Staff Semi Packaging Engineer Analog DevicesStaff Semi Packaging EngineerSan Jose, CaliforniaADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls.
Principal Packaging Engineer Velaura AI IncPrincipal Packaging EngineerSunnyvale, CAStaff / Principal)On-site - Full-timeBangalore / Santa Clara, CADVApplyDesign Verification EngineerOn-site - Full-timeSanta Clara, CA / Austin, Texas / Boston, MAApplyDesign Verification Engineer- AI Accelerator LeadOn-site - Full-timeSanta Clara, CAApplyDesign Verification Engineer- CPUOn-site - Full-timeSanta Clara, CAApplySenior Design Verification EngineerOn-site - Full-timeSanta Clara, CAApplySenior Formal Verification EngineerOn-site - Full-timeSanta Clara, CAEmulationApplySenior Emulation EngineerOn-site - Full-timeSanta Clara, CAPerformanceApplyPerformance Modeling Architect - AI SystemsOn-site - Full-timeDurham, North Carolina / Santa Clara, CA / Boston, MA / Austin, TexasRTLApplyRTL DesignerOn-site - Full-timeSanta Clara, CAApplyRTL LeadOn-site - Full-timeSanta Clara, CAApplyRTL Power EngineerOn-site - Full-timeSanta Clara, CAApplySenior RTL EngineerOn-site - Full-timeSanta Clara, CASoftwareCompiler & ToolchainApplyAccelerator Compiler and Tool Chain LeadOn-site - Full-timeSanta Clara, CAPlatform SoftwareApplyPlatform Software Lead - Physical AIOn-site - Full-timeSanta Clara, CAApplyPrincipal AI SoC Runtime Software ArchitectOn-site - Full-timeSanta Clara, CA. Manager)On-site - Full-timeBangalore / Santa Clara, CAApplyPhysical Design Engineer (Staff / Sr.
NewSenior Electrical Engineer / Product Lead Advanced Semiconductor Packaging and Integration Macpower Digital Assets Edge Private LimitedSenior Electrical Engineer / Product Lead Advanced Semiconductor Packaging and IntegrationSanta Clara, CA$64 / hourIf you enjoy solving complex challenges in mixed-signal design, chiplet integration, and high-performance electronics , this role is for you. We are looking for a Senior Electrical Engineer with deep expertise in semiconductor design, advanced packaging, and ASIC development .
Senior IC Packaging Development Engineer NvidiaSenior IC Packaging Development EngineerSanta Clara, CAWith competitive salaries and a generous benefits package, we are widely considered to be one of the technology world's most desirable employers; we have some of the most forward-thinking and hardworking people in the world working for us and, due to unparalleled growth, best-in-class teams are rapidly growing. This will include planning & driving related R&D with multiple internal and external partners and you will be responsible for establishing advanced packaging processes needed to meet our NPI goals regarding packaging turn-around-time, reliability, and chip-package interaction.
Integrated Circuit - Packaging Architect Engineer Advanced Micro Devices, IncIntegrated Circuit - Packaging Architect EngineerSan Jose, CaliforniaSuccessful candidate would collaborate with product design teams and technology development partners to understand future product needs and define a packaging roadmap that includes architecture, process definition, Design for Manufacturing (DFM) and Design for Yield (DFY) guidelines. Responsibilities: The Role : Advanced packaging technology leader driving packaging architecture across client, server, gaming and GPU products.
Packaging Engineer LancesoftPackaging EngineerFoster City, CA$70–$96.30 / hourThis position resides within the Packaging Development team, with a primary focus on the development, qualification, and lifecycle management of controlled temperature (cold chain) packaging systems (thermal protection systems) to ensure product quality and regulatory compliance across global distribution of our pharmaceuticals and biologics products. Degree in industrial engineering, mechanical engineering, biomedical engineering, chemical engineering, package engineering, or a related scientific field.
