Product Design Engineer II Pinnacle Technical ResourcesProduct Design Engineer IICupertino,, California$50–$60 / hourContractorThe specific compensation for this position will be determined by a number of factors, including the scope, complexity and location of the role as well as the cost of labor in the market; the skills, education, training, credentials and experience of the candidate; and other conditions of employment. Client’s approach to packaging is unique, so we value people who are eager to learn new skills and further improve their knowledge of packaging design, manufacturing processes, and sustainable materials.
Flexible Packaging Engineer - Destiny Packaging |Salinas, CA Bunzl plcFlexible Packaging Engineer - Destiny Packaging |Salinas, CASalinas, CAUnderstanding of the chemistry of poly urethane, poly vinyl, and poly olefin films, single direction and bi-directional shrink films, barrier and co extruded poly films is preferred. Experience with MAP, barrier films, laminated structures, COEX films, SUPs, flexo print, shrink, stretch, and poly bag structures is preferred.
Senior IC Packaging Engineer Axiado CorpSenior IC Packaging EngineerSan Jose, CAAxiado has also won numerous industry awards for our ground-breaking products and technological innovations, including being named one of Fast Companys 2025 Top 10 Most Innovative Companies in Security, winning the 2025 Global InfoSec Award for Outstanding AI Security Solution, and being named a finalist for the Global Semiconductor Alliances 2025 Start-Up to Watch award. We are a fast-growing, well funded silicon, systems, and solutions company pioneering a new category of semiconductor called the Trusted Control/Compute Unit (TCU) that combines advanced hardware security, AI driven resilience and efficiency, and real-time platform management.
Senior Packaging Engineer Zp Group LlcSenior Packaging EngineerSaratoga, CA$210,000–$265,000 / yearKeywords: advanced packaging, flip‑chip, multi‑chip module, MCM, organic substrate, CoWoS, 2.5D, 3D packaging, TSMC system‑on‑wafer, OSAT, Wistron, module integration, cold plate integration, wafer‑level assembly, substrate technology, semiconductor packaging, high‑density interconnect, HDI substrates, yield improvement, semiconductor manufacturing, module engineering. The ideal Senior Packaging Engineer will lead advanced component and system‑level packaging efforts, with a strong emphasis on pcb assembly and organic substrate technologies on site in Saratoga, CA.
Photonic Packaging Engineer, Principal Astera Labs IncPhotonic Packaging Engineer, PrincipalSan Jose, CA$205,000–$255,000 / yearAstera Labs' Intelligent Connectivity Platform integrates CXL, Ethernet, NVLink, PCIe, and UALink semiconductor-based technologies with the company's COSMOS software suite to unify diverse components into cohesive, flexible systems that deliver end-to-end scale-up, and scale-out connectivity. We know that creativity and innovation happen more often when teams include diverse ideas, backgrounds, and experiences, and we actively encourage everyone with relevant experience to apply, including people of color, LGBTQ+ and non-binary people, veterans, parents, and individuals with disabilities.
Packaging Engineer Nexthop Systems IncPackaging EngineerSanta Clara, CAQualification plans to characterize and validate packaging solutions for product and it's FRU (Field replaceable unit), subassemblies or components as per industry or internal specifications by working closely with HW design (mechanical, thermal, electrical etc.) Come out with innovative ideas for cost optimization, durability during shipping, environmental impact, and compliance with safety regulations. In this role, you'll combine technical expertise with innovative problem-solving to plan & execute all qualifications activities for cutting-edge packaging designs, ensuring they meet the stringent demands of all global shipping environments.
Memory Packaging Engineer Apple IncMemory Packaging EngineerSanta Clara, CAMinimum requirement of a bachelors degree in a relevant fieldMS or PhD preferred, with 3+ years of industry experience in package design and assembly process development of high-bandwidth and high-density memory packages. If you are driven to solve the industrys toughest packaging challenges, your work will have a profound and lasting impact on the products used by millions.
Flexible Packaging Engineer BunzlFlexible Packaging EngineerSalinas, CAFull timeUnderstanding of the chemistry of poly urethane, poly vinyl, and poly olefin films, single direction and bi-directional shrink films, barrier and co extruded poly films is preferred. Experience with MAP, barrier films, laminated structures, COEX films, SUPs, flexo print, shrink, stretch, and poly bag structures is preferred.
