NewDry Etch module development engineer INTELDry Etch module development engineerLafayette, OR$148,100–$209,100 / yearExperience with advanced dry etch technologies such as: ICP / CCP plasma etch, High aspect ratio etch (HARC), Atomic Layer Etch (ALE), Radical and Vapor phase isotropic etching, Ash and surface treatments, EUV patterned layer etch integration. You will operate in a high impact space, partnering closely with cross functional teams (Process Integration, Manufacturing, Equipment Engineering, Yield/Defect Engineering, and suppliers) to solve complex technical challenges and establish long term systems that sustain performance.
NewModule Development Engineer INTELModule Development EngineerVernonia, OR$127,400–$179,900 / yearSee Intel Privacy Policy at https://www.intel.com/content/www/us/en/privacy/intel-privacy-notice.html and SonicJobs Privacy Policy at https://www.sonicjobs.com/us/privacy-policy and Terms of Use at https://www.sonicjobs.com/us/terms-conditions. PhD in a STEM discipline such as Electrical Engineering, Materials Science, Applied Physics, Chemical Engineering, Chemistry, or a closely related field with at least 6+ months relevant experience.
NewProcess Engineer - RF Test INTELProcess Engineer - RF TestLafayette, OR$172,200–$243,000 / yearAs a Senior HBI Module Development Engineer for Die-to-Wafer Hybrid Bonding (HBI), you will drive equipment development and manufacturability for next-generation hybrid bonding technologies, enabling Intel's leadership in advanced packaging for high-performance computing, AI, and chiplet architectures. You will bring deep technical expertise in hybrid bonding process or equipment engineering, contributing to both first-of-a-kind (FOK) platform development and optimization of manufacturing processes to support development and high-volume manufacturing environments.
NewDry Etch module development engineer INTELDry Etch module development engineerPortland, OR$148,100–$209,100 / yearExperience with advanced dry etch technologies such as: ICP / CCP plasma etch, High aspect ratio etch (HARC), Atomic Layer Etch (ALE), Radical and Vapor phase isotropic etching, Ash and surface treatments, EUV patterned layer etch integration. You will operate in a high impact space, partnering closely with cross functional teams (Process Integration, Manufacturing, Equipment Engineering, Yield/Defect Engineering, and suppliers) to solve complex technical challenges and establish long term systems that sustain performance.
NewYield Development Engineer INTELYield Development EngineerHillsboro, OR$148,100–$209,100 / yearPreferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates Experience listed below would be obtained through a combination of your schoolwork, classes, research and/or relevant previous job and/or internship experiences. Collaborating with cross-functional teams, you will develop methods and tools to analyze vast data sets, identify yield limiters, and implement process changes that enable Intel to achieve its yield milestones.
NewAdvanced Packaging Engineer INTELAdvanced Packaging EngineerHillsboro, OR$148,100–$209,100 / yearThe successful candidate will be responsible for developing, optimizing, and implementing dry etch processes for next-generation semiconductor packaging technologies including 2.5D/3D integration, chiplet packaging, and heterogeneous integration solutions. See Intel Privacy Policy at https://www.intel.com/content/www/us/en/privacy/intel-privacy-notice.html and SonicJobs Privacy Policy at https://www.sonicjobs.com/us/privacy-policy and Terms of Use at https://www.sonicjobs.com/us/terms-conditions.
Sr. Machine Learning Engineer Intel Corp.Sr. Machine Learning EngineerHillsboro, OR$195,200–$361,200 / yearThis role sits at the intersection of research and engineering: the ideal candidate designs and implements algorithms for agent harness and post-training pipelines, develops RL environments and reward models, and conducts training runs to improve model capabilities for agentic applications. Small, efficient models run directly on the user's machine (AI PC, edge, on-prem, and beyond), keeping data private and token costs low, while powerful cloud models handle the hardest work: planning, reasoning, and complex problem-solving.
Principal Engineer, AMS IP Architecture Intel CorpPrincipal Engineer, AMS IP ArchitectureHillsboro, OR$220,920–$311,890 / yearD. in Electrical Engineering, Computer Engineering, or a related field with focus on high-speed communications, analog circuits, or signal processing • Deep expertise in one or more of the following: SerDes modeling in MATLAB or Simulink, high-speed analog CMOS design, DSP techniques for SerDes equalization and timing recovery, or communications theory including equalization, coding, and noise filtering • Experience analyzing and closing link budgets for NRZ or PAM4 signaling at 100Gbps or higher, accounting for transmitter impairments, channel loss, reflection, crosstalk, and receiver noise • Hands-on work with SerDes transmitter and receiver architectures, equalization techniques such as FFE, DFE, and CTLE, or CDR loop dynamics and jitter tolerance • Ability to correlate models with silicon measurements, debug discrepancies systematically, and update models to reflect real-world behavior • Familiarity with C, Verilog-A, or SystemVerilog for co-simulation or algorithm prototyping is a plus. Business group: The Central Engineering Group (CEG) is Intel''s data-driven organization that builds scalable engineering solutions across three pillars: Product Enablement (IP, tools, and methodologies), Custom ASIC (leveraging existing IP for custom silicon), and Foundry Enablement (supporting top customers and validating technologies).
