Senior Power Integrity Engineer - LPU Packaging NVIDIA CorpSenior Power Integrity Engineer - LPU PackagingSanta Clara, CA$196,000–$310,500 / yearWe have some of the most forward-thinking and hardworking people in the world working with us and our product lines are growing fast in some of the hottest state-of-the-art fields such as Artificial Intelligence, Deep Learning, Autonomous Vehicles, and Robotics. A deep understanding of board-level PDN design, including stack-up definition, plane partitioning, and VRM placement on high-layer-count accelerator boards.
Sr. Technical Solutions Manager - Process Control & Yield Enhancement Software Solutions - (Advanced Packaging) (E) KLA CorpSr. Technical Solutions Manager - Process Control & Yield Enhancement Software Solutions - (Advanced Packaging) (E)Milpitas, CA$138,500–$235,500 / yearMinimum 10+ years of experience in semiconductor manufacturing, product marketing, product management, applications engineering, yield engineering, process control, or related technical commercial roles. Doctorate (Academic) Degree and related work experience of 3 years; Master's Level Degree and related work experience of 6 years; Bachelor's Level Degree and related work experience of 8 years.
NewCold Chain Packaging & Logistics Associate MMC GroupCold Chain Packaging & Logistics AssociateMillbrae, CA$23 / hourIt is a temp-to-hire opportunity offering a consistent weekday schedule and the chance to develop valuable experience in cold chain logistics, temperature-controlled shipping, inventory management, and regulated operations. Throughout the past 35+ years, MMC, one of the most trusted names in workforce management services, has successfully delivered strategic solutions to large and small businesses in numerous industries.
Process Engineer, Advanced Packaging Applied Materials IncProcess Engineer, Advanced PackagingSanta Clara, CA$124,000–$171,000 / yearIf you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members.
Program Management - Principal TPM - Packaging, SI/PI & System Integration Eliyan CorporationProgram Management - Principal TPM - Packaging, SI/PI & System IntegrationCAKey Responsibilities: Packaging & SI/PI Program Execution: Own and drive program schedules for advanced packaging and SI/PI workstreams - including 2.5D/3D IC integration, chiplet interposer/substrate design, bump/RDL planning, and co-packaged optics (CPO) - from early feasibility through qualification and production ramp, ensuring milestones stay synchronized with die-level tapeout schedules. OSAT & Foundry/Vendor Management: Manage relationships and schedules with outsourced assembly and test (OSAT) partners, substrate vendors, and foundries; track packaging-specific deliverables (interposer fab, flip-chip assembly, bump qualification, reliability testing) against committed timelines.
Senior Automation Software Engineer, Optical Packaging PsiQuantum CorpSenior Automation Software Engineer, Optical PackagingMilpitas, CA$130,000–$170,000 / yearOur application, software, and industry teams work directly with leading Fortune 500 companies-including Lockheed Martin, Mercedes-Benz, Boehringer Ingelheim, and Mitsubishi Chemical-to prepare quantum solutions for real-world impact. Actual compensation may vary outside of these ranges and is dependent on various factors including but not limited to a candidate''s qualifications including relevant education and training, competencies, experience, geographic location, and business needs.
Sr. Packaging Engineer Tesla IncSr. Packaging EngineerFremont, CA$96,000–$162,000 / yearThe successful candidate must have the ability to work quickly and efficiently with a high level of precision, have strong interpersonal and communication skills, be detail oriented, and not afraid to re-define tradition. Tesla is seeking a highly motivated Packaging Engineer to join our Packaging team in developing world-class designs for automation equipment.
Sr. Creative Program Manager, eero Packaging Team Amazon.com IncSr. Creative Program Manager, eero Packaging TeamSan Francisco, CAIn addition to creating the packaging plan, which includes a global workback schedule for artwork development in various regions, the role requires management in the creation of technical publications, print on demand (POD) labels, and product labels under the guidance of legal, compliance, brand, marketing, and leadership. Drive cross-functional stakeholders including marketing, brand, product, legal, compliance, and operations to determine schedule for on-box packaging and label content for eero programs.
Senior Engineering Program Manager - Device Packaging, Devices & Services Experience Design Amazon.com IncSenior Engineering Program Manager - Device Packaging, Devices & Services Experience DesignSan Francisco, CAWorking closely with global, cross-functional partners-including Packaging Engineering, Industrial Design, Marketing, Legal/Compliance, Operations, and Hardware Technical Program Managers-the Senior Packaging Engineering Program Manager influences at all levels from concept through production. This role owns the end-to-end packaging plan, including schedule creation, structural design development and approval, testing, and coordination of validation builds, aligning inter-disciplinary teams to ensure packaging structure and artwork meet global launch dates.
