Senior Software Application Development Engineer Intel Corp.Senior Software Application Development EngineerFolsom, CA$117,620–$227,270 / yearWith a focus on scalability, AI advancement, and shaping the future, we provide an unparalleled blend of an industry-leading technology, a rich IP portfolio, a world-class design ecosystem, and an operationally resilient global manufacturing supply chain. This is an opportunity to solve complex technical challenges, transform manual processes into automated CI/CD pipelines, and make a tangible impact on customer support quality and delivery speed.
Semiconductor Manufacturing Engineer- F11x Production Intel Corp.Semiconductor Manufacturing Engineer- F11x ProductionAlbuquerque, NM$103,730–$146,440 / yearAs a key strategic partner to Captain of Ship (COS) and Remote Operations Center (ROC) Group Leaders, the Production Engineer helps develop and execute operational strategies that support both technology development and high-volume manufacturing objectives. This role drives factory operational excellence through the application of manufacturing science, factory physics, and data-driven decision-making to optimize Work-in-Process (WIP), cycle time, output, and overall manufacturing performance.
Process Integration And Defect Reduction Engineer Intel Corp.Process Integration And Defect Reduction EngineerAlbuquerque, NM$120,860–$170,630 / yearJob Details: Job Description: The New Mexico Silicon Manufacturing (NM Si Mfg) Yield Department is seeking Process Integration and Defect Reduction Engineers to support backend interconnect and advanced packaging semiconductor fabrication. You will be responsible for sustaining process health as products transition from development into high-volume manufacturing (HVM) while driving improvements in yield, quality, reliability, cost, and manufacturability.
Facilities Site Manager Intel Corp.Facilities Site ManagerPhoenix, AZ$191,220–$269,950 / yearThis role is part of Intel's Frontend Facilities Engineering and Operations (FFEO) organization, which is dedicated to providing innovative, sustainable, and efficient solutions that support Intel's business objectives and create an outstanding experience for employees. As a Facilities Engineering Manager, you will lead a team of managers, engineers, and technicians responsible for ensuring the structural, mechanical, electrical, and environmental integrity of Intel's corporate facilities.
Tool Install Manager Intel Corp.Tool Install ManagerPhoenix, AZ$140,220–$234,950 / yearThe Tool Install Manager will oversee programs with annual expenditures ranging from $500M to $1B and manage contractor workforces of 2,000 to 6,000 contingent workers, including general contractors, architecture and engineering firms, and specialized trade partners. Reporting to the Director of Construction, this position supports day-to-day operations across Intel's Virtual Factory portfolio and is accountable for project execution, supplier management, schedule performance, budget controls, and overall program success without disrupting factory operations.
Development Tools Software Arch IntelDevelopment Tools Software ArchUs, CaliforniaAs a trusted advisor for technical direction, you will engage with engineering partners, interact with technologists across Intel and the broader industry, and evaluate requirements to prioritize impactful developments. You will architect, design, and lead the development of innovative software tools—such as debuggers, analyzers, SDKs, IDEs, PDKs, and methodologies—that empower Intel to maintain its industry leadership.
Back-End TD Reliability Lab Manager Intel CorpBack-End TD Reliability Lab ManagerChandler, AZ$180,770–$255,200 / yearYou will lead a team of 7-10 talented engineers, spearhead cross-functional efforts to resolve complex reliability and technology challenges, drive strong quality and operational excellence across the laboratory, and develop a high-performing organization focused on innovation and customer responsiveness. This site serves as the technology development hub for Intel's most advanced packaging technologies, including Hybrid Bond Interconnect (HBI), Embedded Multi-die Interconnect Bridge (EMIB-T), glass substrates, Foveros, and future advanced packaging innovations.
Operations Research Engineer Intel Corp.Operations Research EngineerPhoenix, AZ$128,880–$211,200 / yearThese professionals build, develop, validate, and deploy mathematically-based decision algorithms, heuristics, optimization models, and simulation tools while working collaboratively with business units to identify root causes, define strategic and tactical requirements, and implement appropriate business and technical solutions. They identify and solve highly complex problems across factory performance, production loading, equipment optimization, decision science, and supply and distribution network operations, requiring deep understanding of fabrication (Fab) and assembly/test (A/T) environments combined with comprehensive supply chain expertise.
Back-End TD Reliability Lab Manager IntelBack-End TD Reliability Lab ManagerChandler, Arizona$180,770–$255,200 / yearYou will lead a team of 7-10 talented engineers, spearhead cross-functional efforts to resolve complex reliability and technology challenges, drive strong quality and operational excellence across the laboratory, and develop a high-performing organization focused on innovation and customer responsiveness. This site serves as the technology development hub for Intel's most advanced packaging technologies, including Hybrid Bond Interconnect (HBI), Embedded Multi-die Interconnect Bridge (EMIB-T), glass substrates, Foveros, and future advanced packaging innovations.
Rebates Global Process Owner Analyst Intel CorpRebates Global Process Owner AnalystFolsom, CA$116,160–$195,980 / yearThis role partners closely across CAO, IT, SMG regional reps, rebate analysts (RAs), and audit/compliance stakeholders to ensure scalable, well controlled execution and audit readiness as processes and tooling evolve. Partner with COE/controls stakeholders to ensure process changes remain SOX relevant, documented, and auditable, including alignment with audit expectations when introducing new technologies or changing operating models.
