NewPackaging Engineer The Fountain Group LLCPackaging EngineerFoster City, CA$88.89–$96.30 / hourWe are seeking an experienced Cold Chain Packaging Engineer to develop, test, qualify, and support temperature-controlled (cold chain) packaging systems for the safe distribution of pharmaceutical and biologic products worldwide. What We're Looking For: Bachelor's degree in Packaging Engineering, Mechanical Engineering, Industrial Engineering, Biomedical Engineering, Chemical Engineering, or a related scientific field.
Packaging Engineer Manpower EngineeringPackaging EngineerFremont, CATemporaryManpowerGroup® (NYSE: MAN), the leading global workforce solutions company, helps organizations transform in a fast-changing world of work by sourcing, assessing, developing, and managing the talent that enables them to win. We are recognized consistently for our diversity - as a best place to work for Women, Inclusion, Equality and Disability and in 2023 ManpowerGroup was named one of the World's Most Ethical Companies for the 14th year - all confirming our position as the brand of choice for in-demand talent.
Senior IC Packaging Engineer Axiado CorpSenior IC Packaging EngineerSan Jose, CAAxiado has also won numerous industry awards for our ground-breaking products and technological innovations, including being named one of Fast Companys 2025 Top 10 Most Innovative Companies in Security, winning the 2025 Global InfoSec Award for Outstanding AI Security Solution, and being named a finalist for the Global Semiconductor Alliances 2025 Start-Up to Watch award. We are a fast-growing, well funded silicon, systems, and solutions company pioneering a new category of semiconductor called the Trusted Control/Compute Unit (TCU) that combines advanced hardware security, AI driven resilience and efficiency, and real-time platform management.
Photonic Packaging Engineer, Principal Astera Labs IncPhotonic Packaging Engineer, PrincipalSan Jose, CA$205,000–$255,000 / yearAstera Labs' Intelligent Connectivity Platform integrates CXL, Ethernet, NVLink, PCIe, and UALink semiconductor-based technologies with the company's COSMOS software suite to unify diverse components into cohesive, flexible systems that deliver end-to-end scale-up, and scale-out connectivity. We know that creativity and innovation happen more often when teams include diverse ideas, backgrounds, and experiences, and we actively encourage everyone with relevant experience to apply, including people of color, LGBTQ+ and non-binary people, veterans, parents, and individuals with disabilities.
Packaging Engineer Nexthop Systems IncPackaging EngineerSanta Clara, CAQualification plans to characterize and validate packaging solutions for product and it's FRU (Field replaceable unit), subassemblies or components as per industry or internal specifications by working closely with HW design (mechanical, thermal, electrical etc.) Come out with innovative ideas for cost optimization, durability during shipping, environmental impact, and compliance with safety regulations. In this role, you'll combine technical expertise with innovative problem-solving to plan & execute all qualifications activities for cutting-edge packaging designs, ensuring they meet the stringent demands of all global shipping environments.
Internship, Packaging Engineer, Supply Chain (Fall 2026) Tesla IncInternship, Packaging Engineer, Supply Chain (Fall 2026)Fremont, CA$16.35–$33.65 / hourConsider before submitting an application: This position is expected to start August 2026 or September 2026 and continue through the Fall term (ending approximately December 2026 or later, if available). Demonstrated ability to facilitate dynamic cross-functional projects with engineering, supply chain, manufacturing and test to meet project timelines.
Advanced Packaging Engineer DensityAIAdvanced Packaging EngineerMountain View, CA$200,000–$350,000 / year10+ years of experience on very high performance designs at advanced packaging like SIP, CoWoS, EMIB and other interposer technologies. Demonstrated ability to work closely with architects to create right packaging solutions and sign off complex packaging solutions.
Packaging Engineer Rodan & Fields LLCPackaging EngineerSan Ramon, CA$84,000–$105,000 / yearRodan + Fields Dermatologists is a direct selling skincare company founded in 2000 by Dr. Katie Rodan and Dr. Kathy Fields, world-renowned dermatologists, and creators of Proactiv Solution with a passion for giving people the best skin of their lives - and the confidence that comes with it. With effective products, a unique business model and a powerful community of Independent Consultants, Rodan + Fields has disrupted the skincare category to become a leading skincare brand in North America.