Advanced Optical Packaging Design Tech Lead MediaTek IncAdvanced Optical Packaging Design Tech LeadSan Jose, CAThe ideal candidate brings deep expertise in substrate and packaging technologies, hybrid bonding, thermo-mechanical behavior, and high-speed interconnect design, and works effectively across PIC, IC, systems, reliability, manufacturing, and supplier teams. This is a highly visible technical leadership role with responsibility for package architecture, substrate design, hybrid bonding integration, warpage risk management, signal integrity, and production enablement.
Build and OS Packaging Technical Lead, Production Engineering Everpure, IncBuild and OS Packaging Technical Lead, Production EngineeringSanta Clara, CAIn this role, you will drive technical direction, raise engineering execution, and work closely with product, infrastructure, and release teams to improve build performance, reliability, and developer productivity. We have been named Fortune''s Best Workplaces in Technology, Fortune''s Best Workplaces in the Bay Area, and certified as a Great Place to Work!
Senior Mechanical Simulation Engineer – Avionics & Electronics Packaging ZiplineSenior Mechanical Simulation Engineer – Avionics & Electronics PackagingSan Francisco, CA$130,000–$180,000 / yearOur customers include the world's largest and most prominent healthcare systems, governments, retailers, restaurants and global businesses who rely on us to save lives, reduce emissions, increase economic opportunity, and provide delivery from point A to point B as fast as possible. Develop structural finite element models for electronics housings, PCB assemblies, brackets, connectors, flex circuits, fasteners, heat sinks, shields, and integrated avionics modules.
ASIC Packaging Signal/Power Integrity Engineer (Hybrid) Cisco Systems IncASIC Packaging Signal/Power Integrity Engineer (Hybrid)San Jose, CA$165,000–$241,400 / yearBachelor''s degree in Electrical Engineering and 6+ years of relevant signal and power integrity experience, or Master''s degree in Electrical Engineering and 3+ years of relevant signal and power integrity experience, or PhD in Electrical Engineering and 1+ years of relevant signal and power integrity related work experience. Cisco Silicon One is the only unifying silicon architecture in the market that enables customers to deploy the best-of-breed silicon from Top of Rack (TOR) switches all the way through web scale data centers and across service provider, enterprise networks, and data centers with a fully unified routing and switching portfolio.
Integrated Circuit Packaging Architect Advanced Micro Devices IncIntegrated Circuit Packaging ArchitectSan Jose, CASuccessful candidate would collaborate with product design teams and technology development partners to understand future product needs and define a packaging roadmap that includes architecture, process definition, Design for Manufacturing (DFM) and Design for Yield (DFY) guidelines. The Role: Advanced packaging technology leader driving packaging architecture across client, server, gaming and GPU products.
NewReusable Packaging Ambassador Abacus Service CorporationReusable Packaging AmbassadorSan Francisco, CATo support this pilot, the Reusable Packaging Ambassador will provide on-the-ground support, including but not limited to recruiting merchant participants, supporting consumer marketing design and operations, monitoring return points, raising local awareness, and engaging with local consumers and community groups. Raise local awareness of reusable packaging by providing merchants with handouts and marketing material and engaging with local consumers and community groups, for example during farmers markets or beach clean ups.
NewPackaging Operator TalentBurst, Inc.Packaging OperatorPleasanton, CA$21.50 / hourBacked by precision, transparency, and results, we connect top talent with leading organizations through trusted partnerships. We partner with you to move quickly and connect you to opportunities aligned with your skills and long term growth.
NewPackaging Machine Operator I - Day Shift United 1 LaboratoriesPackaging Machine Operator I - Day ShiftBenicia, CaliforniaParticipate in Total Preventative Maintenance (TPM), with ability to learn and communicate successfully with the Maintenance Department in order to keep equipment at top levels of performance. The Packaging Machine Operator reports directly to the Packaging Supervisor and works with other Packaging Line Workers and Maintenance staff.
NewPackaging Machine Operator II - Day Shift United 1 LaboratoriesPackaging Machine Operator II - Day ShiftBenicia, CaliforniaLearn to set up and operate auxiliary production equipment such as the shrink band applicator, induction sealer, and ink jet coders and print and apply labelers. Complete production paperwork including GMP and HACCP sign offs, downtime reasons and calculation of product, packaging or label losses.
NewPackaging Line Lead I - 1st Shift United 1 LaboratoriesPackaging Line Lead I - 1st ShiftBenicia, CaliforniaHelp production team continuously improve on safety, product quality, cost, and delivery by leading team huddles in RedZone data review. Direct 9-15 packaging line workers/machine operators on single production line to fill, label, and package powders into jugs, bags, boxes, and packets.
Senior Packaging Production Designer (6859) You and RUN Studios LLCSenior Packaging Production Designer (6859)San Francisco, CA$80–$90 / hourWorking within the Industrial Design team under Device Experience Design, you'll collaborate with designers, engineers, and program managers to deliver accurate, consistent packaging artwork for worldwide manufacturing. Prepare production-ready packaging artwork for device cartons, in-box documentation, labels, and regulatory inserts, ensuring accuracy in layout, typography, dielines, and print specifications.