Soc Verification Engineer Intel Corp.Soc Verification EngineerHillsboro, OR$141,910–$200,340 / yearBachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, with 4+ years of hands-on experience in SoC design verification, including demonstrated expertise in OVM/UVM methodologies, debugging, and test planning. Master's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, with 3+ years of hands-on experience in SoC design verification, including demonstrated expertise in OVM/UVM methodologies, debugging, and test planning.
Staff Chemical Mechanical Planarization (Cmp) Engineer Intel Corp.Staff Chemical Mechanical Planarization (Cmp) EngineerHillsboro, OR$133,800–$255,200 / yearAdditional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Memory Circuit Design Engineer Intel Corp.Memory Circuit Design EngineerSanta Clara, CA$122,440–$232,190 / yearYou will be partnering with and leveraging domain experts across various areas of technology development, EDA vendors and product design teams to develop and deliver high-quality industry-leading memory technology collaterals and to drive circuit innovations that enable next generation high-performance, high-density, low-power embedded memory designs on Intel advanced CMOS process technologies. Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly.
Asic And Custom Silicon Sales Leader Intel Corp.Asic And Custom Silicon Sales LeaderFolsom, CA$454,230–$641,270 / yearJob Details: Job Description: Intel is seeking a highly strategic Custom ASIC Sales Leader to build a global team of expert custom silicon and ASIC sales specialists focused on identifying, shaping, and winning custom opportunities with our largest and most strategic customers. This leader will define and execute a worldwide go-to-market motion for custom silicon engagements, align deeply with customer roadmaps, and translate complex market requirements into high-value custom silicon business opportunities for Intel.
Lab Engineering Technician IntelLab Engineering TechnicianChandler, Arizona$63,090–$102,790 / yearIn this role, you will support engineering teams by preparing samples, executing experimental measurements, maintaining lab equipment, and helping develop new tools, fixtures, and test methods. Annual Salary Range for jobs which could be performed in the US: $63,090.00-102,790.00 USD (Hourly Role)The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
High Speed PHY System Architect Intel Corp.High Speed PHY System ArchitectSanta Clara, CA$164,470–$311,890 / yearBusiness group: The Central Engineering Group (CEG) is Intel's data-driven organization that builds scalable engineering solutions across three pillars: Product Enablement (IP, tools, and methodologies), Custom ASIC (leveraging existing IP for custom silicon), and Foundry Enablement (supporting top customers and validating technologies). Job Details: Job Description: Responsibilities will include but are not limited to: Develop and drive analog and mixed-signal IP architectures, signal processing algorithms, and calibration algorithms for system-on-chip (SoC) independent AMS IPs.
Design Verification Engineer IntelDesign Verification EngineerUs, CaliforniaJob Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, California, Santa Clara Additional Locations: Business group: The Central Engineering Group (CEG) is Intel's data-driven organization that builds scalable engineering solutions across three pillars: Product Enablement (IP, tools, and methodologies), Custom ASIC (leveraging existing IP for custom silicon), and Foundry Enablement (supporting top customers and validating technologies). The team focuses on customer-driven, end-to-end solutions with short development cycles to deliver measurable business impact across Intel's product and foundry businesses.
Sales Engineer - Dallas, TX IntelSales Engineer - Dallas, TXTexasExhibits solid understanding of key technology trends, industry segments and Intel's product lines to develop technically advanced solutions that help solve customer business problems, while creating significant pull for Intel's products and solutions. Business Acumen/Industry Knowledge: Understand the customers business (priorities, pressures, competition, growth strategy, business imperatives) and how Intel technologies apply to Oil and Gas, FSI, Retail, Transportation and Manufacturing.
Senior Technologist, Hybrid Bonding Module Intel Corp.Senior Technologist, Hybrid Bonding ModuleHillsboro, OR$180,770–$255,200 / yearAdditional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. As a Senior Technologist for Die-to-Wafer Hybrid Bonding (HBI), you will drive process and equipment development for next-generation hybrid bonding technologies, enabling Intel's leadership in advanced packaging for high-performance computing, AI, and chiplet architectures.
SW engineer - Silicon CAD tool development IntelSW engineer - Silicon CAD tool developmentUs, California$149,600–$211,200 / yearChassis refers to non-compute infrastructure in any SoC, which provides essential platform services and typically includes interconnects, protocol bridges, clock/reset/power, security, debug/trace/analytics (DTA), RAS error logic, address maps, firmware tables, and more. The chassis automation tool collects user requirements and translates them into detailed parameters representing topology, then generates RTL, register definitions, integration, and verification collateral for the chassis using highly parameterized and configurable sub-components.