Memory Packaging Engineer Apple IncMemory Packaging EngineerSanta Clara, CAMinimum requirement of a bachelors degree in a relevant fieldMS or PhD preferred, with 3+ years of industry experience in package design and assembly process development of high-bandwidth and high-density memory packages. If you are driven to solve the industrys toughest packaging challenges, your work will have a profound and lasting impact on the products used by millions.
NewCold Chain Packaging Engineer Net2SourceCold Chain Packaging EngineerFoster City, CA$88.89–$96.30 / hourThis position resides within the Packaging Development team with a primary focus on the development, qualification, and lifecycle management of controlled temperature (cold chain) packaging systems (thermal protection systems) to ensure product quality and regulatory compliance across global distribution of our pharmaceuticals and biologics products. Specific Education and Experience B.S. degree in industrial engineering, mechanical engineering, biomedical engineering, chemical engineering, package engineering , or a related scientific field.
NewSenior MEMS Packaging Engineer - IC Packaging Innovator SitimeSenior MEMS Packaging Engineer - IC Packaging InnovatorSanta Clara, CA$138,800–$190,850 / yearApplicants should hold an M.S or PhD in Mechanical Engineering or Material Science and have over 5 years of experience in semiconductor packaging technology. The role involves designing, developing, and qualifying unique custom package technologies while managing production activities at overseas OSATs.
NewInnovative Packaging Engineer - Cold Beverage R&D Keurig Dr PepperInnovative Packaging Engineer - Cold Beverage R&DSan Francisco, CACandidates should have a Bachelor's degree in Packaging Engineering and at least 4 years of experience with PET containers and testing packaging materials. A leading beverage company in San Francisco seeks a Packaging Engineer to develop and implement various packaging solutions.
NewOptic-Electronic Packaging Engineer Dormont Manufacturing CompanyOptic-Electronic Packaging EngineerSan Jose, CAKey ResponsibilitiesDesign and develop mechanical packaging solutions for high‑speed optical modules used in AI and data center interconnect systemsDrive mechanical concepts from architecture definition through detailed design, prototype build, validation, and production rampDevelop detailed 3D CAD models and engineering documentationPerform advanced thermal and mechanical stress analysis (FEA) to address high power density, airflow constraints, and long‑term reliabilityOwn GD&T definition and tolerance stack‑up analysis for high‑density opto‑electro‑mechanical assembliesDesign fixtures, tooling, and test infrastructure to support optical alignment, module validation, and scalable manufacturingCollaborate closely with optical, electrical, thermal, reliability, manufacturing, and supply‑chain teams to deliver integrated, system‑aware solutionsFor senior‑level engineers: provide technical direction, review designs, mentor junior engineers, and influence mechanical and thermal platform strategyQualificationsB.S. in Mechanical Engineering or a related discipline (M.S. or Ph. Mechanical Engineer (All Levels – AI & Data Center Optical Modules)Department: Research & DevelopmentLocation: San Jose, California, USAPosition OverviewWe are seeking Mechanical Engineers to support the design and development of next‑generation high‑speed optical modules for AI and data center interconnect applications.
NewSenior Silicon Photonics Packaging Engineer Apple, Inc.Senior Silicon Photonics Packaging EngineerSan Francisco, CAApple Inc. is seeking a Silicon Photonics & Optical Packaging Engineer in San Francisco to develop next-generation optical interconnects. This role involves designing silicon photonic devices, collaborating with various teams, and developing packaging technologies.
NewCold Chain Packaging Engineer Integrated Resources, IncCold Chain Packaging EngineerFoster City, CA$88.89–$96.29 / hourThis position resides within the Packaging Development team at Client, with a primary focus on the development, qualification, and lifecycle management of controlled temperature (cold chain) packaging systems (thermal protection systems) to ensure product quality and regulatory compliance across global distribution of our pharmaceuticals and biologics products. Specific Education and Experience B.S. degree in industrial engineering, mechanical engineering, biomedical engineering, chemical engineering, package engineering, or a related scientific field.
