The Thermal BU's portfolio spans the complete thermal chain from chip to atmosphere, including room cooling, in-row cooling, rack cooling, direct-to-chip liquid cooling, coolant distribution units (CDUs), rear-door heat exchangers, chillers, dry coolers, and trim coolers. Operating across all major regions (Americas, EMEA, and Asia-Pacific), the Thermal BU serves hyperscale, colocation, enterprise, and edge data center customers with solutions optimized for increasingly high-density AI and high-performance computing environments.