NewAdvanced Packaging SI/PI Engineer ETCHED LLCAdvanced Packaging SI/PI EngineerSan Jose, CAKey ResponsibilitiesSI/PI analysis of designs and optimization within 2D/2.5D/3D packagesClose interaction with Package Layout Designers, ASIC PD and IP teams as well as Board Schematic/Layout/SI/PI teams to optimize the best electrical performanceDrive SI requirements into interposer/substrate layout (high‑speed routing: 112G/224G) from preliminary design through tape‑out. BenefitsMedical, dental, and vision packages with generous premium coverage$500 per month credit for waiving medical benefitsHousing subsidy of $2k per month for those living within walking distance of the officeRelocation support for those moving to San Jose (Santana Row)Various wellness benefits covering fitness, mental health, and moreDaily lunch and dinner in our officeHow we're differentEtched believes in the Bitter Lesson.
Director, Advanced Packaging Disruptive Technology (Based in Singapore) Applied Materials IncDirector, Advanced Packaging Disruptive Technology (Based in Singapore)Santa Clara, CAThe Director will build and lead a high-impact team focused on exploratory, pre-product technologies, developing solutions such as D2W, RDL, CoWoS, TSV, etc and connecting emerging technology inflections to customer and market roadmaps. Based in Singapore, this role is responsible for defining and driving pathfinding strategy for N+2 and beyond advanced packaging technologies, leading disruptive innovation that shapes future integration architectures and unlocks new value creation opportunities.
Packaging Operator (Contractor) ReCor Medical IncPackaging Operator (Contractor)Palo Alto, CA$25–$30 / hourThis hourly role supports daily production by following written work instructions, performing in-process checks, and completing required production and packaging documentation accurately. Perform hands-on packaging and labeling of medical device components (e.g., catheters, connection cables) by cleaning components, pouching, and cartoning products per approved work instructions.
Advanced Packaging Reliability Engineer OpenAI LLCAdvanced Packaging Reliability EngineerSan Francisco, CAFor unincorporated Los Angeles County workers: we reasonably believe that criminal history may have a direct, adverse and negative relationship with the following job duties, potentially resulting in the withdrawal of a conditional offer of employment: protect computer hardware entrusted to you from theft, loss or damage; return all computer hardware in your possession (including the data contained therein) upon termination of employment or end of assignment; and maintain the confidentiality of proprietary, confidential, and non-public information. In-depth knowledge of advanced packaging architectures, including 2.5D and 3.5D integration, interposers, embedded bridges, chiplets, large package substrates, HBM integration, redistribution layers, and package-level power delivery.
Director, Pricing and Packaging Strategy McAfee, LLCDirector, Pricing and Packaging StrategySan Jose, CaliforniaFull timeReporting to the Head of Pricing and partnering closely with executive leaders across Marketing, Retention, Product, and Retail, you’ll set the vision and frameworks that govern how we price, package, and promote across every channel and stage of the customer lifecycle – from acquisition through renewal – ensuring strategic coherence while maximizing long-term value. You’ll lead a high-impact pricing function, influence executive decisions on monetization strategy, and shape how millions of customers experience McAfee – from the first marketing touchpoint, through product packaging, into renewals and win-back, and across our retail ecosystem.
Senior IC Packaging Engineer Axiado CorpSenior IC Packaging EngineerSan Jose, CAAxiado has also won numerous industry awards for our ground-breaking products and technological innovations, including being named one of Fast Companys 2025 Top 10 Most Innovative Companies in Security, winning the 2025 Global InfoSec Award for Outstanding AI Security Solution, and being named a finalist for the Global Semiconductor Alliances 2025 Start-Up to Watch award. We are a fast-growing, well funded silicon, systems, and solutions company pioneering a new category of semiconductor called the Trusted Control/Compute Unit (TCU) that combines advanced hardware security, AI driven resilience and efficiency, and real-time platform management.
Internship, Packaging Engineer, Supply Chain (Fall 2026) Tesla IncInternship, Packaging Engineer, Supply Chain (Fall 2026)Fremont, CA$16.35–$33.65 / hourConsider before submitting an application: This position is expected to start August 2026 or September 2026 and continue through the Fall term (ending approximately December 2026 or later, if available). Demonstrated ability to facilitate dynamic cross-functional projects with engineering, supply chain, manufacturing and test to meet project timelines.