Sr Packaging Engineer Applied Materials IncSr Packaging EngineerSanta Clara, CA$133,500–$183,500 / yearIf you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members.
NewSenior IC Packaging Engineer - NPI & HVM Leadership Broadcom CorporationSenior IC Packaging Engineer - NPI & HVM LeadershipSan Jose, CAWith a strong educational background in engineering and extensive hands-on experience in advanced IC packaging, you will manage packaging deliverables, ensuring optimal design and execution throughout the lifecycle.#J-18808-Ljbffr. You'll collaborate closely with chip design, system design, and manufacturing teams to deliver industry-leading package solutions.
VAVE Packaging Engineer Bio-Rad Laboratories IncVAVE Packaging EngineerHercules, CA$107,900–$148,400 / yearActual compensation will be provided in writing at the time of offer, if applicable, and is based on several factors we believe fairly and accurately impact compensation, including geographic location, experience, knowledge, skills, abilities, and other job permitted factors. Bio-Rads robust offerings serve to enrich the overall health, wealth, and wellbeing of our employees and their families through the various stages of an employee's work and life cycle.
NewSenior Mechanical Packaging Engineer - Semiconductor Interconnects AvicenaSenior Mechanical Packaging Engineer - Semiconductor InterconnectsSunnyvale, CAA semiconductor technology company in Sunnyvale, California is seeking a Mechanical Engineer to develop and support mechanical designs for advanced packaging and optical components. Candidates should have a Bachelor's degree in Mechanical Engineering, 3+ years of experience in semiconductor packaging, and strong skills in SolidWorks.
Staff Semi Packaging Engineer Analog Devices IncStaff Semi Packaging EngineerSan Jose, CA$130,168–$188,490 / yearADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls.
Packaging Engineer Analog Devices IncPackaging EngineerSan Jose, CA$86,480–$118,910 / yearADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls.
Principal Packaging Engineer Skyworks Solutions IncPrincipal Packaging EngineerSan Jose, CAAt Skyworks you will find a fast-paced environment with a strong focus on global collaboration minimal layers of management and the freedom to make meaningful contributions in a setting that encourages creative thinking. Experience in package design and proficient in Cadence Allegro platform tools, PCB Editor, Advanced Package Designer, APDSiP, or Mentor Xpedition platform tools.
NewPackaging Engineer - I TekWissen LLCPackaging Engineer - IFoster City, CA$84–$90Work Type: Onsite Job Description: This position resides within the Packaging Development team at Client, with a primary focus on the development, qualification, and lifecycle management of controlled temperature (cold chain) packaging systems (thermal protection systems) to ensure product quality and regulatory compliance across global distribution of our pharmaceuticals and biologics products. Specific Education and Experience: B.S. degree in industrial engineering, mechanical engineering, biomedical engineering, chemical engineering, package engineering, or a related scientific field.
NewSenior Substrate & 3DIC Packaging Engineer TSMC - Taiwan Semiconductor Manufacturing Company LimitedSenior Substrate & 3DIC Packaging EngineerSan Jose, CAA leading semiconductor foundry in San Jose seeks a highly skilled Substrate / Advanced Package Engineer to innovate in 3DIC design and packaging. Responsibilities include designing, simulating, and optimizing advanced packaging technologies while collaborating with cross-functional teams.
NewLead IC Packaging Engineer - FCBGA & NPI Apple, Inc.Lead IC Packaging Engineer - FCBGA & NPISan Francisco, CAA leading technology firm in California is seeking an experienced IC Packaging Assembly Engineer to optimize flip-chip BGA assembly processes. Candidates must have over 10 years of experience in semiconductor packaging, a strong engineering background, and excellent problem-solving skills.
