Silicon Packaging Design Engineer IntelSilicon Packaging Design EngineerChandler, ArizonaJob Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Arizona, Phoenix Additional Locations: US, Oregon, Hillsboro Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Substrate Packaging Defect Metro Tool Owner IntelSubstrate Packaging Defect Metro Tool OwnerChandler, ArizonaDirect next-generation tool installation, reaching major milestones-purchase-spec development, source inspection, design, pre-fac, Safety level approval, Supplier qual, Intel qual, etc.-by collaborating with diverse stakeholders. In this role, you will help drive innovation in EMIB-T, glass core, EMIB scaling, and panel-level packaging technologies for substrate as well as assembly test mfg (ATM) factories for Intel's IPG and IFS customers.
Silicon Photonics Component Design Engineer IntelSilicon Photonics Component Design EngineerRio Rancho, New MexicoExperience in one or more of the following areas: High-speed photonic devices, including optical modulators and photodetectors; Photonic design and simulation using tools such as Sentaurus, Silvaco, Lumerical, HFSS, ADS, RSoft, or equivalent; Photonic device testing and characterization; data analysis using MATLAB, Python, JMP, or similar tools; Photonic layout design using Cadence, KLayout, or comparable design environments. Our team is committed to expanding Intel Foundry's Silicon Photonics platform to support customer solutions across data center communications, co-packaged optics, and next-generation optical networking technologies ranging from 400G to 3.2T+ and beyond.
Packaging Module Equipment Development Engineer IntelPackaging Module Equipment Development EngineerChandler, ArizonaBachelor's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 2+ years of relevant experience OR Master's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 1+ years of relevant experience OR PhD in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field. With a legacy of relentless innovation and a commitment to bring smart, connected devices to every person on Earth, our diverse and brilliant teams are continually searching for tomorrow's technology and revel in the challenge that changing the world for the better brings.
Module Equipment Technician IntelModule Equipment TechnicianChandler, Arizona$60,450–$116,640 / yearWork from technical manuals, specifications, drawings/diagrams, schematics, written and verbal instructions utilizing a variety of tools, test equipment, problem solving techniques and communication. Must be willing to perform work in a cleanroom environment while wearing required PPE, including coveralls, hood, booties, safety glasses, gloves, and respirator (when required).
Foundry Device Engineer IntelFoundry Device EngineerHillsboro, Oregon$161,550–$317,600 / yearCollaborate with the Technology Development team to develop new device technologies and customize newly developed device architectures to meet specific foundry customer needs. Annual Salary Range for jobs which could be performed in the US: $161,550.00-317,600.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
OTF Failure Analysis Technician - Night Shift IntelOTF Failure Analysis Technician - Night ShiftChandler, Arizona$51,710–$99,770 / yearOperates Dual Beam FIB/PFIB to perform site-specific cross sectioning and prepare TEM samples, including site marking, depositing protective materials, de-layering, imaging and TEM lamella preparation. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates Experience listed below would be obtained through a combination of your schoolwork, classes, research and/or relevant previous job and/or internship experiences.
Enterprise Systems Analyst Intel Corp.Enterprise Systems AnalystHillsboro, OR$105,300–$175,210 / yearWe are looking for a seasoned Windchill PLM Business/Systems Analyst with experience gathering requirements, understanding of complex data structures, which will enable workflow capabilities for internal and supplier (external) users, and integrating with other planning, master data and enterprise systems. The Equipment Configuration Management Program team is chartered with delivering and maintaining capabilities around the creation and maintenance of a single source of record for equipment configurations of factory equipment and the respective bill of materials (BOM) in Windchill.
Partner Marketing Strategist - AI ISV IntelPartner Marketing Strategist - AI ISVHillsboro, California$121,130–$247,930 / yearCloud and Ecosystem Marketing Expertise: 6+ years of dedicated cloud marketing, partner marketing, or alliance marketing experience, with a strong preference for backgrounds working directly with or within Cloud Service Providers (CSPs), Neoclouds, or AI/ML-focused SaaS/Enterprise Software partners. Vertical Industry Marketing: Experience designing and executing marketing campaigns tailored to specific industry verticals (e.g., Financial Services, Healthcare, Retail, Manufacturing, or Public Sector) utilizing AI and cloud infrastructure to solve unique sector-specific challenges.
Silicon Photonics Component Design Engineer IntelSilicon Photonics Component Design EngineerRio Rancho, New Mexico$141,910–$269,100 / yearExperience in one or more of the following areas: High-speed photonic devices, including optical modulators and photodetectors; Photonic design and simulation using tools such as Sentaurus, Silvaco, Lumerical, HFSS, ADS, RSoft, or equivalent; Photonic device testing and characterization; data analysis using MATLAB, Python, JMP, or similar tools; Photonic layout design using Cadence, KLayout, or comparable design environments. Our team is committed to expanding Intel Foundry's Silicon Photonics platform to support customer solutions across data center communications, co-packaged optics, and next-generation optical networking technologies ranging from 400G to 3.2T+ and beyond.
Principal Engineer, Hybrid Bonding Module IntelPrincipal Engineer, Hybrid Bonding ModuleHillsboro, Oregon$211,400–$298,440 / yearJob Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Oregon, Hillsboro Additional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Your work will directly impact Intel's ability to execute advanced packaging roadmaps by delivering state-of-the-art hybrid bonding solutions with industry-leading performance, reliability, and cost efficiency, while shaping both internal strategy and the external ecosystem.