Advanced Packaging Engineer DensityAIAdvanced Packaging EngineerMountain View, CA$200,000–$350,000 / year10+ years of experience on very high performance designs at advanced packaging like SIP, CoWoS, EMIB and other interposer technologies. Demonstrated ability to work closely with architects to create right packaging solutions and sign off complex packaging solutions.
NewFlexible Packaging Engineer Destiny Packaging Inc.Flexible Packaging EngineerSalinas, CAPart timeUnderstanding of the chemistry of poly urethane, poly vinyl, and poly olefin films, single direction and bi-directional shrink films, barrier and co extruded poly films is preferred. Experience with MAP, barrier films, laminated structures, COEX films, SUPs, flexo print, shrink, stretch, and poly bag structures is preferred.
Sr Packaging Engineer Applied Materials IncSr Packaging EngineerSanta Clara, CA$133,500–$183,500 / yearIf you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members.
Silicon Photonics & Optical Packaging Engineer Apple IncSilicon Photonics & Optical Packaging EngineerCAIn this highly visible role, you will develop Si photonics engine/chiplet packaging and co-packaging solutions utilizing advanced packaging technologies, define assembly baseline processes, decide package BOM, establish optical coupling design/manufacturing that are optimized for performance, reliability, yield and cost. Si photonics based optical engine package architecture / Package integration and drive micro-optical component assembly/interface characterization through Innovation Work with optical component vendors, foundry and OSAT to bring Si photonics packaging solution from concept to HVM.
Advanced Packaging Process Engineer Tenstorrent IncAdvanced Packaging Process EngineerSanta Clara, CAPartner with design, reliability, and architecture teams to evaluate tradeoffs (bump pitch, stack-ups, embedded Si, etc.) and lead test vehicle planning to meet program needs. As the position offered will have direct and/or indirect access to information, systems, or technologies subject to these laws, the offer may be contingent upon your citizenship/permanent residency status or ability to obtain prior license approval from the U.S. Commerce Department or applicable federal agency.
Packaging Engineer Analog DevicesPackaging EngineerSan Jose, CaliforniaADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls.
Staff Semi Packaging Engineer Analog DevicesStaff Semi Packaging EngineerSan Jose, CaliforniaADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls.
Integrated Circuit - Packaging Architect Engineer Advanced Micro Devices, IncIntegrated Circuit - Packaging Architect EngineerSan Jose, CaliforniaSuccessful candidate would collaborate with product design teams and technology development partners to understand future product needs and define a packaging roadmap that includes architecture, process definition, Design for Manufacturing (DFM) and Design for Yield (DFY) guidelines. Responsibilities: The Role : Advanced packaging technology leader driving packaging architecture across client, server, gaming and GPU products.
NewSenior Fiber Optic Module Packaging Engineer Coherent CorpSenior Fiber Optic Module Packaging EngineerSunnyvale, CAWe are a vertically integrated manufacturing company that develops innovative products for diversified applications in the industrial, optical communications, military, life sciences, semiconductor equipment, and consumer markets. Coherent provides a comprehensive career development platform within an environment that challenges employees to perform at their best, while rewarding excellence and hard-work through a competitive compensation program.
Software Engineer 5 - Ads Pricing & Packaging Netflix IncSoftware Engineer 5 - Ads Pricing & PackagingLos Gatos, CA$388,000–$619,000 / yearThe Ads Pricing and Packaging team is responsible for developing cutting-edge inventory management systems which support various monetization strategies, including dynamic pricing, rate card management, product packaging, inventory segmentation, and yield optimization. Skills & experience we're seeking: Professional experience in building inventory management solutions that support monetization strategies such as dynamic pricing, rate card management, product packaging, inventory split and yield management.
NewSenior Fiber Optic Module Packaging Engineer II-VI Optical Systems, Inc.Senior Fiber Optic Module Packaging EngineerSunnyvale, CAWe are a vertically integrated manufacturing company that develops innovative products for diversified applications in the industrial, optical communications, military, life sciences, semiconductor equipment, and consumer markets. Coherent provides a comprehensive career development platform within an environment that challenges employees to perform at their best, while rewarding excellence and hard-work through a competitive compensation program.