Integrated Circuit Packaging Architect Advanced Micro Devices IncIntegrated Circuit Packaging ArchitectSan Jose, CASuccessful candidate would collaborate with product design teams and technology development partners to understand future product needs and define a packaging roadmap that includes architecture, process definition, Design for Manufacturing (DFM) and Design for Yield (DFY) guidelines. The Role: Advanced packaging technology leader driving packaging architecture across client, server, gaming and GPU products.
Packaging Structural Design Spec 3 RR Donnelley & Sons CoPackaging Structural Design Spec 3Santa Clara, CAMust have three (3) years of experience in/with: Client engagement and interfacing directly with clients and transforming ideas into shippable products and revenue; Identifying critical elements, variables, and alternatives to develop packaging design solutions; Structural design of packaging specifically for Precision Consumer Electronics packaging; Structural design experience in consumer product, educational, publishing, retail, consumer products, technology, or pharmaceutical markets; Handling packaging, manufacturing equipment, processes, and capabilities; and Working with packaging and prototyping equipment and processes; including. Manage whole design project including design creation, quick turn prototyping of various iterations of the design for review with the client, collaborating with global design and manufacturing team in Asia and India to ensure designs are manufacturable and can be automated easily, and conduct predictive product testing and analyze test data to predict design viability.
NewSenior Electrical Engineer / Product Lead Advanced Semiconductor Packaging and Integration Macpower Digital Assets Edge Private LimitedSenior Electrical Engineer / Product Lead Advanced Semiconductor Packaging and IntegrationSanta Clara, CA$64 / hourIf you enjoy solving complex challenges in mixed-signal design, chiplet integration, and high-performance electronics , this role is for you. We are looking for a Senior Electrical Engineer with deep expertise in semiconductor design, advanced packaging, and ASIC development .
NewIntegrated Circuit - Packaging Architect Engineer Advanced Micro DevicesIntegrated Circuit - Packaging Architect EngineerSan Jose, CAResponsibilities Work with product architects in early definition stage to understand and define package architectures, roadmapLead new package technology development initiatives from concept to full technology qualificationDrive Test vehicle design and manufacturing to establish design rules, DFM/DFY guidelinesEstablish Yield roadmap and lead implementation of yield, data analytic tools as needPreferred Experience Experience in semiconductor technology development roleExperience working with manufacturing partners such as suppliers, OSATs and foundry partners. In-depth knowledge in material science, thin film process development, and/or packagingExperience in a leadership role driving cross-functional teamsProven track record of driving yield improvement, defect reduction in semiconductor fab or packaging environmentEducation BS/MS/PhD in Material Science, Mechanical Engineering, Computer Science, Applied Mathematics, Electrical Engineering or equivalentThis role is not eligible for visa sponsorship.#LI-HYBRID#LI-AP1Benefits offered are described: AMD benefits at a glance.
NewSenior Reliability Engineer - LPU Packaging NVIDIA GruppeSenior Reliability Engineer - LPU PackagingSanta Clara, CA$168,000–$264,500 / yearBase salary range is $168,000 - $264,500 for Level4 and $196,000 - $310,500 for Level5.Eligible for equity and benefits.
NewSenior IC Packaging Reliability Engineer - 2.5D/3D & BGA NVIDIA GruppeSenior IC Packaging Reliability Engineer - 2.5D/3D & BGASanta Clara, CA$168,000–$264,500 / yearThe position offers a competitive salary range of $168,000 - $264,500 for Level 4 and $196,000 - $310,500 for Level 5, along with equity and benefits.#J-18808-Ljbffr. NVIDIA Gruppe is seeking an experienced professional to lead package-level reliability for semiconductor products in Santa Clara, California.
NewIC Packaging Architect - Lead New Package Tech & Yield Advanced Micro DevicesIC Packaging Architect - Lead New Package Tech & YieldSan Jose, CAAdvanced Micro Devices in San Jose, California, is seeking an experienced leader in packaging technology to drive architecture initiatives across multiple product lines. The ideal candidate will lead cross-functional teams in developing advanced packaging solutions while maintaining world-class communication with stakeholders.