NewIC Packaging Integration Engineer Apple, Inc.IC Packaging Integration EngineerSanta Clara, CA$181,100–$318,400 / yearDescription You will be responsible for IC packaging developmentWork with cross-functional teams and lead SoC Package integration and architecture effortsDrive the industry with advanced package solutions, new material developments, and specsResponsibilities Work with cross-functional domains through package definition process and deliver optimized solutions to meet electrical, mechanical, thermal requirements. Test vehicle definition and execution working alongside foundries and OSATs for advanced packaging technologies (FOWLP, 2.5D, 3D, coreless MCM).Well versed with DOE principles and statistical analyses to establish robust build plans for OSATs through NPI phase.
NewPrincipal Packaging Engineer Alpha & Omega SemiconductorPrincipal Packaging EngineerSunnyvale, CAQualifications:10+ years of experiences in Power Electronics package design (Si, GaN, SiC; LF based, substrate based)MS degree and aboveExperience in AutoCAD and SoldWorks for package designsExperiences Ansys for thermal and stress simulationLead Frame (LF), design, clip design, wire bondExperiences in RD concept development and novel power electronics packaging technologiesExperience with assembly manufacturing processes and environment (soldering, die attach, wire bonding and moldingExperiences in MIS substrate design and IPM design is a plusProfessional communication in technical subjects with internal and external groups. At Alpha and Omega Semiconductor (AOS), we design, develop and globally supply a broad range of power semiconductors, including a wide portfolio of Power MOSFET, IGBT, IPM, TVS, GaN/SiC, Power IC and Digital Power products.
Advanced Packaging Process Engineer Tenstorrent IncAdvanced Packaging Process EngineerSanta Clara, CAPartner with design, reliability, and architecture teams to evaluate tradeoffs (bump pitch, stack-ups, embedded Si, etc.) and lead test vehicle planning to meet program needs. As the position offered will have direct and/or indirect access to information, systems, or technologies subject to these laws, the offer may be contingent upon your citizenship/permanent residency status or ability to obtain prior license approval from the U.S. Commerce Department or applicable federal agency.
NewSenior Fiber Optic Module Packaging Engineer Coherent CorpSenior Fiber Optic Module Packaging EngineerSunnyvale, CAWe are a vertically integrated manufacturing company that develops innovative products for diversified applications in the industrial, optical communications, military, life sciences, semiconductor equipment, and consumer markets. Coherent provides a comprehensive career development platform within an environment that challenges employees to perform at their best, while rewarding excellence and hard-work through a competitive compensation program.
Sr. Industrial Designer (Packaging) SanDisk CorpSr. Industrial Designer (Packaging)Milpitas, CAAn employee's pay position within the salary range may be based on several factors including but not limited to (1) relevant education; qualifications; certifications; and experience; (2) skills, ability, knowledge of the job; (3) performance, contribution and results; (4) geographic location; (5) shift; (6) internal and external equity; and (7) business and organizational needs. Sandisk is looking for a Senior Packaging Industrial Designer to join global industrial design team to design 3D structural packaging solutions for world‑class consumer storage products.
NewSenior IC Packaging & Integration Engineer (2.5D/3D) Apple, Inc.Senior IC Packaging & Integration Engineer (2.5D/3D)Santa Clara, CA$181,100–$318,400 / yearThe position offers a competitive salary ranging from $181,100 to $318,400, along with comprehensive benefits including medical coverage, stock options, and educational reimbursements. This role involves driving packaging development and leading cross-functional teams in advanced semiconductor packaging solutions.
NewMemory Packaging Engineer - Next-Gen High-Density Packages Apple, Inc.Memory Packaging Engineer - Next-Gen High-Density PackagesSanta Clara, CA$181,100–$318,400 / yearThis pivotal role involves defining and developing next-generation memory packages for Apple's hardware, collaborating with cross-functional teams, and driving vendor partnerships. Apple offers competitive compensation between $181,100 and $318,400 along with comprehensive benefits, including medical coverage and employee stock purchase opportunities.#J-18808-Ljbffr.
NewPackaging Engineer - I* MindlancePackaging Engineer - I*Foster city, CA$92–$96.29 / hourB.S. degree in industrial engineering, mechanical engineering, biomedical engineering, chemical engineering, package engineering, or a related scientific field. · Author packaging protocols, reports, and technical documentation to support shipping qualification and regulatory filings.