Senior Electrical Engineer / Product Lead Advanced Semiconductor Packaging and Integration Macpower Digital Assets Edge Private LimitedSenior Electrical Engineer / Product Lead Advanced Semiconductor Packaging and IntegrationSanta Clara, CA$64 / hourIf you enjoy solving complex challenges in mixed-signal design, chiplet integration, and high-performance electronics , this role is for you. We are looking for a Senior Electrical Engineer with deep expertise in semiconductor design, advanced packaging, and ASIC development .
Advanced Packaging Engineer - SI/PI Marvell Technology IncAdvanced Packaging Engineer - SI/PISanta Clara, CA$97,630–$146,300 / yearHighlights include an employee stock purchase plan with a 2-year look back, family support programs to help balance work and home life, robust mental health resources to prioritize emotional well-being, and a recognition and service awards to celebrate contributions and milestones. Expected Base Pay Range (USD) $97,630 - $146,300 per annum The successful candidate's starting base pay will be determined based on job-related skills, experience, qualifications, work location, and market conditions.
Packaging Assembly Engineer Apple IncPackaging Assembly EngineerCupertino, CAIn this highly visible role, you will own development, optimization and sustaining the advanced flip-chip BGA (FCBGA) assembly process from pathfinding, NPI through high-volume manufacturing by defining assembly baseline processes, deciding package BOM, establishing package design rules that are optimized for performance, reliability, yield and cost for a variety of projects including SoC. Define and optimize end-to-end FCBGA assembly process flow (wafer back-end interface, flip-chip attach, underfill, lid/heat spreader attach, ball attach, singulation, final inspection).
Sr. Principal Engineer, Advanced Packaging Marvell Technology IncSr. Principal Engineer, Advanced PackagingSanta Clara, CAThe group focuses on signal integrity, power integrity, thermal integrity, mechanical integrity, high speed signaling and complex power delivery networks (PDNs) requiring innovative and custom solutions to meet constantly evolving customer needs. Highlights include an employee stock purchase plan with a 2-year look back, family support programs to help balance work and home life, robust mental health resources to prioritize emotional well-being, and a recognition and service awards to celebrate contributions and milestones.
Foundry Services Advanced Packaging Account Technical Solutions Engineer Intel CorpFoundry Services Advanced Packaging Account Technical Solutions EngineerSanta Clara, CA$220,320–$311,040 / yearBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. With a focus on scalability, AI advancement, and shaping the future, we provide an unparalleled blend of an industry-leading technology, a rich IP portfolio, a world-class design ecosystem, and an operationally resilient global manufacturing supply chain.
Packaging Product Design Engineer Apple IncPackaging Product Design EngineerCupertino, CAThe Packaging PD team is a diverse group of people responsible for the design and execution of structural packaging for all Apple products - from shippers to finished goods boxes. Apple's approach to packaging is unique, so we value people who are eager to learn new skills and further improve their knowledge of packaging design, manufacturing processes, and sustainable materials.
Co-Packaged Optics Packaging Process Development Engineer Marvell Technology IncCo-Packaged Optics Packaging Process Development EngineerSanta Clara, CAWork with cross-functional packaging teams and lead process development at foundry along with 2.5D/3D CoW process development with particular emphasis on chemistry development with packaging consumable suppliers at OSATs to bring packaging solutions from concept to prototypes and ramp to high volume manufacturing with aggressive cost reduction strategies. Highlights include an employee stock purchase plan with a 2-year look back, family support programs to help balance work and home life, robust mental health resources to prioritize emotional well-being, and a recognition and service awards to celebrate contributions and milestones.
NewAdvanced Packaging SI/PI Engineer ETCHED LLCAdvanced Packaging SI/PI EngineerSan Jose, CAKey ResponsibilitiesSI/PI analysis of designs and optimization within 2D/2.5D/3D packagesClose interaction with Package Layout Designers, ASIC PD and IP teams as well as Board Schematic/Layout/SI/PI teams to optimize the best electrical performanceDrive SI requirements into interposer/substrate layout (high‑speed routing: 112G/224G) from preliminary design through tape‑out. BenefitsMedical, dental, and vision packages with generous premium coverage$500 per month credit for waiving medical benefitsHousing subsidy of $2k per month for those living within walking distance of the officeRelocation support for those moving to San Jose (Santana Row)Various wellness benefits covering fitness, mental health, and moreDaily lunch and dinner in our officeHow we're differentEtched believes in the Bitter Lesson.
