NewFlexible Packaging Engineer Destiny Packaging Inc.Flexible Packaging EngineerSalinas, CAUnderstanding of the chemistry of poly urethane, poly vinyl, and poly olefin films, single direction and bi-directional shrink films, barrier and co extruded poly films is preferred. Experience with MAP, barrier films, laminated structures, COEX films, SUPs, flexo print, shrink, stretch, and poly bag structures is preferred.
Sr Packaging Engineer, Distribution Packaging Applied MaterialsSr Packaging Engineer, Distribution PackagingSanta Clara, CA$133,500–$183,500 / yearIf you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members.
Flexible Packaging Engineer - Destiny Packaging |Salinas, CA Bunzl plcFlexible Packaging Engineer - Destiny Packaging |Salinas, CASalinas, CAUnderstanding of the chemistry of poly urethane, poly vinyl, and poly olefin films, single direction and bi-directional shrink films, barrier and co extruded poly films is preferred. Experience with MAP, barrier films, laminated structures, COEX films, SUPs, flexo print, shrink, stretch, and poly bag structures is preferred.
Senior Packaging Engineer Zp Group LlcSenior Packaging EngineerSaratoga, CA$210,000–$265,000 / yearKeywords: advanced packaging, flip‑chip, multi‑chip module, MCM, organic substrate, CoWoS, 2.5D, 3D packaging, TSMC system‑on‑wafer, OSAT, Wistron, module integration, cold plate integration, wafer‑level assembly, substrate technology, semiconductor packaging, high‑density interconnect, HDI substrates, yield improvement, semiconductor manufacturing, module engineering. The ideal Senior Packaging Engineer will lead advanced component and system‑level packaging efforts, with a strong emphasis on pcb assembly and organic substrate technologies on site in Saratoga, CA.
Sr Packaging Engineer Imperative CareSr Packaging EngineerCampbell, CA$132,000–$158,000 / yearWorking under general supervision, this individual will independently execute packaging development activities, support packaging validation efforts, coordinate supplier and laboratory activities, and contribute to the successful commercialization and lifecycle management of products. As a senior professional, this position support the design, development, validation, commercialization, and sustaining of sterile and non-sterile packaging systems for medical device and capital equipment products for Stroke, Vascular, and Robotics business units.
Photonic Packaging Engineer, Principal Astera Labs IncPhotonic Packaging Engineer, PrincipalSan Jose, CA$205,000–$255,000 / yearAstera Labs' Intelligent Connectivity Platform integrates CXL, Ethernet, NVLink, PCIe, and UALink semiconductor-based technologies with the company's COSMOS software suite to unify diverse components into cohesive, flexible systems that deliver end-to-end scale-up, and scale-out connectivity. We know that creativity and innovation happen more often when teams include diverse ideas, backgrounds, and experiences, and we actively encourage everyone with relevant experience to apply, including people of color, LGBTQ+ and non-binary people, veterans, parents, and individuals with disabilities.
Sr Packaging Engineer Imperative Care IncSr Packaging EngineerCampbell, CA$132,000–$158,000 / yearWorking under general supervision, this individual will independently execute packaging development activities, support packaging validation efforts, coordinate supplier and laboratory activities, and contribute to the successful commercialization and lifecycle management of products. As a senior professional, this position support the design, development, validation, commercialization, and sustaining of sterile and non-sterile packaging systems for medical device and capital equipment products for Stroke, Vascular, and Robotics business units.
Senior IC Packaging Engineer Axiado CorpSenior IC Packaging EngineerSan Jose, CAAxiado has also won numerous industry awards for our ground-breaking products and technological innovations, including being named one of Fast Companys 2025 Top 10 Most Innovative Companies in Security, winning the 2025 Global InfoSec Award for Outstanding AI Security Solution, and being named a finalist for the Global Semiconductor Alliances 2025 Start-Up to Watch award. We are a fast-growing, well funded silicon, systems, and solutions company pioneering a new category of semiconductor called the Trusted Control/Compute Unit (TCU) that combines advanced hardware security, AI driven resilience and efficiency, and real-time platform management.
Senior Staff Packaging Engineer CyfleSenior Staff Packaging EngineerSan Jose, CaliforniaDrive alignment between module substrate (PCB) design requirements and supplier capabilities, to enable new product development and volume manufacturing of power modules. Collaborate with multi-functional teams within Power Integrations for successful development, qualification and production ramp of new module products.
