Must have basic understanding of surface mount and microelectronic chip-and-wire manufacturing methods and techniques, including soldering, wedge bonding, silver epoxy application, expansion coefficient and thermal conductivity of materials, plating, hard and soft substrate materials, printed circuit board manufacturing methods and techniques. Align and test RF through mmW amplifiers, mixers, multipliers, switches, filters, couplers, attenuators, phase shifters, limiters and other related components using the latest PNA-X vector network analyzers.