TEMP Packaging Designer Kendo BrandsTEMP Packaging DesignerSan Francisco, CAFull timeA dynamic engine of speed, expertise and market-savvy, the Kendo team continues to redefine the beauty industry through great product, great storytelling, great retail and direct-to-consumer partnerships. Kendo Holdings, Inc. is a San Francisco-based beauty brand developer and wholesaler owned by LVMH Moët Hennessy - Louis Vuitton, the world's largest luxury group.
Technologist, Packaging Engineering SanDisk CorpTechnologist, Packaging EngineeringMilpitas, CAProvide technical leadership in evaluating and validating design options through characterization builds and comprehensive DFX (Design for excellence) analyses, including DFM (Design for Manufacturability), DFA (Design for Assembly), DFRW (Design for Rework), influencing product architecture and manufacturing strategy at the system level. ESSENTIAL DUTIES AND RESPONSIBILITIES: Serve as the senior Package Engineering representative on cross‑functional leadership teams, setting technical direction and ensuring packages are fully characterized, qualified, and released to production on schedule while meeting stringent mechanical, electrical, performance, reliability, and quality requirements.
Packaging Sourcing Manager Kinder'sPackaging Sourcing ManagerWalnut Creek, CA$125,000–$145,000 / yearMost of our work happens in the office to spark creativity and community, but we also offer flexibility so team members have the autonomy to work outside the office when needed to support their work-life balance and personal commitments. By developing strong supplier partnerships, ensuring regulatory compliance, and driving process efficiencies, you will help Kinder's scale its impact while staying true to our values.
Sr. Industrial Designer (Packaging) SanDisk CorpSr. Industrial Designer (Packaging)Milpitas, CAAn employee's pay position within the salary range may be based on several factors including but not limited to (1) relevant education; qualifications; certifications; and experience; (2) skills, ability, knowledge of the job; (3) performance, contribution and results; (4) geographic location; (5) shift; (6) internal and external equity; and (7) business and organizational needs. Sandisk is looking for a Senior Packaging Industrial Designer to join global industrial design team to design 3D structural packaging solutions for world‑class consumer storage products.
Advanced Packaging Engineer DensityAIAdvanced Packaging EngineerMountain View, CA$200,000–$350,000 / year10+ years of experience on very high performance designs at advanced packaging like SIP, CoWoS, EMIB and other interposer technologies. Demonstrated ability to work closely with architects to create right packaging solutions and sign off complex packaging solutions.
Co-Packaged Optics Packaging Process Development Engineer Marvell Technology IncCo-Packaged Optics Packaging Process Development EngineerSanta Clara, CAWork with cross-functional packaging teams and lead process development at foundry along with 2.5D/3D CoW process development with particular emphasis on chemistry development with packaging consumable suppliers at OSATs to bring packaging solutions from concept to prototypes and ramp to high volume manufacturing with aggressive cost reduction strategies. Highlights include an employee stock purchase plan with a 2-year look back, family support programs to help balance work and home life, robust mental health resources to prioritize emotional well-being, and a recognition and service awards to celebrate contributions and milestones.
Photonic Packaging Engineer, Principal Astera Labs IncPhotonic Packaging Engineer, PrincipalSan Jose, CA$205,000–$255,000 / yearAstera Labs' Intelligent Connectivity Platform integrates CXL, Ethernet, NVLink, PCIe, and UALink semiconductor-based technologies with the company's COSMOS software suite to unify diverse components into cohesive, flexible systems that deliver end-to-end scale-up, and scale-out connectivity. We know that creativity and innovation happen more often when teams include diverse ideas, backgrounds, and experiences, and we actively encourage everyone with relevant experience to apply, including people of color, LGBTQ+ and non-binary people, veterans, parents, and individuals with disabilities.
Memory Packaging Engineer Apple IncMemory Packaging EngineerSanta Clara, CAMinimum requirement of a bachelors degree in a relevant fieldMS or PhD preferred, with 3+ years of industry experience in package design and assembly process development of high-bandwidth and high-density memory packages. If you are driven to solve the industrys toughest packaging challenges, your work will have a profound and lasting impact on the products used by millions.