Enterprise Systems Analyst Intel Corp.Enterprise Systems AnalystPhoenix, AZ$105,300–$175,210 / yearWe are looking for a seasoned Windchill PLM Business/Systems Analyst with experience gathering requirements, understanding of complex data structures, which will enable workflow capabilities for internal and supplier (external) users, and integrating with other planning, master data and enterprise systems. The Equipment Configuration Management Program team is chartered with delivering and maintaining capabilities around the creation and maintenance of a single source of record for equipment configurations of factory equipment and the respective bill of materials (BOM) in Windchill.
NewDirector - Foundry Advanced Packaging Business Development IntelDirector - Foundry Advanced Packaging Business DevelopmentUs, California$221,810–$313,140 / yearIn this capacity, the primary focus for the leader will be to help build a world-class foundry business development and sales team with a service mindset, and be responsible for directly working with target customers to initiate and close on business engagements. Job Description: Intel Foundry Services is looking for a highly collaborative, influential and experienced leader, responsible for initiating business engagement on new opportunities with new and existing advanced packaging and test customers, and closing sales opportunities.
New Mexico WPM Manufacturing Technician Internship Intel Corp.New Mexico WPM Manufacturing Technician InternshipAlbuquerque, NM$46,700–$57,000 / yearThe position is a part-time (20-32 hours a week during the school year, up to 40 hours a week on breaks/summers) with flexible hours around a student's school schedule while still in alignment with a one of the following factory shifts: Shift 4: (nights frontend) 7 PM - 7 AM Sun-Tues and alternating Saturday nights. Minimum Requirements: Actively enrolled and progressing as a student pursuing an AAS Degree or certification in Automotive Technology, Aviation Technology, Electrical Trades, Heating/Ventilation/AC/Refrigeration, Industrial Automation Technology (Mechatronics), Machine Tool Technology or related field of study.
Enterprise Systems Analyst Intel Corp.Enterprise Systems AnalystSanta Clara, CA$105,300–$175,210 / yearWe are looking for a seasoned Windchill PLM Business/Systems Analyst with experience gathering requirements, understanding of complex data structures, which will enable workflow capabilities for internal and supplier (external) users, and integrating with other planning, master data and enterprise systems. The Equipment Configuration Management Program team is chartered with delivering and maintaining capabilities around the creation and maintenance of a single source of record for equipment configurations of factory equipment and the respective bill of materials (BOM) in Windchill.
Substrate Packaging Defect Metro Tool Owner Intel CorpSubstrate Packaging Defect Metro Tool OwnerChandler, AZ$103,730–$198,820 / yearDirect next-generation tool installation, reaching major milestones-purchase-spec development, source inspection, design, pre-fac, Safety level approval, Supplier qual, Intel qual, etc.-by collaborating with diverse stakeholders. In this role, you will help drive innovation in EMIB-T, glass core, EMIB scaling, and panel-level packaging technologies for substrate as well as assembly test mfg (ATM) factories for Intel's IPG and IFS customers.
Silicon Photonics Component Design Engineer Intel CorpSilicon Photonics Component Design EngineerRio Rancho, NM$141,910–$269,100 / yearExperience in one or more of the following areas: High-speed photonic devices, including optical modulators and photodetectors; Photonic design and simulation using tools such as Sentaurus, Silvaco, Lumerical, HFSS, ADS, RSoft, or equivalent; Photonic device testing and characterization; data analysis using MATLAB, Python, JMP, or similar tools; Photonic layout design using Cadence, KLayout, or comparable design environments. Our team is committed to expanding Intel Foundry's Silicon Photonics platform to support customer solutions across data center communications, co-packaged optics, and next-generation optical networking technologies ranging from 400G to 3.2T+ and beyond.
Metrology Engineering Technican Intel CorpMetrology Engineering TechnicanChandler, AZ$51,710–$99,770 / yearMinimum Qualifications: Candidates must meet one of the following education and experience requirements: Bachelor's degree in mechanical engineering, optical engineering, physics, electrical engineering, computer science or another applied engineering discipline with no experience. In this role, you will play a critical part in keeping our advanced manufacturing equipment running at peak performance, supporting engineering teams, and contributing to continuous improvement initiatives that directly impact production outcomes.
AI and Cloud Service Provider Account Executive Intel CorpAI and Cloud Service Provider Account ExecutiveAZ$178,520–$366,170 / yearCross-Functional Leadership: Partner closely with Cloud Solution Architects (CSAs), Intel Business Units, Cloud and OEM partners to influence future product roadmaps based on the unique needs of AI-native disruptors. You will operate at the intersection of deep technical engineering and executive business strategy, ensuring Intel's silicon and software roadmap aligns with the world's most demanding AI-as-a-Service and SaaS platforms across on-prem, Tier1 CSP and NeoCloud environments.
Senior GPU Performance Software Engineer IntelSenior GPU Performance Software EngineerHillsboro, Oregon$195,200–$275,580 / yearInstead, you will focus on developing highly optimized math primitives, parallel algorithms, and GPU kernels that power industry-leading AI frameworks (such as OpenVINO, TensorFlow, PyTorch, and ONNX Runtime) on Intel hardware. Performance Optimizations: 2+ years of hands-on experience in programming and kernel optimization on GPUs (via SYCL/DPC++, OpenCL, CUDA, or HIP), or at least 5+ years of similar low-level performance optimization experience on CPUs.