Platform Architecture Manager Intel Corp.Platform Architecture ManagerHillsboro, OR$190,610–$361,480 / yearUnder a single-umbrella of leadership, PWCAs responsibilities are focused on integrating UX research, ecosystem engagement, competitive analysis, UX workflow development, and data collection into a single operating model that improves PXA's ability to make fast, evidence-based architecture and roadmap decisions. Strong working knowledge of user experience research methods, including framing research questions, selecting appropriate qualitative and quantitative approaches, evaluating research quality, and translating findings into actionable experience and platform requirements.
Platform Architecture Manager Intel Corp.Platform Architecture ManagerFolsom, CA$190,610–$361,480 / yearUnder a single-umbrella of leadership, PWCAs responsibilities are focused on integrating UX research, ecosystem engagement, competitive analysis, UX workflow development, and data collection into a single operating model that improves PXA's ability to make fast, evidence-based architecture and roadmap decisions. Strong working knowledge of user experience research methods, including framing research questions, selecting appropriate qualitative and quantitative approaches, evaluating research quality, and translating findings into actionable experience and platform requirements.
Principal Engineer-Td Foundry Engineering Intel Corp.Principal Engineer-Td Foundry EngineeringHillsboro, OR$220,920–$311,890 / yearJob Details: Job Description: As the world's largest chip manufacturer, and a global leader in innovation and new technology, Intel strives to make every facet of semiconductor manufacturing state-of-the-art - from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. This high-impact role provides executive technical leadership, engages directly with customers, drives the success of multi-billion-dollar programs, and helps shape the future of the global semiconductor industry in the AI innovation era.
EDA Tools Software Engineer IntelEDA Tools Software EngineerHillsboro, Oregon$128,880–$245,160 / yearThe Test Chip Engineering(TCE) team is responsible for delivering and supporting engineering environments, EDA infrastructure, automation frameworks, parametric layout synthesis tools and development workflows that enable successful execution of design and technology development programs across multiple projects. You will work closely with design engineers, CAD teams, infrastructure partners, and tool vendors to improve engineering productivity, drive workflow modernization, and implement scalable solutions that improve the overall user experience.
Senior GPU Performance Software Engineer Intel Corp.Senior GPU Performance Software EngineerSanta Clara, CA$195,200–$275,580 / yearInstead, you will focus on developing highly optimized math primitives, parallel algorithms, and GPU kernels that power industry-leading AI frameworks (such as OpenVINO, TensorFlow, PyTorch, and ONNX Runtime) on Intel hardware. Performance Optimizations: 2+ years of hands-on experience in programming and kernel optimization on GPUs (via SYCL/DPC++, OpenCL, CUDA, or HIP), or at least 5+ years of similar low-level performance optimization experience on CPUs.
Process Integration And Yield Engineer Intel Corp.Process Integration And Yield EngineerPhoenix, AZ$103,730–$198,820 / yearMinimum Qualifications: BS degree in Electrical Engineering, Microelectronics Engineering, Material Science Engineering, Chemical Engineering, Mechanical Engineering, Optical Engineering, Statistics/Data Science, Chemistry, Physics or related STEM field of study with 4+ years of experience, or Master's degree with 3+ years of experience or a Ph. The role of a Process Integration and Yield Engineer is to deliver high-quality analytical insights that influences / directs the factory resources to minimize defects, control process parameters, and improve overall factory yields.
Construction Contracts Manager Intel Corp.Construction Contracts ManagerNew Albany, OH$151,900–$214,440 / yearJob Details: Job Description: As a Construction Contracts Manager, you will play a critical role in shaping Intel's supply chain strategy to secure best-in-class construction services, materials, and contractor partnerships. Experience supporting large-scale, technically complex construction projects, ideally within semiconductor, advanced manufacturing, data center, infrastructure, or other capital-intensive industries.
Platform Architecture Manager Intel Corp.Platform Architecture ManagerPhoenix, AZ$190,610–$361,480 / yearUnder a single-umbrella of leadership, PWCAs responsibilities are focused on integrating UX research, ecosystem engagement, competitive analysis, UX workflow development, and data collection into a single operating model that improves PXA's ability to make fast, evidence-based architecture and roadmap decisions. Strong working knowledge of user experience research methods, including framing research questions, selecting appropriate qualitative and quantitative approaches, evaluating research quality, and translating findings into actionable experience and platform requirements.
Operations Research Engineer Intel Corp.Operations Research EngineerHillsboro, OR$128,880–$211,200 / yearThese professionals build, develop, validate, and deploy mathematically-based decision algorithms, heuristics, optimization models, and simulation tools while working collaboratively with business units to identify root causes, define strategic and tactical requirements, and implement appropriate business and technical solutions. They identify and solve highly complex problems across factory performance, production loading, equipment optimization, decision science, and supply and distribution network operations, requiring deep understanding of fabrication (Fab) and assembly/test (A/T) environments combined with comprehensive supply chain expertise.
Transistor Reliability and Quality Engineer IntelTransistor Reliability and Quality EngineerHillsboro, OregonYou will collaborate closely with cross-functional teams including Process Integration, Device Engineering, Yield Engineering, and Product teams to drive quality and reliability excellence from early technology development through technology qualification and high-volume manufacturing readiness. - Drive transistor reliability characterization and certification activities including but not limited to: Hot Carrier Injection (HCI), Bias Temperature Instability (NBTI/PBTI), Time Dependent Dielectric Breakdown (TDDB).