NewPackaging Assembly Engineer Apple, Inc.Packaging Assembly EngineerSan Francisco, CA$181,100–$318,400 / yearIn this highly visible role, you will own development, optimization and sustaining the advanced flip-chip BGA (FCBGA) assembly process from pathfinding, NPI through high-volume manufacturing by defining assembly baseline processes, deciding package BOM, establishing package design rules that are optimized for performance, reliability, yield and cost for a variety of projects including SoC.DescriptionResponsible to lead packaging assembly technology development. ResponsibilitiesDefine and optimize end‑to‑end FCBGA assembly process flow (wafer back‑end interface, flip‑chip attach, underfill, lid/heat spreader attach, ball attach, singulation, final inspection).Develop and maintain process documentation including process specs, work instructions, control plans, PFMEA, and process flow diagrams.
NewIC Packaging Integration Engineer Apple, Inc.IC Packaging Integration EngineerSanta Clara, CA$181,100–$318,400 / yearDescription You will be responsible for IC packaging developmentWork with cross-functional teams and lead SoC Package integration and architecture effortsDrive the industry with advanced package solutions, new material developments, and specsResponsibilities Work with cross-functional domains through package definition process and deliver optimized solutions to meet electrical, mechanical, thermal requirements. Test vehicle definition and execution working alongside foundries and OSATs for advanced packaging technologies (FOWLP, 2.5D, 3D, coreless MCM).Well versed with DOE principles and statistical analyses to establish robust build plans for OSATs through NPI phase.
Sr. Principal Engineer, Advanced Packaging Marvell Technology IncSr. Principal Engineer, Advanced PackagingSanta Clara, CAThe group focuses on signal integrity, power integrity, thermal integrity, mechanical integrity, high speed signaling and complex power delivery networks (PDNs) requiring innovative and custom solutions to meet constantly evolving customer needs. Highlights include an employee stock purchase plan with a 2-year look back, family support programs to help balance work and home life, robust mental health resources to prioritize emotional well-being, and a recognition and service awards to celebrate contributions and milestones.
Packaging Engineer Rodan & Fields LLCPackaging EngineerSan Ramon, CA$84,000–$105,000 / yearRodan + Fields Dermatologists is a direct selling skincare company founded in 2000 by Dr. Katie Rodan and Dr. Kathy Fields, world-renowned dermatologists, and creators of Proactiv Solution with a passion for giving people the best skin of their lives - and the confidence that comes with it. With effective products, a unique business model and a powerful community of Independent Consultants, Rodan + Fields has disrupted the skincare category to become a leading skincare brand in North America.
NewProcess Development Engineer - Packaging InlightentechProcess Development Engineer - PackagingSanta Clara, CA$104,000–$208,000 / yearLead process development for: MicroLED die bonding with FPC/PCB, Interconnect technologies, Wafer-level or panel-level packaging, Optical component integration (waveguides, collimators, micro-optics, etc.)Define process flows, DOEs, and control plans for new packaging technologiesDrive yield improvement, defect reduction, and cost optimizationSupport EVT / DVT / PVT builds and ramp to mass productionPerform failure analysis and root cause investigations related to packaging and assemblyCollaborate with device, optics, system, equipment, and manufacturing teamsWork with equipment vendors and material suppliersGenerate and maintain process documentation, specifications, and qualification reportsMinimum QualificationsBachelor's degree or above in Materials Science, Electrical Engineering, Mechanical Engineering, or related field3-7 years of experience in advanced packaging or process developmentStrong understanding of semiconductor and optoelectronic packaging processesHands‑on experience with die attach, bonding, interconnect, and assembly processesExperience running DOE, process characterization, and data analysisFamiliarity with yield, reliability, and manufacturing metricsAbility to work in a cross-functional, fast-paced R&D-to-production environmentAbility and willingness to travel internationally up to 20%Preferred QualificationsAdvanced degree (MS or PhD) in a relevant field of study. Direct experience with microLED, LED, or CIS packagingExperience in AR light engines or optical module packagingFamiliarity with reliability testing (thermal cycling, HTOL, humidity, drop, etc.)Hands‑on experience with process yields analysis and defect characterizationSalary Range: $104k - $208k/yearComprehensive health, dental, and vision insurance.