Semiconductor Packaging Modeling and Simulation Engineer onsemiSemiconductor Packaging Modeling and Simulation EngineerSan Jose, CAWith a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. As a semiconductor packaging modeling and simulation engineer, you will have the opportunities to support new power module development and new product design, assembly and process, quality and reliability, and customers in worldwide.
Advanced Packaging Technologist Google LLCAdvanced Packaging TechnologistSunnyvale, CAFrom software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Google Cloud, Google Global Networking, Data Center operations, systems research, and much more. As an advanced packaging technologist, you will develop advanced packaging solutions (2.5D/3D/3.5D) for ML chips, which involves collaborating with architects, Signal Integrity (SI)/Power Integrity (PI), thermal, and Printed Circuit Board (PCB) engineers to create high-performance packages optimized for electrical performance, reliability, and assembly.
Packaging Product Design Engineering Manager Apple IncPackaging Product Design Engineering ManagerCupertino, CAApple's approach to packaging is unique, so we value people who are eager to learn new skills and further improve their knowledge of packaging design, manufacturing processes, and sustainable materials. The Packaging PD team is a diverse group of people responsible for the design and execution of structural packaging for all Apple products - from shippers to finished goods boxes.
Principal/ Staff Engineer, Advanced Packaging Process Integration Applied Materials IncPrincipal/ Staff Engineer, Advanced Packaging Process IntegrationSanta Clara, CAThe SMTS will operate at the intersection of technology innovation, customer roadmaps, and ecosystem collaboration, translating emerging concepts into scalable, differentiated capabilities aligned with Applied Materials' long-term strategy. You will experiment, learn, and collaborate with some of the brightest minds in the semiconductor and display industries, partnering with our globally recognized R&D teams on state-of-the-art research and development projects.
Cloud Hardware Development, Packaging, Network Product Development - Optics Amazon.com IncCloud Hardware Development, Packaging, Network Product Development - OpticsCupertino, CAYou will perform high-quality design, development, validation, and sustaining engineering of IC and SOC packages for high-speed applications, working closely with design teams, manufacturing partners, and cross-functional stakeholders to deliver robust solutions at scale. Within AWS Networking the NPD (Network Product Development) organization is responsible for, designing the hardware, building the software, and owning the interconnects for the routers that power the global AWS network.
Packaging Design Engineer GooglePackaging Design EngineerSunnyvale, CAFrom software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Google Cloud, Google Global Networking, Data Center operations, systems research, and much more. Utilize advanced Three-Dimensional/Two-Dimensional Computer-Aided Design software (SolidWorks, Artios CAD, Creo, etc.) to architect complex structural packaging solutions and generate precise technical drawings, assembly instructions, and cushion layouts.
Lab Packaging Test Engineer I Engineer In Training (Swing Shift) Ryzen SolutionsLab Packaging Test Engineer I Engineer In Training (Swing Shift)San Jose, CA$66,560Perform testing duties within the designated workday hours according to requirements to ensure customer objectives are met through proactive communication, documentation, and customer service. Maintain responsive customer communication in email and in person regarding testing services provided, test status, updates, and results.
Lab Packaging Test Engineer I Engineer In Training (Swing Shift) Artech LLCLab Packaging Test Engineer I Engineer In Training (Swing Shift)San Jose, CA$66,560–$70,720 / yearPerform testing duties within the designated workday hours according to requirements to ensure customer objectives are met through proactive communication, documentation, and customer service. Maintain responsive customer communication in email and in person regarding testing services provided, test status, updates, and results.
Senior Power Integrity Engineer - LPU Packaging NVIDIA CorpSenior Power Integrity Engineer - LPU PackagingSanta Clara, CA$196,000–$310,500 / yearWe have some of the most forward-thinking and hardworking people in the world working with us and our product lines are growing fast in some of the hottest state-of-the-art fields such as Artificial Intelligence, Deep Learning, Autonomous Vehicles, and Robotics. A deep understanding of board-level PDN design, including stack-up definition, plane partitioning, and VRM placement on high-layer-count accelerator boards.
Senior Signal Integrity Engineer - LPU Packaging NVIDIA CorpSenior Signal Integrity Engineer - LPU PackagingSanta Clara, CADevelop and execute simulation flows for advanced packaging technologies, including 2.5D, 3D, and multi-die integration, with strong focus on channel loss, discontinuities, return path behavior, and crosstalk. We have some of the most forward-thinking and hardworking people in the world working for us and, due to unprecedented growth, our world-class engineering teams are growing fast.
