Process Engineer - RF Test INTELProcess Engineer - RF TestLafayette, OR$172,200–$243,000 / yearAs a Senior HBI Module Development Engineer for Die-to-Wafer Hybrid Bonding (HBI), you will drive equipment development and manufacturability for next-generation hybrid bonding technologies, enabling Intel's leadership in advanced packaging for high-performance computing, AI, and chiplet architectures. You will bring deep technical expertise in hybrid bonding process or equipment engineering, contributing to both first-of-a-kind (FOK) platform development and optimization of manufacturing processes to support development and high-volume manufacturing environments.
Foundry Advanced Packaging Customer Engineer IntelFoundry Advanced Packaging Customer EngineerChandler, ArizonaAs a Foundry Platform Product Manager Advanced Packaging Customer Engineer, you will play a pivotal role in driving the development, launch, and management of cutting-edge semiconductor technologies and services. Your day-to-day responsibilities will include collaborating with cross-functional teams to define product strategies, aligning with market trends, and ensuring innovative solutions meet customer needs.
Product Manager - Data Center System and Manageability Software IntelProduct Manager - Data Center System and Manageability SoftwareHillsboro, CaliforniaIn this role, you will lead the strategy and execution for system software, firmware, telemetry, and out-of-band/in-band manageability capabilities, ensuring next-generation hyperscale and enterprise infrastructure operates reliably, securely, and efficiently at scale for Intel Datacenter GPUs. • Customer and Market Discovery: Drive deep technical discovery with cloud service providers (CSPs), enterprise customers, and OEMs/ODMs to translate complex infrastructure operational pain points into clear product requirements (PRDs).
Software Engineer – Datacenter IntelSoftware Engineer – DatacenterPhoenix, CaliforniaWith a legacy of relentless innovation and a commitment to bring smart, connected devices to every person on Earth, our diverse and brilliant teams are continually searching for tomorrow's technology and revel in the challenge that changing the world for the better brings. Bachelor's degree in Computer Science, Computer Engineering, or related field with 1+ years of hands-on experience in software development OR a Master's degree in Computer Science, Computer Engineering, or related field with no prior professional experience.
FSMS Systems Analyst Intel CorpFSMS Systems AnalystAloha, OR$105,300–$148,660 / yearFSMS Systems Analyst work focuses on designing information systems that are appropriate for users' needs and consistent with the overall design of the organization's information systems architecture. Bachelor's degree in a relevant field and 3+ years of hands-on experience in business systems analysis, OR a Master's degree in a relevant field with 2+ years of experience, OR a PhD in a relevant field.
Software QA Engineer IntelSoftware QA EngineerUs, CaliforniaBachelor’s degree in Computer Science, Software Engineering, Electrical/Computer Engineering, or a closely related technical discipline with 3+ years of hands-on experience in software quality engineering, validation, or software development; OR Master’s degree in a relevant technical field with 2+ years of experience; OR Ph. In this role, you will identify and isolate defects across software systems and tool interfaces, drive thorough root cause investigations, collaborate directly with software development and engineering teams, and champion quality engineering best practices across the development lifecycle.
Foundry Advanced Packaging Customer Engineer Intel CorpFoundry Advanced Packaging Customer EngineerAustin, TX$220,320–$311,040 / yearAs a Foundry Platform Product Manager Advanced Packaging Customer Engineer, you will play a pivotal role in driving the development, launch, and management of cutting-edge semiconductor technologies and services. Your day-to-day responsibilities will include collaborating with cross-functional teams to define product strategies, aligning with market trends, and ensuring innovative solutions meet customer needs.
Operations Research, Engineering Analytics Graduate Intern Intel CorpOperations Research, Engineering Analytics Graduate InternChandler, AZ$133,498–$133,502 / yearProjects may include developing and enhancing factory simulation models, building data pipelines and analytics solutions, conducting experiments, and supporting capacity, production, and operational decision making. Successful candidates will demonstrate strong quantitative problem-solving skills, programming experience in Python and SQL, and an interest in modeling complex manufacturing systems.
Foundry Advanced Packaging Customer Engineer Intel CorpFoundry Advanced Packaging Customer EngineerChandler, AZ$220,320–$311,040 / yearAs a Foundry Platform Product Manager Advanced Packaging Customer Engineer, you will play a pivotal role in driving the development, launch, and management of cutting-edge semiconductor technologies and services. Your day-to-day responsibilities will include collaborating with cross-functional teams to define product strategies, aligning with market trends, and ensuring innovative solutions meet customer needs.
Senior Analog Design Engineer Intel CorpSenior Analog Design EngineerSanta Clara, CA$141,910–$269,100 / yearMinimum Qualifications: M.S. degree in Electrical Engineering or a related field with 4+ years of industry experience or PhD & 2+ years in the following: Hands-on experience designing high-speed circuit blocks such as amplifiers, drivers, equalizers, PLLs, phase interpolators, and clock and data recovery (CDR) circuits for data rates of 32 Gbps and above. With a legacy of relentless innovation and a commitment to bring smart, connected devices to every person on Earth, our diverse and brilliant teams are continually searching for tomorrow's technology and revel in the challenge that changing the world for the better brings.