Senior Packaging Design Engineer, Silicon Google LLCSenior Packaging Design Engineer, SiliconMountain View, CA$163,000–$237,000 / yearCollaborate closely with Signal Integrity (SI), Power Integrity (PI), Test, New Product Introduction (NPI), and Mechanical Engineering teams to refine and optimize product package architecture and design. Skip navigation links home Home work_outline Jobs noogler_hat Students google How we work handyman How we hire person_outline Your career help_outline Help.
Sr. Creative Program Manager, eero Packaging Team Amazon.com IncSr. Creative Program Manager, eero Packaging TeamSan Francisco, CAIn addition to creating the packaging plan, which includes a global workback schedule for artwork development in various regions, the role requires management in the creation of technical publications, print on demand (POD) labels, and product labels under the guidance of legal, compliance, brand, marketing, and leadership. Drive cross-functional stakeholders including marketing, brand, product, legal, compliance, and operations to determine schedule for on-box packaging and label content for eero programs.
Packaging Engineer Nexthop Systems IncPackaging EngineerSanta Clara, CAQualification plans to characterize and validate packaging solutions for product and it's FRU (Field replaceable unit), subassemblies or components as per industry or internal specifications by working closely with HW design (mechanical, thermal, electrical etc.) Come out with innovative ideas for cost optimization, durability during shipping, environmental impact, and compliance with safety regulations. In this role, you'll combine technical expertise with innovative problem-solving to plan & execute all qualifications activities for cutting-edge packaging designs, ensuring they meet the stringent demands of all global shipping environments.
NewAdvanced Packaging Technologist MediaTekAdvanced Packaging TechnologistSan Jose, CA$180,000–$250,000 / yearResponsibilitiesCollaborate with internal teams, external customers, and key partners to develop advanced packaging solutions from concept to mass productionCoordinate with package design, substrate, and assembly partners to select materials and BOM, ensuring manufacturability and meeting electrical, mechanical, thermal, and system-level requirementsLead and coordinate projects across design, engineering, supply chain, manufacturing, and quality assurance to ensure successful executionEstablish and maintain strong relationships with suppliers, customers, and internal teams to meet project requirements and resolve supply chain or manufacturing issuesMonitor and report on project progress, supply chain performance, and manufacturing metrics to senior managementMain Requirements and QualificationsExpertise in 2.5D/3D package architecture and advanced packaging technologies such as CoWoS, EMIB, SoIC, CoW, WoW, POP, etc. Strong supply chain and quality management skills, including BOM management, procurement, logistics, and inventoryUnderstanding of legacy packaging technologies, package failure mechanisms, and quick problem-solving skillsAbility to develop and maintain strong relationships with key enablement partners and customers, ensuring smooth communication and alignment on project requirements, product quality, reliability, system, and operational needsExcellent communication skills10-15% international travel requiredSalary range: $180,000 - $250,000Employee may be eligible for performance bonus, short and long term incentive programs.
NewSenior Packaging Specialist (TAG) Nestle S.A.Senior Packaging Specialist (TAG)Fremont, CAREQUIREMENTS AND MINIMUM EDUCATION LEVELA BS or MS degree in Food Science, Food Engineering, Chemical Engineering Packaging Science, Packaging Engineering, Mechanical Engineering, or related field. JOB SUMMARYThe Senior Packaging Specialist is a key role within Nestle's Technical Applications Group (TAG) that serves as the technical lead on highly complex and strategic projects.
Packaging Engineer Manpower EngineeringPackaging EngineerFremont, CATemporaryManpowerGroup® (NYSE: MAN), the leading global workforce solutions company, helps organizations transform in a fast-changing world of work by sourcing, assessing, developing, and managing the talent that enables them to win. We are recognized consistently for our diversity - as a best place to work for Women, Inclusion, Equality and Disability and in 2023 ManpowerGroup was named one of the World's Most Ethical Companies for the 14th year - all confirming our position as the brand of choice for in-demand talent.
