The ideal candidate will play a key role in identifying the optimal package architecture and key packaging technologies, establishing 3rd party relationships, communicating with partners and addressing challenges in areas such as 2.5D/3D/3.5D and System technology optimization with advanced Si nodes, including but not limited to CoWoS-S/R/L, EMIB/EMIB-T, SoIC, HBM, FCBGA, and HBPOP. Perform a trade-off analysis across silicon layout, die-to-die connectivity options, and package design/technology, evaluating their impact on key product metrics, including performance, cost, manufacturability, power efficiency, and form factor.