Materials Program Manager Intel Corp.Materials Program ManagerAlbuquerque, NM$76,780–$152,460 / yearBy translating manufacturing, market dynamics, and business requirements into strategic actions, you will play a pivotal role in risk assessment, inventory optimization, supply chain reliability, and cost management. Partner with cross-functional teams across project/program management, engineering, supply chain, and manufacturing to define customer demand and establish early raw materials requirements.
Data Center Manager Intel CorpData Center ManagerFolsom, CA$160,980–$227,270 / yearIn this role, you will play a critical part in designing, implementing, and maintaining the Data Center (DC) infrastructure that enables Intel to deliver world-class hardware and support Enterprise Services. You will collaborate closely with development, and enterprise teams to ensure efficient DC operations while continuously improving the automation, reliability, and velocity of our delivery pipeline.
Senior AI Software Engineer - Neuromorphic Computing IntelSenior AI Software Engineer - Neuromorphic ComputingHillsboro, OregonContribute across all levels of the stack from drivers to runtime to AI framework integration in collaboration with hardware, software and solution architects to deliver robust, efficient, scalable software solutions that enable customers to build high-performance physical AI applications powered by Intel's neuromorphic technology. Job Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Oregon, Hillsboro Additional Locations: US, California, Santa Clara, US, Texas, Austin Business group: Intel makes possible the most amazing experiences of the future.
Advanced Packaging Dry Etch Module Development Engineer IntelAdvanced Packaging Dry Etch Module Development EngineerHillsboro, Oregon$133,800–$255,200 / yearJob Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Oregon, Hillsboro Additional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
TD Media And Collaterals Development Engineer Intel Corp.TD Media And Collaterals Development EngineerPhoenix, AZ$115,110–$162,500 / yearAdditional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Preferred Qualifications: • Strong mechanical design software experience (SolidWorks, AutoCAD, etc) • Portfolio of self-completed project examples from concept to fabrication • Assembly equipment, process, media, and/or collateral experience • Technical innovation and deliver results for complex, time critical technical projects.
AI Software Engineer Graduate Intern Intel CorpAI Software Engineer Graduate InternAZ$113,500–$153,600 / yeareducation level classes, and current level school classes, projects, research, and relevant previous job and/or internship experience. gain hands-on experience, deepen your technical expertise, and build valuable skills while exploring potential career paths in a collaborative and innovative.
EDA Tools SW Engineer Intel CorpEDA Tools SW EngineerSanta Clara, CA$173,660–$330,340 / yearThe Technical Lead position within the Design Enablement (DTP) organization of Intel Foundry is a Design Enablement Applications and Support Technical Lead position chartered to lead a team that drives customer solutions for ASIC tools/flows and Physical verification/runsets, Tape-in Verification and IP sign off for test chips when customers use Intel PDK collaterals in these domains. The job requires partnering and leveraging domain experts across various areas of Technology Development, EDA vendors and product design teams (internal to Intel and external) to deliver quality solutions.
EDA Tools SW Engineer Intel CorpEDA Tools SW EngineerHillsboro, ORThe Technical Lead position within the Design Enablement (DTP) organization of Intel Foundry is a Design Enablement Applications and Support Technical Lead position chartered to lead a team that drives customer solutions for ASIC tools/flows and Physical verification/runsets, Tape-in Verification and IP sign off for test chips when customers use Intel PDK collaterals in these domains. The job requires partnering and leveraging domain experts across various areas of Technology Development, EDA vendors and product design teams (internal to Intel and external) to deliver quality solutions.
Advanced Packaging Quality and Reliability Engineer IntelAdvanced Packaging Quality and Reliability EngineerRio Rancho, New Mexico$89,010–$146,440 / yearAs a Manufacturing Quality and Reliability Engineer in New Mexico, you will play a critical role in ensuring the quality and reliability of Intel's products and processes during manufacturing ramps to high-volume production. Annual Salary Range for jobs which could be performed in the US: $89,010.00-146,440.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
Senior AI Software Engineer - Neuromorphic Computing Intel Corp.Senior AI Software Engineer - Neuromorphic ComputingHillsboro, OR$149,750–$275,580 / yearContribute across all levels of the stack from drivers to runtime to AI framework integration in collaboration with hardware, software and solution architects to deliver robust, efficient, scalable software solutions that enable customers to build high-performance physical AI applications powered by Intel's neuromorphic technology. 3+ years of experience developing AI compiler, runtime, performance, or systems software, including execution environments, profiling, or debugging infrastructure in frameworks like ONNX, IREE, OpenVINO, TVM, MLIR, XLA.