Director, Silicon Design Engineering Intel CorpDirector, Silicon Design EngineeringHillsboro, OR$220,920–$311,890 / yearBusiness group: The Central Engineering Group (CEG) is Intel''s data-driven organization that builds scalable engineering solutions across three pillars: Product Enablement (IP, tools, and methodologies), Custom ASIC (leveraging existing IP for custom silicon), and Foundry Enablement (supporting top customers and validating technologies). The team focuses on customer-driven, end-to-end solutions with short development cycles to deliver measurable business impact across Intel''s product and foundry businesses.
ASIC and Custom Silicon Sales Account Manager - Americas region Intel CorpASIC and Custom Silicon Sales Account Manager - Americas regionSanta Clara, CA$215,180–$366,170 / yearThis role will help define and execute a regional go-to-market motion for custom silicon engagements in alignment with overall Intel worldwide ASIC and Custom Silicon strategy - set by the sales leader, in alignment with regional account teams, business unit, and regional customer's roadmaps. Additional Locations: Business group: The Sales and Marketing Group (SMG) leverages the product portfolio to drive Intel''s revenue growth and market expansion, blending strategic initiatives with dynamic sales efforts to capture and retain customers.
Supply Chain Engineer Intel CorpSupply Chain EngineerAlbuquerque, NM$140,830–$198,820 / yearAdditional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Responsible to work with factory modules and factory leadership to improve cost structures, drive performance to outcome based contracts, and identify cost savings contracting opportunities across the functional areas within the local factory.
Ocotillo Technology Fabrication Litho Resist Track Module Engineer Intel CorpOcotillo Technology Fabrication Litho Resist Track Module EngineerChandler, AZ$103,730–$198,820 / yearAdditional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. During factory ramps, owns equipment install/conversion and qualification to ensure tools are installed safely and on schedule, while meeting all quality/matching criteria (from design through Safety Level 1 and Safety Level Supplier milestones, Intel qual and manufacturing readiness processes).
Facilities Mechanical Technician Intel CorpFacilities Mechanical TechnicianChandler, AZ$72,680–$140,590 / yearAdditional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Principal Collateral Device Engineer Intel CorpPrincipal Collateral Device EngineerPhoenix, AZ$224,970–$317,600 / yearBusiness group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Advanced Packaging Process Integration Engineer Intel CorpAdvanced Packaging Process Integration EngineerAlbuquerque, NM$120,860–$170,630 / yearAdditional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. Bachelor's degree in Engineering, Material Science, Physics, or a related field with 4 or more years of relevant experience, or a Master's degree in Engineering, Material Science, Physics, or a related field with 3 or more years of relevant experience, or a PhD in Engineering, Material Science, Physics, or a related field with no experience.
Director of Data Governance and Operations Intel CorpDirector of Data Governance and OperationsHillsboro, OR$172,410–$338,110 / yearBusiness group: The Corporate Planning Group (CPG) is the strategic heartbeat of Intel, acting as catalyst for innovation and transformation, guiding the company towards achieving its vision and maintaining a competitive edge in the marketplace. The Director will play a pivotal role in ensuring that business requirements are thoroughly understood and effectively translated into IT solutions, with a keen vision for business process management and transformation.
Hardware Platform Applications Engineer - Military & Aerospace Intel CorpHardware Platform Applications Engineer - Military & AerospaceSanta Clara, CA$122,440–$232,190 / yearHarnessing the capability of the cloud, the ubiquity of the Internet of Things, the latest advances in memory and programmable solutions, and the promise of always-on 5G connectivity, Intel is disrupting industries and solving global challenges. In the Hardware Platform Applications Engineer role, your responsibilities would include but not be limited to: Directly engaging customers to provide support for customer developed systems including providing on-site power on support.
Hardware Platform Applications Engineer - Military & Aerospace Intel CorpHardware Platform Applications Engineer - Military & AerospaceChandler, AZ$122,440–$232,190 / yearHarnessing the capability of the cloud, the ubiquity of the Internet of Things, the latest advances in memory and programmable solutions, and the promise of always-on 5G connectivity, Intel is disrupting industries and solving global challenges. In the Hardware Platform Applications Engineer role, your responsibilities would include but not be limited to: Directly engaging customers to provide support for customer developed systems including providing on-site power on support.
Memory Circuit Design Engineer Intel CorpMemory Circuit Design EngineerHillsboro, OR$122,440–$232,190 / yearYou will be partnering with and leveraging domain experts across various areas of technology development, EDA vendors and product design teams to develop and deliver high-quality industry-leading memory technology collaterals and to drive circuit innovations that enable next generation high-performance, high-density, low-power embedded memory designs on Intel advanced CMOS process technologies. Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly.
IP Design Verification Engineer Intel CorpIP Design Verification EngineerHillsboro, OR$141,910–$200,340 / yearBusiness group: The Central Engineering Group (CEG) is Intel''s data-driven organization that builds scalable engineering solutions across three pillars: Product Enablement (IP, tools, and methodologies), Custom ASIC (leveraging existing IP for custom silicon), and Foundry Enablement (supporting top customers and validating technologies). The team focuses on customer-driven, end-to-end solutions with short development cycles to deliver measurable business impact across Intel''s product and foundry businesses.