Process Integration, Yield and Defect Reduction Engineering Lead Intel CorpProcess Integration, Yield and Defect Reduction Engineering LeadAlbuquerque, NM$140,830–$198,820 / yearIn this role, you will collaborate closely with Advanced Packaging High-Volume Manufacturing (HVM) engineering and factory operations teams to support the transfer, ramp, and sustainment of advanced packaging technologies. Job Details: Job Description: The New Mexico Silicon Manufacturing (NM Si Manufacturing) Integration Team is seeking a highly motivated engineering professional with a strong technical background to grow into a Process Integration (PI) Team Lead role.
Senior Software Application Development Engineer Intel CorpSenior Software Application Development EngineerFolsom, CA$117,620–$227,270 / yearWith a focus on scalability, AI advancement, and shaping the future, we provide an unparalleled blend of an industry-leading technology, a rich IP portfolio, a world-class design ecosystem, and an operationally resilient global manufacturing supply chain. This is an opportunity to solve complex technical challenges, transform manual processes into automated CI/CD pipelines, and make a tangible impact on customer support quality and delivery speed.
Silicon Packaging Design Engineer Intel CorpSilicon Packaging Design EngineerChandler, AZ$105,650–$149,150 / yearJob Details: Job Description: As a Silicon Packaging Design Engineer, you will play a pivotal role in driving the development of advanced substrate designs, contributing to the creation of cutting-edge technology that fuels Intel's innovation. This position provides an exciting opportunity to work collaboratively with silicon and hardware teams, directly impacting Intel's success in delivering world-class solutions for high-performance applications.
Senior Software Application Development Engineer Intel CorpSenior Software Application Development EngineerChandler, AZ$117,620–$227,270 / yearWith a focus on scalability, AI advancement, and shaping the future, we provide an unparalleled blend of an industry-leading technology, a rich IP portfolio, a world-class design ecosystem, and an operationally resilient global manufacturing supply chain. This is an opportunity to solve complex technical challenges, transform manual processes into automated CI/CD pipelines, and make a tangible impact on customer support quality and delivery speed.
Tool Install Manager Intel CorpTool Install ManagerChandler, AZ$140,220–$234,950 / yearThe Tool Install Manager will oversee programs with annual expenditures ranging from $500M to $1B and manage contractor workforces of 2,000 to 6,000 contingent workers, including general contractors, architecture and engineering firms, and specialized trade partners. Reporting to the Director of Construction, this position supports day-to-day operations across Intel's Virtual Factory portfolio and is accountable for project execution, supplier management, schedule performance, budget controls, and overall program success without disrupting factory operations.
NMSi Module Engineer IntelNMSi Module EngineerRio Rancho, New MexicoMinimum Qualifications: Candidates must possess one of the following: Bachelor's degree or higher in Chemistry, Materials Science, Physics, Chemical Engineering, or a related STEM field and 3+ years of semiconductor device fabrication or semiconductor manufacturing experience. During factory ramps, lead equipment installation, conversion, qualification, and readiness activities to ensure tools are installed safely, on schedule, and in compliance with all quality and manufacturing requirements.
Identity Security - PKI Engineer IntelIdentity Security - PKI EngineerChandler, ArizonaBachelor's degree in Systems Engineering, Cyber Security Engineering, Computer Engineering, Computer Science, Information Systems, or similar discipline and 3+ years of relevant experience in the required skills section OR a Master's degree in Systems Engineering, Cyber Security Engineering, Computer Engineering, Computer Science, Information Systems, or similar discipline field and 2+ years of relevant experience in the required skills section. With a legacy of relentless innovation and a commitment to bring smart, connected devices to every person on Earth, our diverse and brilliant teams are continually searching for tomorrow's technology and revel in the challenge that changing the world for the better brings.
NMSi Module Engineer IntelNMSi Module EngineerRio Rancho, New Mexico$103,730–$146,440 / yearMinimum Qualifications: Candidates must possess one of the following: Bachelor's degree or higher in Chemistry, Materials Science, Physics, Chemical Engineering, or a related STEM field and 3+ years of semiconductor device fabrication or semiconductor manufacturing experience. Annual Salary Range for jobs which could be performed in the US: $103,730.00-146,440.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
Identity Security - PKI Engineer Intel Corp.Identity Security - PKI EngineerPhoenix, AZ$105,300–$148,660 / yearBachelor's degree in Systems Engineering, Cyber Security Engineering, Computer Engineering, Computer Science, Information Systems, or similar discipline and 3+ years of relevant experience in the required skills section OR a Master's degree in Systems Engineering, Cyber Security Engineering, Computer Engineering, Computer Science, Information Systems, or similar discipline field and 2+ years of relevant experience in the required skills section. With a legacy of relentless innovation and a commitment to bring smart, connected devices to every person on Earth, our diverse and brilliant teams are continually searching for tomorrow's technology and revel in the challenge that changing the world for the better brings.
Back-End TD Reliability Lab Manager Intel CorpBack-End TD Reliability Lab ManagerChandler, AZ$180,770–$255,200 / yearYou will lead a team of 7-10 talented engineers, spearhead cross-functional efforts to resolve complex reliability and technology challenges, drive strong quality and operational excellence across the laboratory, and develop a high-performing organization focused on innovation and customer responsiveness. This site serves as the technology development hub for Intel's most advanced packaging technologies, including Hybrid Bond Interconnect (HBI), Embedded Multi-die Interconnect Bridge (EMIB-T), glass substrates, Foveros, and future advanced packaging innovations.