Serve as the subject matter expert (SME) and technical lead for microcircuit assembly processes - epoxy dispensing, gold-gold thermosonic bonding (wire bonding, ball bonding, stud bumping, flip chip), automatic placement, soldering, silver sintering, and plasma cleaning - providing technical direction across R&D, Manufacturing, and Quality. Working across materials, mechanical, electrical, and manufacturing disciplines, you'll serve as a trusted technical resource and subject matter expert, collaborating with cross-functional teams to deliver breakthrough products supporting communications, aerospace and defense, automotive, semiconductor, and emerging technology markets.