NewOptic-Electronic Packaging Engineer Dormont Manufacturing CompanyOptic-Electronic Packaging EngineerSan Jose, CAKey ResponsibilitiesDesign and develop mechanical packaging solutions for high‑speed optical modules used in AI and data center interconnect systemsDrive mechanical concepts from architecture definition through detailed design, prototype build, validation, and production rampDevelop detailed 3D CAD models and engineering documentationPerform advanced thermal and mechanical stress analysis (FEA) to address high power density, airflow constraints, and long‑term reliabilityOwn GD&T definition and tolerance stack‑up analysis for high‑density opto‑electro‑mechanical assembliesDesign fixtures, tooling, and test infrastructure to support optical alignment, module validation, and scalable manufacturingCollaborate closely with optical, electrical, thermal, reliability, manufacturing, and supply‑chain teams to deliver integrated, system‑aware solutionsFor senior‑level engineers: provide technical direction, review designs, mentor junior engineers, and influence mechanical and thermal platform strategyQualificationsB.S. in Mechanical Engineering or a related discipline (M.S. or Ph. Mechanical Engineer (All Levels – AI & Data Center Optical Modules)Department: Research & DevelopmentLocation: San Jose, California, USAPosition OverviewWe are seeking Mechanical Engineers to support the design and development of next‑generation high‑speed optical modules for AI and data center interconnect applications.
Advanced Packaging Process Engineer Tenstorrent IncAdvanced Packaging Process EngineerSanta Clara, CAPartner with design, reliability, and architecture teams to evaluate tradeoffs (bump pitch, stack-ups, embedded Si, etc.) and lead test vehicle planning to meet program needs. As the position offered will have direct and/or indirect access to information, systems, or technologies subject to these laws, the offer may be contingent upon your citizenship/permanent residency status or ability to obtain prior license approval from the U.S. Commerce Department or applicable federal agency.
Coordinator, Packaging e.l.f. BeautyCoordinator, PackagingOakland, CaliforniaOur total compensation philosophy offers every full-time new hire competitive pay and benefits, bonus eligibility (200% of target over the last seven fiscal years), equity, flexible time off, year-round half-day Fridays, and a hybrid 3 day in office, 2 day at home work environment. You’ll own critical workflows from component assessments and supplier communications to PO execution and data integrity, ensuring every launch moves from idea to shelf with precision and speed.
NewPackaging Engineer The Fountain Group LLCPackaging EngineerFoster City, CA$88.89–$96.30 / hourWe are seeking an experienced Cold Chain Packaging Engineer to develop, test, qualify, and support temperature-controlled (cold chain) packaging systems for the safe distribution of pharmaceutical and biologic products worldwide. What We're Looking For: Bachelor's degree in Packaging Engineering, Mechanical Engineering, Industrial Engineering, Biomedical Engineering, Chemical Engineering, or a related scientific field.
NewCold Chain Packaging Engineer Net2SourceCold Chain Packaging EngineerFoster City, CA$88.89–$96.30 / hourThis position resides within the Packaging Development team with a primary focus on the development, qualification, and lifecycle management of controlled temperature (cold chain) packaging systems (thermal protection systems) to ensure product quality and regulatory compliance across global distribution of our pharmaceuticals and biologics products. Specific Education and Experience B.S. degree in industrial engineering, mechanical engineering, biomedical engineering, chemical engineering, package engineering , or a related scientific field.
Packaging Supervisor ASR Group International IncPackaging SupervisorCA$68,000–$126,000 / yearASR Group companies also produce and market Tellus, a single-use, compostable tableware and foodservice product made from plant fibers, including sugarcane. PRODUCTION / EMPLOYEE LEADERSHIP: Coordinate and supervise daily production activities to meet safety, quality, delivery, and cost targets.
NewLead IC Packaging Engineer - FCBGA & NPI Apple, Inc.Lead IC Packaging Engineer - FCBGA & NPISan Francisco, CAA leading technology firm in California is seeking an experienced IC Packaging Assembly Engineer to optimize flip-chip BGA assembly processes. Candidates must have over 10 years of experience in semiconductor packaging, a strong engineering background, and excellent problem-solving skills.