Executive Director of R&D Engineering for 3DIC-Advance Packaging Synopsys IncExecutive Director of R&D Engineering for 3DIC-Advance PackagingSunnyvale, CALead the global engineering organization responsible for 3DIC silicon IP and advanced packaging design, covering layout, physical design, signal integrity, power integrity, thermal modeling, and mechanical stress analysis for AI infrastructure and HPC products. Experience working effectively in highly matrixed, global organizations, influencing across EDA development, product management, go-to-market, manufacturing, and customer success teams without direct reporting authority.
Manufacturing Design Engineer (MDE) - Packaging Apple IncManufacturing Design Engineer (MDE) - PackagingCupertino, CADevelop innovative solutions that enable Apple's Product and Environmental goals, including but not limited to manufacturability of fiber-based designs, lowering Apple's environmental footprint, and developing world class manufacturing solutions. (domestic and international up to 30%) A team player who is self-motived, defining and closing all engineering tasks to meet project objective, detailed oriented to cut to the root of problems, and ability to learn quickly with limited information or support.
Silicon Packaging Engineering Manager Intel CorpSilicon Packaging Engineering ManagerSanta Clara, CA$190,610–$269,100 / yearBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Minimum Qualifications: Bachelor's degree in Electrical Engineering or STEM related field with 9+ years of relevant experience OR- Master's degree in Electrical Engineering or STEM related field with 6+ years of relevant experience OR- PhD in Electrical Engineering or STEM related field with 4+ years of relevant experience.
Senior, Packaging Design Engineer Intuitive Surgical IncSenior, Packaging Design EngineerSunnyvale, CAThis individual will use sound engineering judgement and independently drive new product development (NPD) and sustaining engineering efforts through cross functional collaboration, ensuring designs meet stringent clinical, functional, global regulatory (FDA, ISO 11607, EU), and quality requirements. The Medical Device Packaging Design Engineer is a critical engineering role responsible for the design, development, verification, and launch of next-generation mechanical packaging systems for sterile and non-sterile medical devices such as surgical instruments, disposables, and electromechanical capital equipment.
Engineering Program Manager, Packaging Apple IncEngineering Program Manager, PackagingCupertino, CADrive day-to-day activities to meet overall project objectives; identify and direct all resources required to execute successful projects Collaborate and facilitate communication across engineering managers, operations managers, marketing managers, and our OEM partners to meet aggressive cost, schedule, and quality goals Understand technical issues and drive them to closure by bringing together key partners for decision-making Enable the development effort by creating and monitoring an efficient, streamlined process; redirect pitfalls and develop a better course of action Lead cross-functional communication between project teams and external vendors Provide timely issue resolution and critical path management Offer multiple levels of status across a wide spectrum of individual contributors to executive management Manage raw material development and ensure high aesthetic quality across products comprised of multiple materials5+ years of related packaging or mechanical background 5 years of combined experience in project management delivering products comprised of multiple materials and high aesthetic quality Knowledge of product development processes as well as a strong understanding of manufacturing processesProject Leadership & Management Proficient in creating and maintaining project timelines and developing product strategy Experience leading cross-functional communication between teams and external vendors Ability to identify and direct resources required to execute successful projects Ability to work on multiple projects simultaneously Core Skills & Attributes Excellent communication, organizational, and leadership skills with strong presentation abilities Self-motivated and proactive with demonstrated creative and critical thinking Ability to work in high-pressure, fast-paced environments; remain flexible and calm with ambiguity Technical & Process Knowledge Detailed knowledge of product development and manufacturing processes Understanding of technical issues with ability to drive closure by engaging key stakeholders Understanding of CAD/mechanical design (nice to have) Understanding of environmental initiatives and policies. This role provides an opportunity to work with a world-class team to deliver high-quality, first-class products at scale, ensuring a memorable and delightful introduction to Apple products.
Chip Packaging Architect GoogleChip Packaging ArchitectSunnyvale, CAFull timeYou will collaborate with product architects, design teams, and Signal Integrity/Power Integrity (SI/PI), thermal, mechanical, assembly, and Printed Circuit Board (PCB) engineers to create high-performance packages. As a Chip Packaging Architect on our Silicon Integration team, you will drive advanced packaging solutions (2.5D/3D/3.5D) and technologies for Machine Learning (ML) chips and custom Application-Specific Integrated Circuits (ASICs).