Packaging Engineer I Exelixis Inc.Packaging Engineer IAlameda, CA$75,000–$106,500 / yearESSENTIAL DUTIES/RESPONSIBILITIES: Provide on-site/remote technical support for project activities such as commercial packaging, implementation/qualification of new packaging line equipment and introduction of components changes. EDUCATION/EXPERIENCE/KNOWLEDGE & SKILLS: Education: Bachelor's degree in related discipline and a minimum of 1 year of related experience; or, Equivalent combination of education and experience.
Advanced Packaging Integration Engineer Applied MaterialsAdvanced Packaging Integration EngineerSanta Clara, CA$161,000–$221,000 / yearJoin the Photonics Platform Business Group at Applied Materials located in Santa Clara headquarters, work with a high caliber cross-functional research team to develop advanced packaging solutions for next-generation smart glasses and high‑performance optical interconnects. In‑depth knowledge and hands‑on experience in advanced packaging technologies, including wafer‑to‑wafer or die‑to‑wafer hybrid bonding, semiconductor processing, 2.5D/3D integration, TSV, RDL, underfill, bumping, molding, and OSAT processes.
FEA Packaging Engineer CspeedFEA Packaging EngineerPalo Alto, CaliforniaOur executive team has a demonstrated track record of building and scaling category-defining semiconductor and infrastructure businesses at companies like Broadcom, Lumentum, Tesla, Apple, Samsung, Intel, and VMware. Expert proficiency in one commercial FEA or CFD tool and working proficiency in a second covering the other domain — for example Ansys Mechanical or Abaqus alongside Icepak, Fluent, Flotherm, or Celsius.
NewPackaging and Labeling Technician - Shockwave Medical 6947-SHOCKWAVE MEDICAL Legal EntityPackaging and Labeling Technician - Shockwave MedicalSanta Clara, CaliforniaAgile Manufacturing, Analytical Reasoning, Detail-Oriented, Equipment Maintenance, Good Manufacturing Practices (GMP), Issue Escalation, Manufacturing Equipment, Plant Operations, Predictive Maintenance, Problem Management, Process Oriented, Product Installation, Professional Ethics, Repair Management, Time Management, Troubleshooting . Employees and/or eligible dependents may be eligible to participate in the following Company sponsored employee benefit programs: medical, dental, vision, life insurance, short- and long-term disability, business accident insurance, and group legal insurance.
Senior Mechanical Engineer (Packaging And Integration) KLA CorporationSenior Mechanical Engineer (Packaging And Integration)Milpitas, CA$117,800–$200,300 / yearEnabling the movement towards advanced chip design, KLA's Global Products Group (GPG), which is responsible for creating all of KLA's metrology and inspection products, is looking for the best and the brightest research scientist, software engineers, application development engineers, and senior product technology process engineers. Our expert teams of physicists, engineers, data scientists and problem-solvers work together with the world's leading technology providers to accelerate the delivery of tomorrow's electronic devices.
Director, Product Line Manager - Advanced Packaging & Metrology (E) KLA CorporationDirector, Product Line Manager - Advanced Packaging & Metrology (E)Milpitas, CA$210,900–$369,100 / yearThis hybrid role blends technical depth with market insight, requiring leadership in both product management and strategic marketing and will be responsible for defining product strategy, driving customer adoption, and managing the full lifecycle of Advanced Packaging products. The ideal candidate will have extensive experience in advanced packaging, metrology, or inspection technologies, and a proven ability to lead and build cross-functional teams to deliver innovative solutions that meet evolving customer needs.
Sr. Technical Solutions Manager - Process Control & Yield Enhancement Software Solutions - (Advanced Packaging) (E) KLA CorporationSr. Technical Solutions Manager - Process Control & Yield Enhancement Software Solutions - (Advanced Packaging) (E)Milpitas, CA$138,500–$235,500 / yearMinimum 10+ years of experience in semiconductor manufacturing, product marketing, product management, applications engineering, yield engineering, process control, or related technical commercial roles. Doctorate (Academic) Degree and related work experience of 3 years; Master's Level Degree and related work experience of 6 years; Bachelor's Level Degree and related work experience of 8 years.
