards to celebrate contributions and milestones. To support fair and authentic hiring practices, candidates are not permitted to use AI tools (such as transcription apps, real-time answer generators like ChatGPT or Copilot, or automated note-taking bots) during interviews.

Santa Clara, CA30+ days ago

Experience with Material Characterization (ex; BH analyzer, VSM, SEM, EDX) • Experience in advanced co-packaged power modules • Preferred qualifications: • PhD in Electrical Engineering, Materials Science, or a related field with deep focus on magnetics and power packaging • System-level understanding of power delivery architectures, thermal management, EMI, and reliability constraints • In-depth understanding of magnetic materials: Ferrite materials (NiZn MnZn), metal materials (Fe, FeNi, FeSiCr, FeSiAl, amorphous & nano crystalline materials) • Familiarity with high-frequency magnetic material behavior, loss modeling, and reliability testing • Hands on knowledge of simulation tools and techniques like Maxwell, Ansys, Femtet, homogenization and model order reduction, optimization tools (NN, AI/ML) • Understanding of material processing: ceramic, metal powder and composite materials • Familiarity with inductor coil forming and termination processes: wire wounded, multilayer, metal composite, thin film, etc. Responsibilities may include: • Lead the definition, development and realization of comprehensive low-profile inductors, planar magnetics, and integrated passives roadmaps to enable ultra-compact, high-density, high current (100-300A) power delivery modules for enterprise and AI infrastructure.

Santa Clara, CA30+ days ago

Own the package-level reliability spec for assigned products • Define qualification requirements and pass/fail criteria for device/package-level reliability (e.g., HTSL, TCT, UHAST, pre-conditioning, JESD22 methods) and Package-on-board / board-level reliability (thermal cycling, shock/vibration, connector/cage interactions) • Leads materials and stackup selection (substrate, solder alloy, underfill, mold, lid, TIM, etc.) and DFR trade-offs for new packages and 2nd sources • Evaluates thermo-mechanical and SI/PI impact of those choices • Analyzes qual and stress data (including HTOL, package qual, SLT/system stress) and convert to design / process/ material changes for next revision • Understands how the component FIT rolls up from component level to system level and overall availability requirement. • Demonstrated ability to lead cross-functional efforts across design, package R&D, SI/PI, validation, QA, and operations • Experience with data center or cloud hardware and understanding of: • Rack and cluster-level availability targets and constraints • How component FIT drive sparing, repair rate, and availability planning • Strong communication: Able to present trade-offs and reliability risks clearly to both technical and program stakeholders.

Fremont, CA30+ days ago

Full-time

Palo Alto, CA30+ days ago

$160,000–$180,000 Per Year

Our application, software, and industry teams work directly with leading Fortune 500 companies-including Lockheed Martin, Mercedes-Benz, Boehringer Ingelheim, and Mitsubishi Chemical-to prepare quantum solutions for real-world impact. Actual compensation may vary outside of these ranges and is dependent on various factors including but not limited to a candidate's qualifications including relevant education and training, competencies, experience, geographic location, and business needs.

Sunnyvale, CA30+ days ago

$157,000–$235,000 Per Year

In-addition-to-the-base-salary,-this-role-may-be-eligible-for-an-annual-bonus,-equity,-and-other-discretionary-bonuses.-Synopsys-offers-comprehensive-health,-wellness,-and-financial-benefits-as-part-of-a-competitive-total-rewards-package.-The-actual-compensation-offered-will-be-based-on-a-number-of-job-related-factors,-including-location,-skills,-experience,-and-education.-Your-recruiter-can-share-more-specific-details-on-the-total-rewards-package-upon-request.-The-base-salary-range-for-this-role-is-across-the-U.S. custom_fields. At-Synopsys,-we-want-talented-people-of-every-background-to-feel-valued-and-supported-to-do-their-best-work.-Synopsys-considers-all-applicants-for-employment-without-regard-to-race,-color,-religion,-national-origin,-gender,-sexual-orientation,-age,-military-veteran-status,-or-disability.

Milpitas, CA13 days ago

Our application, software, and industry teams work directly with leading Fortune 500 companies-including Lockheed Martin, Mercedes-Benz, Boehringer Ingelheim, and Mitsubishi Chemical-to prepare quantum solutions for real-world impact. Support image processing workflows (e.g., contrast, alignment, feature extraction) using Python or similar tools and help turn results into clear tables or simple plots.

San Francisco, CA30+ days ago

For unincorporated Los Angeles County workers: we reasonably believe that criminal history may have a direct, adverse and negative relationship with the following job duties, potentially resulting in the withdrawal of a conditional offer of employment: protect computer hardware entrusted to you from theft, loss or damage; return all computer hardware in your possession (including the data contained therein) upon termination of employment or end of assignment; and maintain the confidentiality of proprietary, confidential, and non-public information. In addition to delivering production-grade silicon for OpenAI's supercomputing infrastructure, the team also creates custom design tools and methodologies that accelerate innovation and enable hardware optimized specifically for AI.