Memory Packaging Engineer Apple IncMemory Packaging EngineerSanta Clara, CABS and 10+ years of relevant industry experienceMS or PhD preferred, with 10+ years of industry experience in package design and assembly process development of high-bandwidth and high-density memory packages. If you are driven to solve the industrys toughest packaging challenges, your work will have a profound and lasting impact on the products used by millions.
Senior IC Packaging Engineer MicrosoftSenior IC Packaging EngineerMountain View, CA$119,800–$234,700 / yearDoctorate in Physics, Electrical Engineering, Computer Engineering, Computer Science, Chemistry, or related field AND 3+ years technical engineering experience OR Masters Degree in Physics, Electrical Engineering, Computer Engineering, Computer Science, Chemistry, or related field AND 6+ years technical engineering experience OR Bachelors Degree in Physics, Electrical Engineering, Computer Engineering, Computer Science, Chemistry, or related field AND 8+ years technical engineering experience OR equivalent experience. Doctorate in Electrical Engineering, Computer Engineering, Computer Science, Physics, Chemistry or related field AND 1+ year(s) technical engineering experience OR Masters Degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, Chemistry or related field AND 4+ years technical engineering experience OR Bachelors Degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, Chemistry or related field AND 5+ years technical engineering experience OR equivalent experience.
Sr Packaging Engineer Applied Materials IncSr Packaging EngineerSanta Clara, CA$133,500–$183,500 / yearIf you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members.
Flexible Packaging Engineer BUNZLFlexible Packaging EngineerSalinas, CA$75,000–$80,000 / yearUnderstanding of the chemistry of poly urethane, poly vinyl, and poly olefin films, single direction and bi-directional shrink films, barrier and co extruded poly films is preferred. With more than 10,000 team members and over 400,000 supplies, Bunzl is recognized as a leading supplier across North America—and proudly certified as a Great Place to Work® .
Quantum 3D Integration and Packaging Engineer Applied Materials IncQuantum 3D Integration and Packaging EngineerSanta Clara, CA$147,000–$202,500 / yearIf you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. You will experiment, learn, and collaborate with some of the brightest minds in the semiconductor and display industries, partnering with our globally recognized R&D teams on state-of-the-art research and development projects.
Quantum 3D Integration And Packaging Engineer Applied MaterialsQuantum 3D Integration And Packaging EngineerSanta Clara, CA$147,000–$202,500 / yearIf you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. You will experiment, learn, and collaborate with some of the brightest minds in the semiconductor and display industries, partnering with our globally recognized R&D teams on state-of-the-art research and development projects.
Advanced Packaging Engineer DensityAIAdvanced Packaging EngineerMountain View, California$200,000–$320,000 / year10+ years of experience on very high performance designs at advanced packaging like SIP, CoWoS, EMIB and other interposer technologies. Demonstrated ability to work closely with architects to create right packaging solutions and sign off complex packaging solutions.
NewSenior Electrical Engineer / Product Lead Advanced Semiconductor Packaging and Integration Macpower Digital Assets Edge Private LimitedSenior Electrical Engineer / Product Lead Advanced Semiconductor Packaging and IntegrationSanta Clara, CA$64 / hourIf you enjoy solving complex challenges in mixed-signal design, chiplet integration, and high-performance electronics , this role is for you. We are looking for a Senior Electrical Engineer with deep expertise in semiconductor design, advanced packaging, and ASIC development .
Staff Semi Packaging Engineer Analog DevicesStaff Semi Packaging EngineerSan Jose, CaliforniaADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls.
Packaging Design Engineer, Platforms Infrastructure Engineering Google LLCPackaging Design Engineer, Platforms Infrastructure EngineeringSunnyvale, CAOur Mechanical Product Design Engineering Team members work cross-functionally to design, build, and deploy the latest technology to support the needs of compute, storage, networking, and machine learning hardware. As a Product Design Engineer, you will design and evaluate our data center systems, identifying product requirements and contributing to research and project planning.
Senior Fiber Optic Module Packaging Engineer II-VI Optical Systems, Inc.Senior Fiber Optic Module Packaging EngineerSunnyvale, CAWe are a vertically integrated manufacturing company that develops innovative products for diversified applications in the industrial, optical communications, military, life sciences, semiconductor equipment, and consumer markets. Coherent provides a comprehensive career development platform within an environment that challenges employees to perform at their best, while rewarding excellence and hard-work through a competitive compensation program.