Foundry Advanced Packaging Customer Engineer Intel CorpFoundry Advanced Packaging Customer EngineerSanta Clara, CA$220,320–$311,040 / yearAs a Foundry Platform Product Manager Advanced Packaging Customer Engineer, you will play a pivotal role in driving the development, launch, and management of cutting-edge semiconductor technologies and services. Your day-to-day responsibilities will include collaborating with cross-functional teams to define product strategies, aligning with market trends, and ensuring innovative solutions meet customer needs.
Foundry Advanced Packaging Customer Engineer Intel CorpFoundry Advanced Packaging Customer EngineerHillsboro, OR$220,320–$311,040 / yearAs a Foundry Platform Product Manager Advanced Packaging Customer Engineer, you will play a pivotal role in driving the development, launch, and management of cutting-edge semiconductor technologies and services. Your day-to-day responsibilities will include collaborating with cross-functional teams to define product strategies, aligning with market trends, and ensuring innovative solutions meet customer needs.
Module Engineering PhD Intern Summer 2027 Intel CorpModule Engineering PhD Intern Summer 2027Hillsboro, OR$120,898–$120,902 / yearAdvanced transistor device structures and architectures including fabrication (Atomic Layer Deposition, Chemical Vapor Deposition, Rapid Thermal Annealing, Ion Implantation, Surface treatments and modification) with in-depth knowledge of semiconductor device physics and process integration. By working collaboratively, the team supports Intel's broader mission of driving innovation and delivering high-quality solutions to meet global technological demands.
Foundry Advanced Packaging Customer Engineer Intel CorpFoundry Advanced Packaging Customer EngineerPhoenix, AZ$220,320–$311,040 / yearAs a Foundry Platform Product Manager Advanced Packaging Customer Engineer, you will play a pivotal role in driving the development, launch, and management of cutting-edge semiconductor technologies and services. Your day-to-day responsibilities will include collaborating with cross-functional teams to define product strategies, aligning with market trends, and ensuring innovative solutions meet customer needs.
Senior Analog Design Engineer Intel CorpSenior Analog Design EngineerSanta Clara, CA$122,440–$232,190 / yearMinimum Qualifications: M.S. degree in Electrical Engineering or a related field with 3+ years of industry experience or PhD & 0 years in the following: Hands-on experience designing high-speed circuit blocks such as amplifiers, drivers, equalizers, PLLs, phase interpolators, and clock and data recovery (CDR) circuits for data rates of 32 Gbps and above. With a legacy of relentless innovation and a commitment to bring smart, connected devices to every person on Earth, our diverse and brilliant teams are continually searching for tomorrow's technology and revel in the challenge that changing the world for the better brings.
Senior Design Verification Engineer - Neuromorphic Computing Intel CorpSenior Design Verification Engineer - Neuromorphic ComputingFolsom, CA$122,440–$232,190 / yearOur Loihi series of research chips pioneered event-driven, sparse, and massively parallel neuro-inspired processing, fueling over 100 peer-reviewed publications that validate the promise of this novel approach. You will create application-driven workloads using high-level software APIs while also developing robust HDL-based verification environments that ensure correctness at the lowest levels of hardware implementation.
Senior SoC Physical Layout & Full-Chip Integration Engineer Intel CorpSenior SoC Physical Layout & Full-Chip Integration EngineerHillsboro, OR$122,440–$232,190 / yearAs a member of the X-Chip Full-Chip Integration team, you will play a key role in developing custom layout methodologies, leading full-chip physical integration, and driving physical verification and tapeout execution for advanced testchip and silicon lead vehicles on cutting-edge process technologies. Join the Design Technology Platform (DTP) organization within Intel Foundry and help drive the development of the methodologies, physical layouts, and silicon platforms that enable next-generation semiconductor technologies.
Packaging Technology Development Graduate Intern Intel Corp.Packaging Technology Development Graduate InternPhoenix, AZ$120,898–$120,902 / yearThrough hands-on experience with cutting-edge equipment and process optimization, you will collaborate with engineering teams to address challenges, explore innovative solutions, and play a key role in shaping the future of technology. Our group focuses on optimizing processes and equipment for high-quality production, supporting Intel's broader goals of delivering innovative solutions for global technology challenges.
Fsms Systems Analyst Intel Corp.Fsms Systems AnalystAlbuquerque, NM$105,300–$148,660 / yearFSMS Systems Analyst work focuses on designing information systems that are appropriate for users' needs and consistent with the overall design of the organization's information systems architecture. Bachelor's degree in a relevant field and 3+ years of hands-on experience in business systems analysis, OR a Master's degree in a relevant field with 2+ years of experience, OR a PhD in a relevant field.
FSMS Systems Analyst IntelFSMS Systems AnalystAloha, Oregon$105,300–$148,660 / yearFSMS Systems Analyst work focuses on designing information systems that are appropriate for users' needs and consistent with the overall design of the organization's information systems architecture. Bachelor's degree in a relevant field and 3+ years of hands-on experience in business systems analysis, OR a Master's degree in a relevant field with 2+ years of experience, OR a PhD in a relevant field.