NewPackaging and Labeling Technician - Shockwave Medical Johnson & JohnsonPackaging and Labeling Technician - Shockwave MedicalSanta Clara, CaliforniaAgile Manufacturing, Analytical Reasoning, Detail-Oriented, Equipment Maintenance, Good Manufacturing Practices (GMP), Issue Escalation, Manufacturing Equipment, Plant Operations, Predictive Maintenance, Problem Management, Process Oriented, Product Installation, Professional Ethics, Repair Management, Time Management, Troubleshooting . Employees and/or eligible dependents may be eligible to participate in the following Company sponsored employee benefit programs: medical, dental, vision, life insurance, short- and long-term disability, business accident insurance, and group legal insurance.
NewPackaging And Labeling Technician - Shockwave Medical Johnson & JohnsonPackaging And Labeling Technician - Shockwave MedicalSanta Clara, CA$40,250–$64,802.50 / yearRequired Skills: Preferred Skills: Agile Manufacturing, Analytical Reasoning, Detail-Oriented, Equipment Maintenance, Good Manufacturing Practices (GMP), Issue Escalation, Manufacturing Equipment, Plant Operations, Predictive Maintenance, Problem Management, Process Oriented, Product Installation, Professional Ethics, Repair Management, Time Management, Troubleshooting. Employees and/or eligible dependents may be eligible to participate in the following Company sponsored employee benefit programs: medical, dental, vision, life insurance, short- and long-term disability, business accident insurance, and group legal insurance.
Advanced Packaging Engineer — Fiber Array Integration CspeedAdvanced Packaging Engineer — Fiber Array IntegrationPalo Alto, CaliforniaA permanently bonded fiber array constrains the downstream flow in three respects: the engine cannot be optically qualified before fiber attach, a single failed channel scraps an assembly containing multiple high-value die, and manual fiber handling limits automation. This position owns the detachable optical interface for CspeedIO optical engines: the on-package element, the coupling optics, the alignment features, and the high-volume assembly process that joins fiber to engine without per-unit active alignment.
Advanced Packaging Design Engineer MarvellAdvanced Packaging Design EngineerSanta Clara, CALead Si/package/PCB/system co-design work collaborating with downstream system design teams and upstream ASIC/PIC designers to develop a portfolio of packages that meets a huge range of performance design points, while optimizing re-use in other Marvell products. Highlights include an employee stock purchase plan with a 2-year look back, family support programs to help balance work and home life, robust mental health resources to prioritize emotional well-being, and a recognition and service awards to celebrate contributions and milestones.
Global Product Support (Gps) Engineer - Advanced Packaging Applied MaterialsGlobal Product Support (Gps) Engineer - Advanced PackagingSanta Clara, CA$124,000–$171,000 / yearIf you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. The successful candidate will serve as the primary equipment support engineer responsible for bringing the system from installation through process readiness while coordinating closely with Facilities, BESI, Applied Materials product engineering teams, and CTO process development teams.
NewPackaging Architect LightmatterPackaging ArchitectMountain View, CA$218,000–$317,000 / yearEvaluate and execute trade-offs across EIC/PIC layouts, die-to-die interfaces, fiber attachment methods, and packaging technologies, analyzing impact on performance, power efficiency, cost, manufacturability, and form factor. You will serve as a key technical decision-maker, driving architecture trade-offs, aligning stakeholders, and ensuring packaging solutions meet both engineering and business objectives across the full product lifecycle.
Intern, Optical Packaging And Characterization Engineer PsiQuantumIntern, Optical Packaging And Characterization EngineerMilpitas, CAOur application, software, and industry teams work directly with leading Fortune 500 companies-including Lockheed Martin, Mercedes-Benz, Boehringer Ingelheim, and Mitsubishi Chemical-to prepare quantum solutions for real-world impact. Support image processing workflows (e.g., contrast, alignment, feature extraction) using Python or similar tools and help turn results into clear tables or simple plots.