Director, Pricing and Packaging Strategy McAfee, LLCDirector, Pricing and Packaging StrategySan Jose, CaliforniaFull timeReporting to the Head of Pricing and partnering closely with executive leaders across Marketing, Retention, Product, and Retail, you’ll set the vision and frameworks that govern how we price, package, and promote across every channel and stage of the customer lifecycle – from acquisition through renewal – ensuring strategic coherence while maximizing long-term value. You’ll lead a high-impact pricing function, influence executive decisions on monetization strategy, and shape how millions of customers experience McAfee – from the first marketing touchpoint, through product packaging, into renewals and win-back, and across our retail ecosystem.
Packaging Structural Design Spec 3 RR Donnelley & Sons CoPackaging Structural Design Spec 3Santa Clara, CAMust have three (3) years of experience in/with: Client engagement and interfacing directly with clients and transforming ideas into shippable products and revenue; Identifying critical elements, variables, and alternatives to develop packaging design solutions; Structural design of packaging specifically for Precision Consumer Electronics packaging; Structural design experience in consumer product, educational, publishing, retail, consumer products, technology, or pharmaceutical markets; Handling packaging, manufacturing equipment, processes, and capabilities; and Working with packaging and prototyping equipment and processes; including. Manage whole design project including design creation, quick turn prototyping of various iterations of the design for review with the client, collaborating with global design and manufacturing team in Asia and India to ensure designs are manufacturable and can be automated easily, and conduct predictive product testing and analyze test data to predict design viability.
NewASIC Packaging Signal/Power Integrity Hardware Engineer (Hybrid) CiscoASIC Packaging Signal/Power Integrity Hardware Engineer (Hybrid)San Jose, CA$152,500–$219,200 / yearMinimum QualificationsBachelor's degree in Electrical Engineering and 4+ years of relevant signal and power integrity experience, or Master's degree in Electrical Engineering and 2+ years of relevant signal and power integrity experience, or PhD in Electrical Engineering and 0+ years of related experience, or equivalent related work experience. Cisco Silicon One is the only unifying silicon architecture in the market that enables customers to deploy the best‑of‑breed silicon from Top of Rack (TOR) switches all the way through web scale data centers and across service provider, enterprise networks, and data centers with a fully unified routing and switching portfolio.
Build and OS Packaging Technical Lead, Production Engineering Everpure, IncBuild and OS Packaging Technical Lead, Production EngineeringSanta Clara, CAIn this role, you will drive technical direction, raise engineering execution, and work closely with product, infrastructure, and release teams to improve build performance, reliability, and developer productivity. We have been named Fortune''s Best Workplaces in Technology, Fortune''s Best Workplaces in the Bay Area, and certified as a Great Place to Work!
Packaging Utility Worker Threshold Enterprises LtdPackaging Utility WorkerCASummary of Job Duties: Responsibility for this position include, assisting with the following processes: set-up, bottle filling, cotton and desiccant insertion, and capping, labeling, and packing of filled bottles. Complete all documentation required for packaging in a cGMP compliant manner, including: Packaging batch records (Travelers), box labels, room and equipment cleaning logbooks, and in-process documentation.
Packaging Utility Worker (2nd Shift) Threshold Enterprises LtdPackaging Utility Worker (2nd Shift)CASummary of Job Duties: Responsibility for this position include, assisting with the following processes: set-up, bottle filling, cotton and desiccant insertion, and capping, labeling, and packing of filled bottles. Complete all documentation required for packaging in a cGMP compliant manner, including: Packaging batch records (Travelers), box labels, room and equipment cleaning logbooks, and in-process documentation.
Nutrition, Food Science and Packaging Lecturer Pool California State UniversityNutrition, Food Science and Packaging Lecturer PoolCA$5,507–$5,959Lecturers are responsible for effective curriculum preparation and teaching of courses in alignment with our Department's vision and mission and the focus on applied research and serving multicultural populations, syllabus and accessibility compliance, review and grading of assignments and work, holding office hours, texts and readings, overall support of student learning and professional development, and working collaboratively with faculty and staff to promote student success. Demonstrated working knowledge of the trends in the nutrition profession in the context of diversity and globalization, including specializations with certain cultural and/or language groups; Ability to teach in online and in-person formats; Proficiency with computers, software, and technology; Experience with multimedia and social media relevant to teaching.