Back End( BE) Process Integration Engineer Intel CorpBack End( BE) Process Integration EngineerHillsboro, OR$103,730–$170,630 / yearJob Details: Job Description: As a global leader in innovation and new technology, we foster a collaborative, supportive, and exciting environment where the brightest minds in the world come together to achieve exceptional results. PhD in Electrical Engineering, Physics, Applied Physics, Materials Science, Chemical Engineering, Mechanical Engineering, Chemistry, Optics, or a closely related semiconductor field of study.
FCO Strategic/Development Functional Area Industrial Engineer Intel CorpFCO Strategic/Development Functional Area Industrial EngineerHillsboro, OR$120,860–$170,630 / yearKey Responsibilities • Collaborate with organizational leadership and cross-functional teams to analyze complex business data, identify risks and opportunities, and develop data-driven models and reports. You will work closely with organizational leadership and cross-functional teams to optimize capacity and capital, solve complex challenges, and influence business strategies with data-driven insights.
Module Engineer Intel Corp.Module EngineerPhoenix, AZ$76,390–$146,440 / yearMinimum Qualifications: Bachelor's degree with 1+ years of experience OR Master's degree with 6+ months of experience in Electrical Engineering, Chemistry, Chemical Engineering, Mechanical or related engineering STEM field. We provide benefits that promote a healthy, enjoyable life: excellent medical plans, wellness programs, and amenities, time off, recreational activities, discounts on various products and services, and much more creative perks that make Intel a Great Place to Work.
Data Center Manager IntelData Center ManagerHillsboro, Oregon$117,620–$227,270 / yearIn this role, you will play a critical part in designing, implementing, and maintaining the Data Center (DC) infrastructure that enables Intel to deliver world-class hardware and support Enterprise Services. Annual Salary Range for jobs which could be performed in the US: $117,620.00-227,270.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
Principal Engineer-Td Foundry Engineering Intel Corp.Principal Engineer-Td Foundry EngineeringPhoenix, AZ$220,920–$311,890 / yearJob Details: Job Description: As the world's largest chip manufacturer, and a global leader in innovation and new technology, Intel strives to make every facet of semiconductor manufacturing state-of-the-art - from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. This high-impact role provides executive technical leadership, engages directly with customers, drives the success of multi-billion-dollar programs, and helps shape the future of the global semiconductor industry in the AI innovation era.
Thin Films Module Development Engineer Intel Corp.Thin Films Module Development EngineerHillsboro, OR$133,800–$188,890 / yearJob Details: Job Description: Intel Foundry is seeking highly motivated Thin Films Metals Module Development Engineers to join the Technology Development (TD) organization to accelerate development of advanced process development for applications in high-k/metal gate, contact, and interconnect. With at least 1+ years of experience in: Working knowledge of one or more thin film deposition technologies such as ALD, CVD, PVD, sputtering, evaporation, electrochemical deposition, or related vacuum process technologies.
Lead Humanoid Robotics System Architect IntelLead Humanoid Robotics System ArchitectHillsboro, OregonArchitectural Expertise: Proven ownership of architectures bridging high-level AI models with real-time hardware control, alongside deep fluency in transformer inference constraints (quantization, action chunking, memory bandwidth walls) and real-time distributed systems (EtherCAT, zonal sensor pods, safety islands). Acting as the critical interface between large-scale vision-language-action (VLA) models and physical platforms, this senior leader defines hierarchical multi-system architecture requirements and drives the co-optimization of advanced AI models with physical hardware under tight power, thermal, latency, and memory-bandwidth constraints.
Module Equipment Technician Intel CorpModule Equipment TechnicianChandler, AZ$51,710–$85,340 / yearWork from technical manuals, specifications, drawings/diagrams, schematics, written and verbal instructions utilizing a variety of tools, test equipment, problem solving techniques and communication. Minimum Qualifications: The candidate must possess at least one of the following educational or experience requirements: HS/GED or higher non-semi degree AND 1+ year technical certification or related (1) trade school.
Module Equipment Technician Intel CorpModule Equipment TechnicianChandler, AZ$60,450–$116,640 / yearWork from technical manuals, specifications, drawings/diagrams, schematics, written and verbal instructions utilizing a variety of tools, test equipment, problem solving techniques and communication. Job Details: Job Description: As a Module Equipment Technician, you will play a critical role in Intel's high-tech manufacturing process, ensuring our tools are optimized for world-class production.
Semiconductor Manufacturing Engineer- F11X Production Intel CorpSemiconductor Manufacturing Engineer- F11X ProductionAlbuquerque, NM$103,730–$146,440 / yearAs a key strategic partner to Captain of Ship (COS) and Remote Operations Center (ROC) Group Leaders, the Production Engineer helps develop and execute operational strategies that support both technology development and high-volume manufacturing objectives. This role drives factory operational excellence through the application of manufacturing science, factory physics, and data-driven decision-making to optimize Work-in-Process (WIP), cycle time, output, and overall manufacturing performance.