Associate Optical Packaging Engineer PsiQuantum CorpAssociate Optical Packaging EngineerMilpitas, CA$85,000–$120,000 / yearOur application, software, and industry teams work directly with leading Fortune 500 companies-including Lockheed Martin, Mercedes-Benz, Boehringer Ingelheim, and Mitsubishi Chemical-to prepare quantum solutions for real-world impact. Actual compensation may vary outside of these ranges and is dependent on various factors including but not limited to a candidate''s qualifications including relevant education and training, competencies, experience, geographic location, and business needs.
NewSenior Fiber Optic Packaging Engineer Multi-Fiber Modules II-VI UKSenior Fiber Optic Packaging Engineer Multi-Fiber ModulesSunnyvale, CAA technology company located in Sunnyvale, California, is seeking an experienced engineer to design and develop multi-fiber module packaging for fiber optic devices. Candidates should have a BS or MS in Telecom, optomechanical engineering, physics, or related fields, along with a minimum of 2 years of experience in the industry.
NewStaff Packaging Engineer: Surgical Robotics - OTTAVA 6267-Auris Health Inc. Legal EntityStaff Packaging Engineer: Surgical Robotics - OTTAVASanta Clara, CA$118,000–$203,550 / yearJob Title Staff Packaging Engineer – OTTAVALocation Santa Clara, California, United States of AmericaPurpose The Staff Packaging Engineer supports the design, development, testing, and validation of packaging systems for medical devices, including robotic capital and durable medical equipment distributed globally. Continuous Improvement & Sustainability Support cost, quality, and sustainability initiatives including material optimization, waste reduction, logistics efficiency, and recycled content usage.
NewSenior Packaging Engineer 3D/TSV, Equity ESR HealthcareSenior Packaging Engineer 3D/TSV, EquitySan Jose, CAThis exciting role involves working on mechanical designs for advanced electronic packaging and optical components. Applicants should have a B.S. or M.S. in a relevant engineering field and be proficient in Solidworks.
NewSenior Fiber Optic Module Packaging Engineer II-VI UKSenior Fiber Optic Module Packaging EngineerSunnyvale, CAWorking ConditionsRegular use of a computer and other office equipment is necessaryInteraction with team members and external contacts is a regular part of the jobPhysical RequirementsSitting for extended periods while working on a computer or conducting meetings. I ntegrity – Create an Environment of TrustC ollaboration – Innovate Through the Sharing of IdeasA ccountability – Own the Process and the OutcomeR espect – Recognize the Value in EveryoneE nthusiasm – Find a Sense of Purpose in WorkCoherent Corp.
NewSenior Packaging Specialist (TAG) Nestle S.A.Senior Packaging Specialist (TAG)Fremont, CAREQUIREMENTS AND MINIMUM EDUCATION LEVELA BS or MS degree in Food Science, Food Engineering, Chemical Engineering Packaging Science, Packaging Engineering, Mechanical Engineering, or related field. JOB SUMMARYThe Senior Packaging Specialist is a key role within Nestle's Technical Applications Group (TAG) that serves as the technical lead on highly complex and strategic projects.
NewOptoelectronic Packaging Engineer - AI Data Center Dormont Manufacturing CompanyOptoelectronic Packaging Engineer - AI Data CenterSan Jose, CA$130,850–$186,900 / yearDormont Manufacturing Co in San Jose, California is seeking a Mechanical Engineer to design innovative optical modules for AI and data center applications. Ideal candidates will have a B.S. in Mechanical Engineering, proficiency in tools like SolidWorks, and experience in a fast-paced R&D environment.
NewSenior Fiber Optic Module Packaging Engineer II-VI Optical Systems, Inc.Senior Fiber Optic Module Packaging EngineerSunnyvale, CAWe are a vertically integrated manufacturing company that develops innovative products for diversified applications in the industrial, optical communications, military, life sciences, semiconductor equipment, and consumer markets. Coherent provides a comprehensive career development platform within an environment that challenges employees to perform at their best, while rewarding excellence and hard-work through a competitive compensation program.
