Deep hands-on expertise in at least one AI/ML networking domain, such as scale-up interconnects and silicon/SerDes/PHY, electrical or optical connectivity, switch systems, scale-out Ethernet/RDMA fabrics, transport/congestion control, collective communication, or workload/fabric performance. This lead will work from physical and data-link technologies through network and transport behavior to collectives, workloads, modeling, observability, and datacenter deployment, creating clarity across architecture, execution, quality, performance, reliability, power, cost, and schedule.