San Francisco, CA19 days ago

$189,000–$236,000 Per Year

About the Team: The Pricing & Packaging team sits at the heart of Gusto's Commerce infrastructure, serving as the single source of truth for all products, bundles, add-ons, subscriptions, pricing, promotions, and discounts across Gusto's first-party customer experience. The team owns and operates Gusto's internal Commerce Platform including the product catalog, promotion engine, subscription, pricing experimentation platform, and entitlement services that enable Growth and other teams to bring Gusto's offerings to market effectively.

Fremont, CA30+ days ago

$115,000–$150,000 Per Year

Our advanced optical, mechanical, electrical, and software design capabilities support the evolving needs of high-density, high-bandwidth, and flexible optical networks across telecom, datacom, hyperscale datacenters, artificial intelligence, and supercomputing. You will apply mechanical design experience and knowledge working in a highly capable team of optical, mechanical, electrical and process engineers to develop and deliver our products meeting internal and customer requirements.

Sunnyvale, CA19 days ago

Full-time
Employee

Resume Resources

Free Resume Templates Free Resume Builder

Get noticed by top employers!

Upload your resume to let employers know you're open to Packaging job opportunities. Plus, receive relevant job recommendations in your inbox.

Create A Free Account

Packaging Jobs in San Francisco, CA

Field Mechanic - Snack Chip Cooking & Packaging Equipment - San Francisco, CA Diedre Moire Corp.

Senior IC Packaging Engineer Axiado Corp

Packaging Engineer Artech LLC

Associate Packaging Engineer Rodan & Fields LLC

Photonic Packaging Engineer, Principal Astera Labs Inc

Sr. Associate, Packaging Engineer Method Products PBC

Memory Packaging Engineer Apple Inc

Packaging Engineer Rodan & Fields LLC

Internship, Packaging Engineer, Supply Chain (Fall 2026) Tesla Inc

Optic-Electronic Packaging Engineer Lumentum Operations LLC

Packaging Engineer Ursus, Inc.

Senior IC Packaging Engineer Microsoft Corp

Principal Packaging Engineer Skyworks Solutions Inc

Sr. Associate, Packaging Engineer SC Johnson Lifestyle Brands

Principal Packaging Engineer Koch Inc

Associate Optical Packaging Engineer PsiQuantum Corp

Advanced Packaging Engineer DensityAI

Advanced Packaging Process Engineer Tenstorrent Inc

Senior Electrical Engineer / Product Lead Advanced Semiconductor Packaging and Integration Macpower Digital Assets Edge Private Limited

Senior Packaging Design Engineer, Silicon Google LLC

Packaging Design Engineer Google LLC

Senior Staff Optical Packaging Engineer Aurora Innovation Inc

Laser Principal Packaging Engineer - Optical Solutions R&D Koch Inc

Internship, Power Semiconductor Packaging Mechanical Design Engineer, Energy Engineering (Summer 2026) Tesla Inc

Principal Silicon Photonics Packaging Engineer II-VI Incorporated

Advanced Packaging Engineer - SI/PI Marvell Technology Inc

Senior Fiber Optic Module Packaging Engineer II-VI Optical Systems, Inc.

Sr. Principal Engineer, Advanced Packaging Marvell Technology Inc

Principal Packaging Engineer Delos Data

Supplier Industrialization Engineer, IC Packaging, Power Electronics Tesla Inc

Chip Packaging Architect Google LLC

Senior Fiber Optic Module Packaging Engineer Coherent Corp

Advanced Packaging Multi-Physics Modeling Engineer OpenAI

Silicon Photonics & Optical Packaging Eng Apple Inc

Senior Technical Solutions Engineer - Advanced Packaging Intel Corp

Foundry Services Advanced Packaging Account Technical Solutions Engineer Intel Corp

Senior Engineer, Semi Packaging Engineering Analog Devices Inc

Memory Packaging Engineer MediaTek Inc

Sr. Packaging Engineer NEXTracker Inc

Optical Packaging and Component Engineer Marvell Technology Inc

Packaging Engineer - Inductor and Power Module Texas Instruments Inc

Senior Reliability Engineer - LPU Packaging NVIDIA Corp

Laser Principal Packaging Engineer - Optical Solutions R&D Molex

Senior Optical Packaging Process Engineer PsiQuantum Corp

Advanced Packaging Design, Sr Staff Engineer - 13846 Synopsys Inc

Intern, Optical Packaging and Characterization Engineer PsiQuantum Corp

Advanced Packaging Multi-Physics Modeling Engineer OpenAI LLC

Senior Staff Software Engineer - Pricing and Packaging Gusto Inc

Mechanical Engineer Electronic Packaging Koch Inc

Packaging Design Engineer Google

Resume Resources