Lead advanced PCB layout efforts using technologies such as High‑Density Interconnect (HDI), microvias, via‑in‑pad, backdrilling, and specialized substrate materials; provide technical guidance, peer reviews, and mentoring to other layout designers. For this role, responsibilities include but are not limited to: Execute the placement and routing of complex, high‑density, multi‑layer printed circuit boards (PCBs), including high‑speed digital, RF, mixed‑signal, and power circuits.