NewSignal & Power Integrity Engineer for Chiplet Packaging EliyanSignal & Power Integrity Engineer for Chiplet PackagingSan Francisco, CAIdeal candidates have extensive experience in signal and power integrity, using advanced simulation tools, and are eager to contribute to high-performance manufacturable products.#J-18808-Ljbffr. This role involves developing innovative packaging solutions for chiplet interconnects while working with a talented cross-functional team.
NewIC Packaging Lead: Integration & Tech Innovation Apple, Inc.IC Packaging Lead: Integration & Tech InnovationSan Francisco, CAThis role involves working with cross-functional teams to develop innovative packaging solutions from concept to mass production. Generous compensation and benefits package offered, including stock options and educational reimbursements.#J-18808-Ljbffr.
NewIC Packaging Simulation Engineer FEM & GenAI Modeling Apple, Inc.IC Packaging Simulation Engineer FEM & GenAI ModelingSan Francisco, CAThe role involves stress and deformation simulation of IC packages, programming CAD/FEM software, and supporting new product introductions. Candidates should have a bachelor's degree and proficiency in FEM tools like ANSYS and ABAQUS, along with programming skills in MATLAB or Python.
NewSenior IC Packaging & Integration Engineer (2.5D/3D) Apple, Inc.Senior IC Packaging & Integration Engineer (2.5D/3D)Santa Clara, CA$181,100–$318,400 / yearThe position offers a competitive salary ranging from $181,100 to $318,400, along with comprehensive benefits including medical coverage, stock options, and educational reimbursements. This role involves driving packaging development and leading cross-functional teams in advanced semiconductor packaging solutions.
NewSenior Substrate & 3DIC Packaging Engineer TSMC - Taiwan Semiconductor Manufacturing Company LimitedSenior Substrate & 3DIC Packaging EngineerSan Jose, CAA leading semiconductor foundry in San Jose seeks a highly skilled Substrate / Advanced Package Engineer to innovate in 3DIC design and packaging. Responsibilities include designing, simulating, and optimizing advanced packaging technologies while collaborating with cross-functional teams.
NewIC Packaging Simulation Engineer Apple, Inc.IC Packaging Simulation EngineerSan Francisco, CAResponsibilitiesNumerical modeling of the stress and deformation of component packages to provide a comprehensive understanding of chip‑package interaction and package‑board interaction to ensure good device yield and reliability. DescriptionWork on stress and deformation simulation of IC packages to provide a comprehensive understanding of chip‑package interaction and package‑board interaction to ensure good device yield and reliability.
NewSenior Packaging Designer & Engineer Hybrid SF (3-Month) HH GlobalSenior Packaging Designer & Engineer Hybrid SF (3-Month)San Francisco, CAThe ideal candidate has 6-8 years of experience in the creative packaging industry, proficiency in design software, and a strong understanding of packaging materials and processes. A leading health and tech brand in San Francisco is seeking a talented Packaging Designer for a full-time, hybrid role.
NewSenior Silicon Photonics Packaging Engineer Apple, Inc.Senior Silicon Photonics Packaging EngineerSan Francisco, CAApple Inc. is seeking a Silicon Photonics & Optical Packaging Engineer in San Francisco to develop next-generation optical interconnects. This role involves designing silicon photonic devices, collaborating with various teams, and developing packaging technologies.
NewPackaging Process Engineer MicroLED AR InlightentechPackaging Process Engineer MicroLED ARSanta Clara, CA$104,000–$208,000 / yearInlighten Technologies in Santa Clara, California is looking for a Process Development Engineer - Packaging to support microLED AR light engine production. This role focuses on advanced packaging processes and collaboration across teams.
NewMarketing Programs Manager: 3D IC Design & Packaging Hybrid Siemens AGMarketing Programs Manager: 3D IC Design & Packaging HybridSanta Clara, CAThe role involves developing marketing strategies, managing campaigns, and collaborating with teams to enhance market visibility. Siemens AG is looking for a Marketing Programs Manager focused on 3D IC Design & Advanced Packaging Solutions.