Senior Packaging Design Engineer, Silicon Google LLCSenior Packaging Design Engineer, SiliconMountain View, CA$163,000–$237,000 / yearCollaborate closely with Signal Integrity (SI), Power Integrity (PI), Test, New Product Introduction (NPI), and Mechanical Engineering teams to refine and optimize product package architecture and design. Skip navigation links home Home work_outline Jobs noogler_hat Students google How we work handyman How we hire person_outline Your career help_outline Help.
Principal Packaging Engineer Delos DataPrincipal Packaging EngineerPalo Alto, CaliforniaSelect and design optimal multi‑die package types (MCM, 2.5D, 3D, fan‑out, CoWoS, InFO, CPC, CPO) balancing electrical performance, thermal behavior, cost, and manufacturability. We aim to create an environment where people are treated fairly, supported in their growth, and are empowered to do meaningful work alongside others who take the craft seriously.
Coordinator, Packaging e.l.f. BeautyCoordinator, PackagingOakland, CaliforniaOur total compensation philosophy offers every full-time new hire competitive pay and benefits, bonus eligibility (200% of target over the last seven fiscal years), equity, flexible time off, year-round half-day Fridays, and a hybrid 3 day in office, 2 day at home work environment. You’ll own critical workflows from component assessments and supplier communications to PO execution and data integrity, ensuring every launch moves from idea to shelf with precision and speed.
Advanced Packaging Engineer - SI/PI Marvell Technology IncAdvanced Packaging Engineer - SI/PISanta Clara, CA$97,630–$146,300 / yearHighlights include an employee stock purchase plan with a 2-year look back, family support programs to help balance work and home life, robust mental health resources to prioritize emotional well-being, and a recognition and service awards to celebrate contributions and milestones. Expected Base Pay Range (USD) $97,630 - $146,300 per annum The successful candidate's starting base pay will be determined based on job-related skills, experience, qualifications, work location, and market conditions.
Packaging Engineer I Exelixis IncPackaging Engineer IAlameda, CA$75,000–$106,500 / yearESSENTIAL DUTIES/RESPONSIBILITIES: Provide on-site/remote technical support for project activities such as commercial packaging, implementation/qualification of new packaging line equipment and introduction of components changes. EDUCATION/EXPERIENCE/KNOWLEDGE & SKILLS: Education: Bachelor's degree in related discipline and a minimum of 1 year of related experience; or, Equivalent combination of education and experience.
NewSenior Electrical Engineer / Product Lead Advanced Semiconductor Packaging and Integration Macpower Digital Assets Edge Private LimitedSenior Electrical Engineer / Product Lead Advanced Semiconductor Packaging and IntegrationSanta Clara, CA$64 / hourIf you enjoy solving complex challenges in mixed-signal design, chiplet integration, and high-performance electronics , this role is for you. We are looking for a Senior Electrical Engineer with deep expertise in semiconductor design, advanced packaging, and ASIC development .
NewSenior Packaging Engineer: Innovation & Sustainability Lead Nestle S.A.Senior Packaging Engineer: Innovation & Sustainability LeadFremont, CAThis role involves managing the lifecycle of packaging development and collaborating with cross-functional teams to ensure sustainable and effective solutions. Responsibilities include driving innovation strategies, managing timelines, and providing sustainability guidance.
NewSenior Reliability Engineer - LPU Packaging NVIDIA GruppeSenior Reliability Engineer - LPU PackagingSanta Clara, CA$168,000–$264,500 / yearBase salary range is $168,000 - $264,500 for Level4 and $196,000 - $310,500 for Level5.Eligible for equity and benefits.
NewSenior IC Packaging Reliability Engineer - 2.5D/3D & BGA NVIDIA GruppeSenior IC Packaging Reliability Engineer - 2.5D/3D & BGASanta Clara, CA$168,000–$264,500 / yearThe position offers a competitive salary range of $168,000 - $264,500 for Level 4 and $196,000 - $310,500 for Level 5, along with equity and benefits.#J-18808-Ljbffr. NVIDIA Gruppe is seeking an experienced professional to lead package-level reliability for semiconductor products in Santa Clara, California.