Expert-level knowledge in assembly steps: wafer thinning, wafer dicing, die attach (including flip chip and multi-die stacking), wirebond, encapsulation and underfill, SMT, transfer/compression molding, singulation, and wafer level packaging processes. You will work at the intersection of design, materials science, and manufacturing, collaborating with internal cross-functional teams and external suppliers to solve complex integration challenges and successfully bring next-generation sensing technologies to market.